NXP Semiconductors LPC18S10FET100E

Overview

LPC18S10FET100E from NXP Semiconductors is a 32-bit ARM Cortex-M3 flashless microcontroller with security features, operating at up to 180 MHz, featuring 136 kB on-chip SRAM, AES encryption engine, and TFBGA100 packaging. It targets secure embedded control applications requiring tamper-resistant boot and peripheral isolation.

For engineers reviewing the LPC18S10FET100E datasheet, LPC18S10FET100E pinout, LPC18S10FET100E application, or LPC18S10FET100E equivalent, key selection criteria include SRAM size, absence of Ethernet/USB/LCD peripherals, BGA100 footprint compatibility, and AES-enabled secure boot capability.

Technical Context

The LPC18S10FET100E implements an ARM Cortex-M3 core with Harvard architecture, 3-stage pipeline, and integrated Memory Protection Unit (MPU) supporting eight memory regions. It uses separate instruction and data buses with speculative branching via internal prefetch unit.

Its clock system includes three PLLs - one for CPU up to 180 MHz, one dedicated to USB (not implemented in this variant), and one configurable for audio - alongside 12 MHz internal RC oscillator trimmed to ±1.5% accuracy and ultra-low-power RTC oscillator.

Key Specifications

Pinout & Package

Package: TFBGA100 (SOT926-1), plastic thin fine-pitch ball grid array with 100 balls, body size 9 mm × 9 mm × 0.7 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC18S10FET100E, LPC18S30FET100 offers +64 kB SRAM for larger code/data footprints, while LPC18S10FBD144 trades BGA density for through-hole accessibility and +34 GPIOs - both retain identical security features and core performance.

Availability

LPC18S10FET100E is available at Aetrix Electronics and suitable for industrial sensor hubs, secure firmware gateways, medical diagnostic peripherals, and white goods control modules requiring stable component supply and long-term lifecycle assurance.

Supply support for LPC18S10FET100E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC18S series is designed for high-integrity embedded applications demanding hardware-enforced security, real-time determinism, and peripheral flexibility - with LPC18S10FET100E targeting cost-optimized, space-constrained secure controllers.

FAQ

What is the maximum CPU frequency supported by the LPC18S10FET100E?

The LPC18S10FET100E supports a maximum CPU frequency of 180 MHz. This is achieved using the on-chip PLL system, which allows operation at full speed without requiring an external high-frequency crystal. The ARM Cortex-M3 core maintains deterministic timing at this rate, making the LPC18S10FET100E suitable for real-time industrial control tasks where cycle-accurate execution is critical. All timing-critical peripherals remain synchronized to this clock domain.

Does the LPC18S10FET100E include Ethernet or USB interfaces?

No, the LPC18S10FET100E does not include Ethernet MAC, USB0, or USB1 interfaces. As confirmed in Table 2 of the official datasheet, these peripherals are disabled in this variant. The LPC18S10FET100E retains only core connectivity options: four UART/USARTs, two SSP controllers, two I²C interfaces, two I²S ports, and a quad-SPI Flash Interface (SPIFI). This omission reduces pin count and power consumption, aligning with its role as a compact, secure control MCU.

How much SRAM does the LPC18S10FET100E provide, and how is it organized?

The LPC18S10FET100E integrates 136 kB of on-chip SRAM, organized across multiple AHB-accessible blocks to enable concurrent CPU and DMA access. Unlike higher-tier variants (e.g., LPC18S50 with 200 kB), this configuration balances memory capacity with die size and cost. The SRAM is used for code execution, stack, heap, and peripheral buffers - and is directly accessible by the eight-channel GPDMA controller for zero-CPU-overhead data transfers with ADC, UART, or SPIFI.

What security features are implemented in the LPC18S10FET100E?

The LPC18S10FET100E includes hardware AES encryption/decryption engine, 64-bit One-Time Programmable (OTP) memory for general use, and two 128-bit OTP banks dedicated to AES key storage - one bank can hold an encrypted key for boot image decryption. It also features ARM Cortex-M3 built-in Memory Protection Unit (MPU) with eight configurable regions and secure boot enforced via ROM-based API. These features collectively ensure firmware authenticity, data confidentiality, and runtime privilege isolation in the LPC18S10FET100E.

What package type and pin count does the LPC18S10FET100E use?

The LPC18S10FET100E uses a TFBGA100 package (SOT926-1): a plastic thin fine-pitch ball grid array with 100 solder balls arranged in a 9 mm × 9 mm × 0.7 mm body. This package supports high-density PCB layouts and thermal performance suitable for industrial environments. Pin functions are multiplexed via the System Configuration Unit (SCU), and the device exposes 49 GPIOs - fewer than LQFP144 variants due to ball count constraints - with full AHB mapping for low-latency register access.