NXP Semiconductors LPC18S30FET256E
- Part No.:
- LPC18S30FET256E
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 256-LBGA
- Datasheet:
-
LPC18S30FET256E.pdf
- Description:
- IC MCU 32BIT ROMLESS 256LBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,968
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LPC18S30FET256E from NXP Semiconductors is a 32-bit ARM Cortex-M3 flashless microcontroller with integrated security features, operating at up to 180 MHz, featuring 200 kB on-chip SRAM, dual high-speed USB (Host/Device/OTG + Host/Device), 10/100T Ethernet MAC with IEEE 1588 support, and AES encryption engine for secure boot. It targets industrial control and communication hubs requiring robust peripheral integration and cryptographic integrity.
For engineers reviewing the LPC18S30FET256E datasheet, LPC18S30FET256E pinout, LPC18S30FET256E application, or LPC18S30FET256E equivalent, key selection considerations include its LBGA256 package, absence of LCD controller (vs. LPC18S50), retained EMC and dual ADCs, and full USB0+USB1 + Ethernet capability in this variant - critical for secure networked edge devices.
Technical Context
The LPC18S30FET256E implements an ARM Cortex-M3 core with Harvard architecture, 3-stage pipeline, and built-in MPU supporting eight memory regions plus NVIC for deterministic interrupt handling. Its clock system uses three PLLs: one for CPU (up to 180 MHz), one dedicated to USB0, and a third configurable as audio PLL.
Peripherals are organized across AHB and APB buses with DMA-capable access; the Global Input Multiplexer Array (GIMA) enables flexible event routing between timers, SCTimer/PWM, and ADCs, while the External Memory Controller supports SDRAM, NOR flash, and SRAM expansion - essential for real-time industrial firmware with external code/data storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 180 MHz max - delivers deterministic real-time performance with low-latency interrupt response for industrial control loops. |
| On-chip SRAM | 200 kB, split into multiple AHB-accessible blocks - enables concurrent code execution, data buffering, and DMA transfer without bus contention. |
| Security Engine | AES-128/256 engine with DMA support and ROM-based API - enables hardware-accelerated encrypted boot image verification and runtime data protection. |
| Connectivity | 10/100T Ethernet MAC (RMII/MII), USB0 (HS Host/Device/OTG), USB1 (HS Host/Device + ULPI) - supports dual-networked device roles with IEEE 1588 time stamping for synchronized industrial networks. |
| Analog Peripherals | Two 10-bit ADCs (400 kSamples/s, 8 channels each), one 10-bit DAC (400 kSamples/s) - sufficient for sensor acquisition and analog feedback in motor control or power management systems. |
| Memory Interface | External Memory Controller (EMC) supporting SDRAM, NOR flash, SRAM, and ROM - allows scalable firmware storage and runtime data logging in resource-constrained embedded designs. |
| Package | LBGA256 (17 × 17 × 1 mm, SOT740-2) - provides high I/O density (164 GPIO) and thermal performance for compact industrial PCB layouts. |
Pinout & Package
Package: Plastic low-profile ball grid array (LBGA256), 17 mm × 17 mm × 1 mm body, 256-ball layout per SOT740-2 standard. Designed for automated assembly and thermal reliability in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1_15 | ENET_RXD0 | Ethernet receive data line 0 (RMII/MII) - required for 10/100 Mbps PHY interface with minimal external components. |
| P1_16 | ENET_RX_DV | Ethernet receive data valid signal - synchronizes valid frame data capture in RMII mode, reducing timing margin requirements. |
| P1_18 | ENET_TXD0 | Ethernet transmit data line 0 - drives differential pair to PHY; supports full-duplex operation with IEEE 1588 timestamp insertion. |
| P1_19 | ENET_TX_CLK / ENET_REF_CLK | Reference clock input (RMII) or transmit clock output (MII) - eliminates need for external clock generator in RMII configurations. |
| P1_20 | ENET_TXD1 | Ethernet transmit data line 1 - completes RMII 2-bit data bus; enables standard PHY interfacing without glue logic. |
| P2_0 | ENET_MDC | MIIM management data clock - controls MDIO register access for PHY configuration and status monitoring. |
| P1_17 | ENET_MDIO | MIIM management data I/O - bidirectional serial interface for reading/writing PHY registers (e.g., link status, speed negotiation). |
Key Features
| Feature | Design Value |
|---|---|
| State Configurable Timer (SCTimer/PWM) | Hardware-state-machine-based PWM subsystem with event-driven transitions - enables complex waveform generation (e.g., multi-phase motor control) without CPU intervention. |
| Global Input Multiplexer Array (GIMA) | Configurable crossbar routing for timer, ADC, and SCT inputs - decouples peripheral triggering from fixed pin assignments, simplifying PCB layout and firmware reuse. |
| Quad SPI Flash Interface (SPIFI) | Up to 52 MB/s 1-/2-/4-bit serial flash access - replaces parallel NOR flash with reduced pin count while maintaining fast XIP (execute-in-place) capability. |
| Dual High-Speed USB Controllers | USB0 (integrated HS PHY) + USB1 (ULPI interface) - supports simultaneous host/device roles and external HS PHY flexibility for custom cable or OTG applications. |
| Secure Boot Architecture | AES engine + OTP key storage + ROM-based API - enforces authenticated boot flow with tamper-resistant key storage, meeting IEC 62443-3-3 SL2 requirements. |
Applications
| Industrial PLC Gateway | Secure Networked Sensor Hub |
|---|---|
Use Scenario: Edge gateway aggregating Modbus RTU/ASCII fieldbus data and forwarding via Ethernet to SCADA systems. IC Role / Device Role / Timing Role: Central MCU managing dual-protocol bridging, real-time packet scheduling, and TLS-secured Ethernet uplink. Use Value: Integrated Ethernet MAC + dual USB + AES engine enables end-to-end encrypted data transport without external crypto co-processor or PHY ICs. |
Use Scenario: Battery-powered environmental monitor with temperature/humidity/CO₂ sensors, transmitting data over Ethernet and USB for local diagnostics. IC Role / Device Role / Timing Role: Main controller executing sensor fusion, secure OTA updates, and IEEE 1588-synchronized timestamping for distributed sensor networks. Use Value: 200 kB SRAM buffers sensor logs during network outages; AES engine validates firmware images before execution, preventing unauthorized code injection. |
| Automotive Diagnostic Tool | Industrial Audio Control Panel |
Use Scenario: Handheld OBD-II scanner supporting CAN, USB, and Ethernet connectivity for fleet diagnostics and ECU reprogramming. IC Role / Device Role / Timing Role: Protocol translator between vehicle CAN bus and PC/host via USB/Ethernet, with secure firmware update path. Use Value: C_CAN 2.0B controller + USB0/USB1 + AES ensures certified diagnostic tool compliance; LBGA256 package withstands automotive vibration and thermal cycling. |
Use Scenario: Front-panel controller for industrial audio mixing console with LCD display, encoder inputs, and I²S audio streaming. IC Role / Device Role / Timing Role: Real-time UI processor handling touch/GPIO inputs, driving monochrome STN LCD, and managing I²S audio data paths. Use Value: LCD controller (up to 1024×768) + two I²S interfaces + SCTimer/PWM for LED dimming enable feature-rich HMI without external graphics or audio ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC18S50FET256 | Includes LCD controller and additional GPIO (164 vs. 164 same count but different mapping); identical SRAM, USB, Ethernet, and AES features. | Required when driving TFT/STN displays directly; unnecessary overhead if display is handled externally or omitted. | Select LPC18S50FET256 only if LCD interface is needed - otherwise LPC18S30FET256E reduces BOM cost and software footprint. |
| LPC4357FET256 | Dual-core (Cortex-M4 + M0), no AES engine, same package and peripheral set except lacks IEEE 1588 support and has lower SRAM (264 kB total but split across cores). | Suitable for asymmetric processing (e.g., M4 for control, M0 for comms), but lacks hardware crypto for secure boot compliance. | Choose LPC4357FET256 for compute-intensive DSP tasks; prefer LPC18S30FET256E when cryptographic integrity and IEEE 1588 synchronization are mandatory. |
Compared with LPC18S50FET256, LPC18S30FET256E removes LCD controller to reduce cost and power while retaining full networking and security capabilities; versus LPC4357FET256, it trades dual-core flexibility for certified AES acceleration and IEEE 1588 precision - making it optimal for standards-compliant industrial gateways.
Availability
LPC18S30FET256E is available at Aetrix Electronics and suitable for industrial automation, secure communication hubs, and embedded audio applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for LPC18S30FET256E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and trusted execution environments.
The LPC18S series is designed specifically for secure, high-performance embedded applications demanding integrated cryptography, deterministic real-time response, and rich peripheral sets - targeting industrial control, networked sensors, and automotive aftermarket systems.
FAQ
What is the maximum operating frequency of the LPC18S30FET256E?
The LPC18S30FET256E operates at a maximum CPU frequency of 180 MHz, achieved via its ARM Cortex-M3 core and triple PLL clock generation unit. This frequency is sustained under industrial temperature ranges (-40°C to +85°C) with proper power supply regulation and thermal management, enabling high-throughput data processing in real-time industrial applications.
Does the LPC18S30FET256E include an LCD controller?
No, the LPC18S30FET256E does not include an LCD controller. Unlike the LPC18S50 variant, this part omits the LCD subsystem while retaining all other major peripherals including Ethernet, dual USB, EMC, and AES engine. This differentiation is confirmed in Table 2 of the official datasheet (Rev. 1.3, p.5).
How many USB interfaces does the LPC18S30FET256E support?
The LPC18S30FET256E supports two independent USB interfaces: USB0 (High-Speed Host/Device/OTG with integrated PHY) and USB1 (High-Speed Host/Device with ULPI interface for external PHY). Both include DMA support and are fully functional in the LBGA256 package, enabling simultaneous USB device enumeration and host-side peripheral control.
What security features are implemented in the LPC18S30FET256E?
The LPC18S30FET256E integrates a hardware AES engine supporting 128/256-bit encryption/decryption with DMA acceleration, two banks (256-bit total) of OTP memory for secure AES key storage, and ROM-based APIs for secure boot validation. These features enable certified secure boot flows compliant with IEC 62443-3-3 SL2 requirements without external security ICs.
Is the LPC18S30FET256E pin-compatible with other LPC18S family members in LBGA256?
Yes, the LPC18S30FET256E shares the same LBGA256 package (SOT740-2) and pinout with LPC18S50FET256 and LPC18S10FET256 variants. However, functional differences exist - e.g., LCD controller is absent in LPC18S30FET256E, and certain pins default to reserved states where unused peripherals are disabled. Full compatibility requires verifying peripheral enablement in software.
LPC18S30FET256E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 256-LBGA
- Series:
- LPC18xx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 164
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 200K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.2V ~ 3.6V
- Data Converters:
- A/D 8x10b; D/A 1x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC18S30FET256E FAQ
1.How can I place an order for LPC18S30FET256E through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC18S30FET256E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC18S30FET256E reliable?
The price and inventory of LPC18S30FET256E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC18S30FET256E is usually 5 days.
3.What payment methods are accepted for LPC18S30FET256E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC18S30FET256E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC18S30FET256E?
LPC18S30FET256E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC18S30FET256E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC18S30FET256E?
For technical support, including LPC18S30FET256E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC18S30FET256E requirements.
6.How does Aetrix verify that LPC18S30FET256E is sourced from the original manufacturer or authorized distributors?
All LPC18S30FET256E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC18S30FET256E meets industry standards.
7.What is the process for return or replacement of LPC18S30FET256E?
All LPC18S30FET256E units undergo pre-shipment inspection (PSI). If there is an issue with LPC18S30FET256E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC18S30FET256E part is unused and in its original packaging.
Return procedure for LPC18S30FET256E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LPC18S30FET256E Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

