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NXP Semiconductors LPC18S50FET256,551

Part No.:
LPC18S50FET256,551
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
256-LBGA
Datasheet:
AetrixLPC18S50FET256,551.pdf
Description:
IC MCU 32BIT ROMLESS 256LBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,179

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Product details

Overview

LPC18S50FET256 from NXP Semiconductors is a flashless 32-bit ARM Cortex-M3 microcontroller with integrated security features, operating at up to 180 MHz CPU frequency, featuring 200 kB on-chip SRAM, dual high-speed USB 2.0 interfaces (one OTG-capable), 10/100T Ethernet MAC with IEEE 1588 support, and AES encryption engine for secure boot. It targets secure industrial control and communication hub applications requiring real-time connectivity and cryptographic integrity.

For engineers reviewing the LPC18S50FET256 datasheet, LPC18S50FET256 pinout, LPC18S50FET256 application, or LPC18S50FET256 equivalent, key selection considerations include its LBGA256 package with 164 GPIOs, dual USB + Ethernet + LCD controller integration, AES-encrypted boot capability, and support for external SDRAM via EMC - critical for deterministic embedded networking and secure firmware deployment.

Technical Context

The LPC18S50FET256 implements an ARM Cortex-M3 core with Harvard architecture, 3-stage pipeline, and built-in MPU supporting eight memory regions plus NVIC for deterministic interrupt handling. Its clock system includes three PLLs: one for CPU (up to 180 MHz), one dedicated to USB0, and one configurable as audio PLL.

Peripherals are organized across AHB and APB buses with DMA access; the State Configurable Timer/PWM (SCTimer/PWM) subsystem enables flexible event-driven timing, while the Global Input Multiplexer Array (GIMA) allows dynamic routing of signals between ADCs, timers, and SCTimer/PWM - enabling synchronized multi-peripheral operation without CPU intervention.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreARM Cortex-M3, 180 MHz max - delivers deterministic real-time execution with low-latency interrupt response for industrial control loops.
On-chip Memory200 kB SRAM (multiple banks), 64 kB ROM, 256-bit OTP for AES keys - enables secure boot image decryption and fast code/data access without external Flash.
Security EngineDedicated AES hardware engine with DMA support and ROM-based API - offloads encryption/decryption from CPU, ensuring secure boot and runtime data protection.
Connectivity10/100T Ethernet MAC (RMII/MII, IEEE 1588 v2), two HS USB 2.0 (USB0: OTG+PHY; USB1: ULPI+FS PHY) - supports time-synchronized networking and dual-role device/host functionality.
Display & MemoryLCD controller (up to 1024×768, CLUT/direct pixel modes), External Memory Controller (EMC) for SDRAM/SRAM/NOR - enables local HMI and expansion of program/data space in resource-constrained systems.
Analog I/OTwo 10-bit ADCs (8 channels each, 400 kS/s), one 10-bit DAC (400 kS/s) - provides sufficient resolution and sampling rate for motor control feedback and audio output generation.
PackageLBGA256 (17×17×1 mm, SOT740-2) - supports high I/O density (164 GPIOs) and thermal performance required for sustained 180 MHz operation in industrial environments.

Pinout & Package

Package: LBGA256 (Plastic low profile ball grid array; 256 balls; body 17 × 17 × 1 mm; SOT740-2).

Pin/Terminal Circuit Role Design Meaning
P0_0GPIO0[0] / SSP1_MISO / ENET_RXD1 / I2S0_TX_WSMulti-function digital I/O supporting Ethernet receive, SPI slave interface, and I2S word select - enables concurrent network and audio peripheral interfacing.
P1_15GPIO0[2] / ENET_RXD0 / U2_TXD / T0_MAT1Ethernet RX data line with co-located USART2 transmit and timer match output - simplifies PCB routing for time-critical Ethernet+serial protocols.
P1_18GPIO0[13] / ENET_TXD0 / CAN1_RD / T0_MAT3Ethernet TX data line sharing pin with CAN receiver input - supports dual-network redundancy or mixed-protocol gateways with careful signal isolation.
P1_19ENET_TX_CLK / SSP1_SCK / CLKOUT / I2S0_RX_MCLKConfigurable clock output supporting Ethernet reference clock, SPI clock, or I2S master clock - eliminates need for external clock generators in multi-interface designs.
P2_7GPIO0[7] / CTOUT_1 / U3_UCLK / EMC_A9 / T3_MAT3ISP entry pin (LOW at reset) with timer match, synchronous serial clock, and external memory address - enables field firmware recovery and coordinated timing for memory-mapped peripherals.

Key Features

Feature Design Value
Secure Boot ArchitectureAES engine decrypts boot image using keys stored in OTP memory, enforced by ROM-based API - prevents unauthorized firmware execution and ensures supply-chain integrity.
Flexible Timing SubsystemSCTimer/PWM with state-configurable logic and GIMA cross-connect - replaces multiple discrete timers and enables complex PWM waveforms (e.g., 3-phase motor control) with minimal CPU overhead.
High-Throughput InterfacingDual USB 2.0 (one OTG with on-chip HS PHY, one with ULPI) + 10/100T Ethernet + Quad SPI Flash Interface (52 MB/s) - supports simultaneous host/device connectivity and high-bandwidth external storage.
Memory Expansion CapabilityExternal Memory Controller (EMC) supporting SDRAM, SRAM, NOR flash, and ROM - extends usable memory beyond 200 kB SRAM for large protocol stacks or graphics buffers.
Low-Power Real-Time OperationUltra-low power RTC domain with battery-backed registers, alarm timer, and four reduced-power modes (Sleep to Deep power-down) - enables always-on monitoring with sub-μA quiescent current.

Applications

Industrial Control Gateway Secure Networked Audio Device

Use Scenario: Programmable logic controller (PLC) edge node aggregating Modbus TCP, CANopen, and EtherCAT traffic over Ethernet and dual USB ports.

IC Role / Device Role / Timing Role: Central MCU managing real-time I/O scanning, protocol translation, and secure firmware updates via encrypted USB mass storage.

Use Value: AES-secured boot prevents malicious firmware injection; IEEE 1588 timestamping enables precise synchronization across distributed I/O modules.

Use Scenario: High-fidelity audio streaming endpoint with local DSP processing, SD card playback, and Ethernet-based control (RAOP/AirPlay).

IC Role / Device Role / Timing Role: Audio subsystem controller handling I2S audio I/O, USB audio class compliance, and LCD-based UI rendering.

Use Value: Dual I2S interfaces support simultaneous input/output; 200 kB SRAM buffers full stereo streams at 96 kHz; LCD controller drives 7-inch TFT displays.

Automotive Aftermarket Telematics Hub White Goods Communication Module

Use Scenario: OBD-II diagnostic gateway with cellular backhaul, GPS logging, and vehicle CAN bus monitoring.

IC Role / Device Role / Timing Role: Secure host processor interfacing C_CAN controllers, USB modem, and Ethernet diagnostics port with tamper-resistant firmware.

Use Value: C_CAN 2.0B controllers isolate automotive bus traffic; OTP-stored keys protect OTA update payloads; 164 GPIOs support diverse sensor inputs.

Use Scenario: Smart appliance controller connecting washing machine motor drivers, temperature sensors, and cloud connectivity via Wi-Fi module over USB.

IC Role / Device Role / Timing Role: Main application MCU executing user interface, motor control PWM, and secure cloud communication stack.

Use Value: Motor control PWM and QEI support precise brushless motor commutation; AES engine encrypts usage data before transmission; EMC enables local display buffer in SDRAM.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
LPC4357FET256Dual-core (Cortex-M4 + M0), no AES engine, 264 kB SRAM, same LBGA256 packageLacks hardware crypto acceleration; better suited for floating-point intensive tasks than secure bootSelect when DSP performance outweighs cryptographic requirements and external crypto ICs are acceptable.
STM32H743VIARM Cortex-M7, 480 MHz, 1 MB Flash, 1 MB RAM, no integrated Ethernet MAC, requires external PHYHigher compute throughput but lacks native Ethernet and AES engine; needs external components for equivalent connectivityChoose for compute-heavy applications where external PHY and crypto IC integration is feasible and Flash-based boot is preferred.

Compared with LPC4357FET256 and STM32H743VI, the LPC18S50FET256 uniquely combines flashless design, on-die AES, native Ethernet MAC, and dual USB - making it optimal for secure, connectivity-rich embedded systems where BOM count, boot integrity, and protocol offload are prioritized over raw CPU speed or Flash storage.

Availability

LPC18S50FET256 is available at Aetrix Electronics and suitable for industrial control gateways, secure networked audio devices, and automotive telematics applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for LPC18S50FET256 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with leadership in ARM-based microcontrollers and edge processing.

The LPC18S50FET256 belongs to NXP's LPC18xx security-focused microcontroller family, designed specifically for embedded applications demanding cryptographic integrity, real-time networking, and robust peripheral integration without external Flash.

FAQ

What is the maximum operating frequency of the LPC18S50FET256?

The LPC18S50FET256 operates at a maximum CPU frequency of 180 MHz, achieved via its ARM Cortex-M3 core and triple PLL clock system. This frequency is sustained under industrial temperature conditions (–40 °C to +85 °C) with proper power regulation and thermal management. The LPC18S50FET256 achieves this performance without external Flash, relying on its 200 kB on-chip SRAM for code execution.

Does the LPC18S50FET256 include on-chip Flash memory?

No, the LPC18S50FET256 is a flashless microcontroller. It executes code from its 200 kB on-chip SRAM and uses a 64 kB ROM containing boot code and driver libraries. Firmware is loaded externally via UART, USB, or Ethernet during startup, and secure boot is enforced using the integrated AES engine and OTP-stored keys - eliminating reliance on external Flash for security-critical applications.

How does the AES engine in the LPC18S50FET256 support secure boot?

The LPC18S50FET256's dedicated AES engine decrypts the boot image using keys stored in its two-bank OTP memory (256 bits total), with one bank reserved for encrypted boot image keys. The ROM-based API controls access, ensuring only authenticated firmware executes. This hardware-accelerated process occurs before application code loads, preventing runtime tampering and establishing a trusted execution environment from power-on reset.

Which Ethernet interface modes does the LPC18S50FET256 support?

The LPC18S50FET256 integrates a 10/100T Ethernet MAC supporting both RMII and MII physical layer interfaces, with DMA acceleration and IEEE 1588-2008 v2 time stamping. It does not include an on-chip PHY; external PHY connection is required via RMII/MII pins. The LPC18S50FET256 also supports advanced features like jumbo frame handling and checksum offload, reducing CPU load during high-throughput network operations.

What package type and pin count does the LPC18S50FET256 use?

The LPC18S50FET256 uses a LBGA256 package (SOT740-2): plastic low-profile ball grid array with 256 solder balls, 17 mm × 17 mm × 1 mm body size. It provides 164 GPIOs, with pin functions including Ethernet, USB, LCD, and EMC signals - all mapped to dedicated balls per the official NXP pinout documentation for the LBGA256 variant.

LPC18S50FET256,551 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
256-LBGA
Series:
LPC18xx
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
164
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
200K x 8
Voltage - Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC18S50FET256,551 FAQ

1.How can I place an order for LPC18S50FET256,551 through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC18S50FET256,551 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC18S50FET256,551 reliable?

The price and inventory of LPC18S50FET256,551 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC18S50FET256,551 is usually 5 days.

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LPC18S50FET256,551 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC18S50FET256,551?

For technical support, including LPC18S50FET256,551 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC18S50FET256,551 requirements.

6.How does Aetrix verify that LPC18S50FET256,551 is sourced from the original manufacturer or authorized distributors?

All LPC18S50FET256,551 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC18S50FET256,551 meets industry standards.

7.What is the process for return or replacement of LPC18S50FET256,551?

All LPC18S50FET256,551 units undergo pre-shipment inspection (PSI). If there is an issue with LPC18S50FET256,551, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC18S50FET256,551 part is unused and in its original packaging.

Return procedure for LPC18S50FET256,551:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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