NXP Semiconductors LPC2364FBD100,551

Overview

LPC2364FBD100 from NXP Semiconductors is a 32-bit ARM7TDMI-S microcontroller operating at up to 72 MHz, featuring 128 kB flash, 8 kB local SRAM, 16 kB Ethernet SRAM, dual CAN channels, and 10-bit ADC/DAC. It integrates Ethernet MAC (RMII), USB 2.0 full-speed device with on-chip PHY, four UARTs, two I²C buses, SPI/SSP, I²S, and 70 GPIOs - deployed in industrial gateways and protocol converters requiring deterministic real-time serial interface aggregation.

For engineers reviewing the LPC2364FBD100 datasheet, LPC2364FBD100 pinout, LPC2364FBD100 application, or LPC2364FBD100 equivalent, key selection criteria include RMII Ethernet support, dual-CAN capability, USB device + 4 kB FIFO, 2 kB battery-backed RTC SRAM, and LQFP100 package compatibility with legacy ARM7-based control designs.

Technical Context

The LPC2364FBD100 implements a dual-AHB architecture separating Ethernet DMA, USB DMA, and CPU instruction fetch to eliminate bus contention. Its Advanced Vectored Interrupt Controller supports 32 vectored IRQs with prioritized nesting, enabling low-latency response for CAN, Ethernet, and UART interrupt service routines.

It uses an on-chip PLL fed by a 1–24 MHz crystal or 4 MHz internal RC oscillator (±1 %) to generate the 72 MHz system clock. The 128-bit wide memory interface and accelerator architecture enable full 32-bit ARM instruction execution at peak frequency, delivering up to 30 % higher ISR performance than Thumb mode.

Key Specifications

Pinout & Package

LPC2364FBD100 is housed in a plastic LQFP100 package (SOT407-1), 14 mm × 14 mm × 1.4 mm body, with 100 leads and standard 0.5 mm pitch. Pin functions are configurable via the Pin Connect Block; all pins support digital I/O, and many offer multiple peripheral roles including Ethernet, USB, CAN, UART, I²C, SPI/SSP, I²S, ADC, DAC, and timer capture/match signals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC2364FBD100, LPC2366FBD100 offers double flash/SRAM for scalable firmware without layout changes, while LPC2368FBD100 adds SD/MMC support for local storage - both retain identical timing, interrupt structure, and peripheral register maps for drop-in software compatibility.

Availability

LPC2364FBD100 is available at Aetrix Electronics and suitable for industrial protocol gateways, medical data aggregators, and building automation controllers requiring stable component supply across extended product lifecycles.

Supply support for LPC2364FBD100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC2364FBD100 belongs to the LPC2300 family of ARM7-based microcontrollers designed for high-integration, multi-serial-interface embedded control - targeting applications where Ethernet, USB, CAN, and analog peripherals must coexist on a single chip with deterministic real-time behavior.

FAQ

What is the maximum operating frequency of the LPC2364FBD100?

The LPC2364FBD100 operates at a maximum CPU clock frequency of 72 MHz, achieved using its on-chip PLL locked to an external 1–24 MHz crystal or the internal 4 MHz RC oscillator. This frequency applies to ARM7TDMI-S core execution, peripheral clocks, and bus interfaces - all fully specified and tested across the −40 °C to +85 °C industrial temperature range.

Does the LPC2364FBD100 support USB device functionality?

Yes, the LPC2364FBD100 integrates a USB 2.0 full-speed device controller with on-chip transceiver and 4 kB of dedicated endpoint RAM. It supports standard USB classes including CDC, HID, and MSC without requiring an external PHY. USB operation is confirmed for LPC2364FBD100 per NXP's LPC2364_65_66_67_68 datasheet Rev. 7.1.

How many CAN interfaces does the LPC2364FBD100 include?

The LPC2364FBD100 includes two independent CAN 2.0B controllers (CAN1 and CAN2), each supporting standard and extended frame formats, programmable bit timing, and message object buffers. This dual-CAN capability is explicitly documented for LPC2364FBD100 in Table 2 (Ordering Options) and Section 2 (Features and benefits) of the official datasheet.

What package type is used for the LPC2364FBD100?

The LPC2364FBD100 uses a plastic low-profile quad flat package (LQFP100) with 100 leads, body dimensions of 14 mm × 14 mm × 1.4 mm, and standard 0.5 mm lead pitch (SOT407-1). This package is pin-compatible with other members of the LPC236x series in LQFP100 format, including LPC2365FBD100 and LPC2366FBD100.

Is the LPC2364FBD100 compatible with RMII Ethernet PHYs?

Yes, the LPC2364FBD100 implements a full RMII (Reduced Media Independent Interface) compliant Ethernet MAC, supporting 10/100 Mbps operation with external PHYs such as the LAN8720A or DP83848. Its RMII interface includes ENET_TXD0/1, ENET_TX_EN, ENET_RXD0/1, ENET_CRS, ENET_RX_ER, ENET_REF_CLK, ENET_MDC, and ENET_MDIO - all mapped to dedicated LQFP100 pins per Table 3.

Does the LPC2364FBD100 include analog-to-digital and digital-to-analog converters?

Yes, the LPC2364FBD100 integrates a 10-bit successive-approximation ADC with six multiplexed input channels (AD0[0]–AD0[5]), and a 10-bit current-steering DAC with single output (AOUT on P0[26]). Both peripherals are fully functional and electrically characterized across the rated temperature range, with ADC reference selectable between VREF and AVDD.