NXP Semiconductors LPC2364FBD100K

Overview

LPC2364FBD100 from NXP Semiconductors is a 32-bit ARM7TDMI-S microcontroller in LQFP100 package, featuring 128 kB flash, 8 kB local SRAM, 16 kB Ethernet SRAM, dual CAN channels, USB 2.0 full-speed device interface with 4 kB endpoint RAM, and 10-bit ADC/DAC - deployed in industrial protocol gateways requiring real-time serial bridging and deterministic interrupt response.

For engineers reviewing the LPC2364FBD100 datasheet, LPC2364FBD100 pinout, LPC2364FBD100 application, or LPC2364FBD100 equivalent, key selection criteria include RMII Ethernet support, dual-CAN timing compliance, USB device-only operation (no host mode), 70 GPIO with edge/level interrupt capability, and -40 °C to +85 °C industrial temperature grade.

Technical Context

The LPC2364FBD100 implements an ARM7TDMI-S core running at up to 72 MHz with dual AHB buses enabling concurrent Ethernet DMA, USB DMA, and flash execution without bus contention. Its Advanced Vectored Interrupt Controller supports 32 vectored interrupts with prioritized nesting for low-latency ISR handling in real-time control loops.

It integrates dedicated peripherals including a 10-bit ADC with six input channels, 10-bit DAC output on P0[26], four 32-bit general-purpose timers (eight capture inputs, ten compare outputs), and a PWM unit supporting three-phase motor control - all accessible via configurable pin-muxing through the Pin Connect Block.

Key Specifications

Pinout & Package

LPC2364FBD100 uses a plastic low-profile quad flat package (LQFP100) with 100 leads, 14 mm × 14 mm body, 1.4 mm height (SOT407-1). All pins are 3.3 V tolerant with individually configurable pull-up/down resistors and pin function selection via the Pin Connect Block.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC2364FBD100, LPC2366FBD100 offers double flash/SRAM for scalable firmware while maintaining identical pinout and peripheral set; LPC2368FBD100 adds SD/MMC support for local storage but shares the same footprint and core architecture-both require no PCB redesign.

Availability

LPC2364FBD100 is available at Aetrix Electronics and suitable for industrial protocol gateways, medical data aggregators, communications bridges, and embedded control nodes requiring stable component supply across extended product lifecycles.

Supply support for LPC2364FBD100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC2300 series was designed specifically for high-integration, multi-protocol embedded control applications where Ethernet, USB, CAN, and analog peripherals must coexist on a single chip with deterministic real-time performance.

FAQ

Does LPC2364FBD100 support USB host functionality?

No, LPC2364FBD100 implements only USB 2.0 full-speed device mode with integrated PHY and 4 kB endpoint RAM. It lacks USB host controller hardware, OTG support, or external transceiver interface. Applications requiring USB host capability must use alternative MCUs such as the LPC3250 or LPC17xx series. The LPC2364FBD100 USB peripheral is strictly device-side and enumerates as a peripheral under host control.

What is the maximum operating frequency of LPC2364FBD100?

The LPC2364FBD100 operates at a maximum CPU clock frequency of 72 MHz, achieved using the on-chip PLL driven by the main oscillator (1–24 MHz crystal) or internal 4 MHz RC oscillator. At 72 MHz, the ARM7TDMI-S core delivers up to 32 MIPS performance. The internal RC oscillator is trimmed to ±1 % accuracy but cannot clock USB or CAN peripherals - those require the main oscillator or RTC oscillator.

Can LPC2364FBD100 run CAN and USB simultaneously?

Yes, LPC2364FBD100 supports concurrent CAN and USB operation because they reside on independent AHB domains with dedicated DMA controllers. CAN messages are handled by the CAN controller and associated AHB DMA, while USB transactions use the separate USB DMA engine. No resource contention occurs between them, enabling real-time CAN messaging alongside USB data transfers - confirmed in the dual-AHB architecture description and ordering table feature set.

What package type does LPC2364FBD100 use?

LPC2364FBD100 uses a plastic low-profile quad flat package (LQFP100) with 100 leads, 14 mm × 14 mm body, and 1.4 mm maximum height (JEDEC standard SOT407-1). This RoHS-compliant package features gull-wing leads for surface-mount assembly and supports reflow soldering per IPC/JEDEC J-STD-020. Pin 1 is located at the top-left corner adjacent to the index mark.

Is LPC2364FBD100 qualified for automotive applications?

No, LPC2364FBD100 is rated for industrial temperature range (-40 °C to +85 °C) and is not AEC-Q100 qualified. It lacks automotive-specific features such as enhanced ESD protection (beyond 2 kV HBM), extended temperature screening, or failure-in-time (FIT) reporting. For automotive use cases, NXP recommends the S32K or MPC56xx families. The LPC2364FBD100 is intended for industrial control, medical, and communications equipment where industrial-grade reliability suffices.