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NXP Semiconductors LPC2364FET100,518

Part No.:
LPC2364FET100,518
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-TFBGA
Datasheet:
AetrixLPC2364FET100,518.pdf
Description:
IC MCU 16/32BIT 128KB 100TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,525

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Product details

Overview

LPC2364FET100 from NXP Semiconductors is a 32-bit ARM7TDMI-S microcontroller operating at up to 72 MHz, featuring 128 kB flash, 8 kB local SRAM, 16 kB Ethernet SRAM, and dual CAN channels. It integrates Ethernet MAC with RMII, USB 2.0 full-speed device interface with on-chip PHY, four UARTs, three I²C interfaces, I²S, SPI/SSP, 10-bit ADC (6-channel), 10-bit DAC, and 70 GPIO pins - deployed in industrial protocol converters and medical gateways.

For engineers reviewing the LPC2364FET100 datasheet, LPC2364FET100 pinout, LPC2364FET100 application, or LPC2364FET100 equivalent, key selection criteria include TFBGA100 package compatibility, dual-CAN + Ethernet coexistence, USB device operation without external PHY, and real-time interrupt handling via 32-vector VIC with 12 external interrupt-capable GPIOs.

Technical Context

The LPC2364FET100 implements a dual-AHB bus architecture separating Ethernet DMA, USB DMA, and CPU instruction fetch to eliminate bus contention. Its Advanced Vectored Interrupt Controller supports prioritized, low-latency response to up to 32 interrupts including timer match, UART FIFO, CAN message, and external edge/level-triggered sources.

On-chip peripherals are clock-gated individually for power optimization, and two independent power domains enable selective shutdown of Ethernet, USB, or analog subsystems. The 4 MHz internal RC oscillator (±1 %) serves as system clock source but disables CAN and USB - requiring external crystal (1–24 MHz) for full peripheral operation.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM7TDMI-S, 32-bit RISC, executes Thumb/ARM code at up to 72 MHz
Flash Memory128 kB on-chip flash with ISP/IAP support; mapped to ARM local bus for zero-wait-state execution
SRAM8 kB local SRAM (CPU access), 16 kB Ethernet SRAM, 8 kB USB/general-purpose SRAM, 2 kB RTC battery-backed SRAM
ConnectivityEthernet MAC (RMII), USB 2.0 full-speed device (4 kB endpoint RAM), 2× CAN 2.0B, 4× UARTs, 3× I²C, I²S, SPI/SSP
Analog Peripherals10-bit ADC with 6 input channels, 10-bit DAC output (AOUT), RTC with separate VBAT supply
GPIO & Interrupts70 general-purpose I/O pins; 12 pins support edge/level-sensitive external interrupts (EINT0–EINT3 plus Port 0/2 pins)
PackageTFBGA100 (9 mm × 9 mm × 0.7 mm, SOT926-1), 100-ball grid, boundary-scan enabled

Pinout & Package

Package: TFBGA100 (plastic thin fine-pitch ball grid array; 100 balls; body 9 × 9 × 0.7 mm; SOT926-1). Boundary-scan supported for PCB testability.

Pin/TerminalCircuit RoleDesign Meaning
P0[29]/USB_D+USB differential pairBidirectional D+ line for USB 2.0 full-speed device; requires 1.5 kΩ pull-up on D+ for enumeration
P0[30]/USB_D−USB differential pairBidirectional D− line; routed with matched length and controlled impedance (90 Ω diff) for signal integrity
P1[0]/ENET_TXD0Ethernet transmit dataBit 0 of 4-bit RMII transmit bus; driven synchronously with ENET_TX_EN and ENET_REF_CLK
P1[4]/ENET_TX_ENEthernet transmit controlActive-high enable for RMII transmit data; must be asserted before TXD0–TXD3 valid
P1[9]/ENET_RXD0Ethernet receive dataBit 0 of 4-bit RMII receive bus; sampled on rising edge of ENET_REF_CLK
P1[16]/ENET_MDCMIIM management clockOpen-drain clock for MDIO serial interface to external PHY; generated by CPU, not auto-timed
P1[17]/ENET_MDIOMIIM management dataBi-directional MDIO line for PHY register read/write; requires external 10 kΩ pull-up resistor
P0[23]/AD0[0]Analog inputChannel 0 of 10-bit ADC; supports single-ended input with programmable gain and burst mode sampling
P0[26]/AOUTAnalog output10-bit DAC output; rail-to-rail capable with 200 kΩ load impedance minimum; no internal buffer
P2[10]/EINT0External interruptEdge- or level-sensitive interrupt source; configurable via VIC registers; supports wake-up from Power-down mode

Key Features

FeatureDesign Value
Dual-AHB bus architectureEnables concurrent Ethernet DMA, USB DMA, and CPU flash execution without arbitration delay or throughput penalty
Real-time interrupt handlingVIC delivers sub-2-cycle latency for highest-priority interrupts; supports nested IRQ/FIQ with software-defined priorities
Peripheral clock gatingEach peripheral (CAN, USB, ADC, etc.) has dedicated clock divider enabling dynamic power reduction during idle periods
Flexible pin muxingPin Connect Block allows runtime reassignment of up to 70 GPIOs to alternate functions (e.g., UART ↔ SSP ↔ I²C) without hardware change
RTC with battery backup2 kB SRAM retains data during main power loss when VBAT ≥ 1.0 V; RTC runs from dedicated 32.768 kHz oscillator or APB clock

Applications

Industrial Protocol ConverterMedical Data Gateway

Use Scenario: Translates Modbus RTU over RS-485 to EtherNet/IP for PLC-to-SCADA integration in factory automation.

IC Role / Device Role / Timing Role: Central protocol translation engine with deterministic UART and Ethernet packet handling using GPDMA and VIC.

Use Value: Dual CAN + Ethernet + USB enables simultaneous fieldbus bridging, remote firmware update, and diagnostic port access - reducing BOM count by one SoC.

Use Scenario: Aggregates ECG, SpO₂, and temperature sensor data from multiple bedside units into HL7-over-TCP streams for hospital EMR systems.

IC Role / Device Role / Timing Role: Real-time data concentrator with 10-bit ADC sampling, USB HID for clinician interface, and Ethernet MAC for secure TLS offload.

Use Value: On-chip 2 kB battery-backed SRAM preserves last vital signs during AC power loss; RTC maintains audit-trail timestamps independent of host.

Communications GatewayEmbedded CAN-Ethernet Bridge

Use Scenario: Connects legacy RS-232 serial devices (POS terminals, barcode scanners) to cloud-based management platforms via Wi-Fi router backhaul.

IC Role / Device Role / Timing Role: Serial-to-Ethernet bridge with four hardware UARTs, TCP/IP stack offloaded to external host, and flow-controlled DMA transfers.

Use Value: Four UARTs with 16-byte FIFOs and fractional baud rate generators support mixed legacy baud rates (9600–115200) without CPU overhead.

Use Scenario: Enables CAN FD-capable vehicle ECUs to communicate with Ethernet-based ADAS domain controllers in automotive test benches.

IC Role / Device Role / Timing Role: Deterministic CAN 2.0B ↔ Ethernet bridge with hardware timestamping on both CAN RX and Ethernet RX paths.

Use Value: Dual CAN channels allow simultaneous monitoring of chassis and powertrain networks while forwarding time-stamped frames to Ethernet for analysis.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LPC2368FET100512 kB flash, 32 kB local SRAM, adds SD/MMC interface; same TFBGA100 package and pinoutRequired for field-upgradable firmware images >128 kB or local data logging to microSDSelect when firmware complexity or data buffering exceeds LPC2364FET100 capacity
LPC2364FBD100LQFP100 package (14 × 14 mm); identical electrical specs and peripheral set; no boundary-scanPreferred for prototyping, manual soldering, or cost-sensitive designs where board space permits larger footprintChoose for easier assembly, debug visibility, or legacy LQFP-based design reuse

Compared with LPC2364FET100, LPC2368FET100 provides scalable flash/SRAM for complex protocol stacks, while LPC2364FBD100 trades TFBGA density for LQFP manufacturability - neither offers pin-compatible replacement without layout revision due to differing land patterns and thermal pad requirements.

Availability

LPC2364FET100 is available at Aetrix Electronics and suitable for industrial protocol converters, medical data gateways, and embedded CAN-Ethernet bridges requiring stable component supply across extended product lifecycles.

Supply support for LPC2364FET100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC2300 series targets resource-constrained embedded applications demanding integrated communication peripherals, real-time responsiveness, and long-term supply stability - particularly where Ethernet, USB, and CAN coexist in a single chip.

FAQ

What is the maximum operating frequency of the LPC2364FET100?

The LPC2364FET100 operates at a maximum CPU clock frequency of 72 MHz. This speed is achieved using the on-chip PLL, which can be driven by the main oscillator (1–24 MHz crystal), internal 4 MHz RC oscillator, or RTC oscillator. When using the internal RC oscillator, CAN and USB peripherals are disabled per datasheet specification.

Does the LPC2364FET100 support USB host functionality?

No, the LPC2364FET100 only implements a USB 2.0 full-speed device controller with on-chip PHY and 4 kB endpoint RAM. It does not support USB host or OTG modes. External USB host capability requires companion ICs such as the NXP ISP1583 or compatible USB host controllers.

How many CAN interfaces does the LPC2364FET100 include?

The LPC2364FET100 integrates two CAN 2.0B controllers (CAN1 and CAN2), confirmed in both the general description and Table 2 (Ordering Options). Each channel supports standard and extended frame formats, programmable bit timing, and message objects with acceptance filtering.

What is the purpose of the 2 kB battery-backed SRAM in the LPC2364FET100?

The 2 kB SRAM powered from the VBAT pin retains critical data (e.g., calibration values, event logs, configuration flags) during main power loss. It remains functional as long as VBAT ≥ 1.0 V and is accessible independently of the main power domain - essential for RTC timestamping and fail-safe state preservation in medical and industrial systems.

Is boundary-scan testing supported on the LPC2364FET100 package?

Yes, boundary-scan (IEEE 1149.1 JTAG) is supported on the LPC2364FET100 in its TFBGA100 package (SOT926-1), as explicitly stated in Section 2 ("Features and benefits") and confirmed in Table 1 (Ordering information). This enables automated PCB test coverage for solder joint integrity and interconnect verification.

LPC2364FET100,518 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-TFBGA
Series:
LPC2300
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
34K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC2364FET100,518 FAQ

1.How can I place an order for LPC2364FET100,518 through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC2364FET100,518 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC2364FET100,518 reliable?

The price and inventory of LPC2364FET100,518 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC2364FET100,518 is usually 5 days.

3.What payment methods are accepted for LPC2364FET100,518?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC2364FET100,518 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC2364FET100,518?

LPC2364FET100,518 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC2364FET100,518 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC2364FET100,518?

For technical support, including LPC2364FET100,518 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC2364FET100,518 requirements.

6.How does Aetrix verify that LPC2364FET100,518 is sourced from the original manufacturer or authorized distributors?

All LPC2364FET100,518 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC2364FET100,518 meets industry standards.

7.What is the process for return or replacement of LPC2364FET100,518?

All LPC2364FET100,518 units undergo pre-shipment inspection (PSI). If there is an issue with LPC2364FET100,518, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC2364FET100,518 part is unused and in its original packaging.

Return procedure for LPC2364FET100,518:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LPC2364FET100,518 Tags

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