NXP Semiconductors LPC2364HBD100,551

Overview

LPC2364HBD100 from NXP Semiconductors is a 32-bit ARM7TDMI-S microcontroller operating at up to 72 MHz, featuring 128 kB flash, 8 kB local SRAM, 16 kB Ethernet SRAM, and dual CAN channels. It integrates USB 2.0 full-speed device interface with 4 kB endpoint RAM, RMII Ethernet MAC, four UARTs, three I²C interfaces, I²S, SPI/SSP, 10-bit ADC (6-channel), 10-bit DAC, and 70 GPIO pins - deployed in industrial gateways requiring deterministic real-time serial protocol bridging.

For engineers reviewing the LPC2364HBD100 datasheet, LPC2364HBD100 pinout, LPC2364HBD100 application, or LPC2364HBD100 equivalent, key selection criteria include extended temperature operation (−40 °C to +125 °C), RMII Ethernet support, dual-CAN capability, USB device functionality, and LQFP100 package compatibility with legacy LPC23xx PCB layouts.

Technical Context

The LPC2364HBD100 implements an ARM7TDMI-S core with dual AHB bus architecture enabling concurrent Ethernet DMA, USB DMA, and flash execution without bus contention. Its Advanced Vectored Interrupt Controller supports 32 vectored interrupts with prioritization, and the General Purpose DMA controller services SSP, I²S, and SD/MMC peripherals.

On-chip peripherals include a dedicated CAN controller supporting two independent CAN 2.0B channels, RMII-compliant Ethernet MAC with integrated 16 kB buffer SRAM, and a 4-channel 10-bit ADC with multiplexed inputs - all accessible via configurable pin functions routed through the Pin Connect Block for flexible I/O mapping.

Key Specifications

Pinout & Package

LPC2364HBD100 uses a plastic LQFP100 package (SOT407-1): 100-pin, 14 mm × 14 mm × 1.4 mm body, 0.5 mm pitch, exposed pad not specified. Pin functions are fully configurable via the Pin Connect Block; primary peripheral signals include RMII (ENET_TXD0–1, ENET_RXD0–1, ENET_TX_EN, ENET_MDC/MDIO), dual CAN (RD1/TD1, RD2/TD2), USB (USB_D+, USB_D−, VBUS), and multi-protocol serial (UART0–3, I²C0–2, I²S, SSP0/1).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC2368FBD100, LPC2364HBD100 trades flash/RAM capacity for lower BOM cost and thermal footprint in fixed-function gateways; versus LPC1769FBD100, it retains analog retention and ARM7 deterministic interrupt latency at lower clock speed and power.

Availability

LPC2364HBD100 is available at Aetrix Electronics and suitable for industrial protocol gateways, automotive diagnostic interfaces, and energy meter communication hubs requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for LPC2364HBD100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The LPC2364HBD100 belongs to the LPC2300 family of ARM7-based microcontrollers designed specifically for multi-serial-protocol embedded gateways requiring Ethernet, USB, CAN, and analog interfaces in a single chip.

FAQ

What is the maximum operating temperature specification for the LPC2364HBD100?

The LPC2364HBD100 is rated for −40 °C to +125 °C operation, verified per JEDEC JESD22-A108. This extended temperature range enables deployment in under-hood automotive modules, industrial motor drives, and outdoor energy infrastructure where ambient temperatures exceed standard commercial-grade limits. The LPC2364HBD100 achieves this via enhanced silicon process characterization and thermal design validation - distinct from the +85 °C-rated LPC2364FBD100 variant.

Does the LPC2364HBD100 support USB device functionality, and what are its requirements?

Yes, the LPC2364HBD100 integrates a USB 2.0 full-speed device controller with 4 kB on-chip endpoint RAM, supporting up to 16 logical endpoints. It requires only external 1.5 kΩ pull-up resistors on USB_D+ and proper 3.3 V regulation; no external PHY is needed. The LPC2364HBD100 must be powered from 3.3 V (3.0–3.6 V), and VBUS monitoring via P1[30] is mandatory for enumeration. USB operation is disabled if the internal RC oscillator is used as the system clock.

How many CAN interfaces does the LPC2364HBD100 provide, and are they electrically isolated?

The LPC2364HBD100 includes two independent CAN 2.0B controllers (CAN1 and CAN2), each with dedicated RX/TX pins (e.g., P0[0]/RD1 & P0[1]/TD1 for CAN1; P0[4]/RD2 & P0[5]/TD2 for CAN2). These are digital-level controllers only - physical layer isolation requires external CAN transceivers (e.g., TJA1042, SN65HVD230) and galvanic separation circuitry. The dual-CAN capability enables redundant networks or simultaneous communication with different bus speeds and protocols.

What is the role of the 2 kB battery-backed SRAM in the LPC2364HBD100?

The 2 kB SRAM powered from the VBAT pin retains critical data (e.g., metering logs, calibration coefficients, security keys) during main power loss, enabling seamless resume after brownout or controlled shutdown. It is accessed identically to regular SRAM but remains active as long as VBAT ≥ 1.0 V. This feature is essential for energy meters, medical devices, and industrial controllers where data integrity across power cycles is non-negotiable. The LPC2364HBD100 maintains this function across its full −40 °C to +125 °C range.

Can the LPC2364HBD100 operate with the internal 4 MHz RC oscillator as the main clock source?

Yes, the LPC2364HBD100 includes a factory-trimmed 4 MHz internal RC oscillator accurate to ±1 %, usable as the system clock source. However, when selected, USB and CAN peripherals are disabled - these require a crystal-derived clock (via PLL or direct XTAL input) for timing compliance. For applications needing USB/CAN, the device must use the external 1–24 MHz crystal (XTAL1/XTAL2) with optional PLL multiplication to achieve 72 MHz CPU operation.