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NXP Semiconductors LPC2365FBD100,551

Part No.:
LPC2365FBD100,551
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixLPC2365FBD100,551.pdf
Description:
IC MCU 16/32B 256KB FLSH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,358

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Product details

Overview

LPC2365FBD100 from NXP Semiconductors is a 32-bit ARM7TDMI-S microcontroller operating at up to 72 MHz, featuring 256 kB flash, 32 kB local bus SRAM, 16 kB Ethernet SRAM, and 8 kB USB/general-purpose SRAM. It integrates Ethernet MAC (RMII), four UARTs, three I²C interfaces, two SSPs, SPI, I²S, 10-bit ADC (6-channel), 10-bit DAC, PWM, RTC, and 70 GPIO pins - optimized for industrial protocol converters and embedded communication gateways.

For engineers reviewing the LPC2365FBD100 datasheet, LPC2365FBD100 pinout, LPC2365FBD100 application, or LPC2365FBD100 equivalent, key selection considerations include its lack of USB device interface and dual CAN controllers (vs. LPC2364/66/68), RMII Ethernet support, 256 kB flash/32 kB SRAM memory configuration, and LQFP100 package with 100-pin 14 × 14 mm footprint.

Technical Context

The LPC2365FBD100 implements a dual Advanced High-performance Bus (AHB) architecture enabling concurrent Ethernet DMA, program execution from flash, and peripheral access without bus contention. Its ARM7TDMI-S core supports both 32-bit ARM and 16-bit Thumb instruction sets, delivering up to 30 % higher interrupt service performance in ARM mode versus Thumb.

Peripheral integration includes a dedicated AHB-based Ethernet MAC with RMII interface, a General Purpose DMA controller supporting SSP, I²S, and memory-to-memory transfers, and an Advanced Vectored Interrupt Controller (VIC) managing up to 32 vectored interrupts - all coordinated via configurable pin-muxing through the Pin Connect Block.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core ARM7TDMI-S, 32-bit/16-bit Thumb, up to 72 MHz - enables deterministic real-time control with legacy code compatibility.
Flash Memory 256 kB on-chip flash with ISP/IAP - supports field firmware updates without external programming hardware.
SRAM 32 kB local bus SRAM + 16 kB Ethernet SRAM + 8 kB GP/USB SRAM - separates high-bandwidth Ethernet and CPU access paths.
Serial Interfaces 4× UARTs (with FIFO & fractional baud), 3× I²C, 2× SSP, SPI, I²S, Ethernet MAC (RMII) - no USB device or CAN controllers per datasheet Table 2.
Analog Peripherals 10-bit ADC (6 inputs), 10-bit DAC (1 output), RTC with 2 kB battery-backed SRAM - supports sensor interfacing and time-stamped data logging.
Timers & PWM 4× 32-bit timers (8 capture/10 compare), 1× PWM unit (6-channel, 3-phase motor control capable) - suitable for precision motor drive and pulse generation.
Package & Power LQFP100 (14 × 14 × 1.4 mm, SOT407-1), 3.0–3.6 V supply, -40 °C to +85 °C - standard industrial-grade quad flat package with thermal and layout compatibility across LPC236x family.

Pinout & Package

Package: LQFP100 (plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm, SOT407-1).

Pin/Terminal Circuit Role Design Meaning
P0[0]–P0[31] Port 0 GPIO / peripheral multiplex 32-bit bidirectional port with configurable functions including UART3, I²C1, CAN1 (not active on LPC2365), ADC0 inputs, and I²S signals.
P1[0]–P1[31] Port 1 GPIO / Ethernet & timer I/O 32-bit port hosting ENET_TXD0/1, ENET_RXD0/1, ENET_MDC/MDIO, RMII control, and Timer match/capture signals.
P2[0]–P2[13] Port 2 GPIO / UART1, PWM, trace, EINT 14 usable pins supporting UART1 TX/RX/CTS/RTS/DSR/DTR/DCD/RI, PWM1 outputs, external interrupts EINT0–EINT3, and trace debug signals.
VDD(3V3), VSS Power supply / ground Multiple distributed 3.3 V and ground pins ensure stable core/peripheral voltage delivery and low-noise analog reference (VDDA/VSSA/VREF).
XTAL1/XTAL2 Clock input Supports 1–24 MHz crystal oscillator; internal 4 MHz RC oscillator available but disables CAN/USB (not applicable here).

Key Features

Feature Design Value
Dual AHB subsystem Enables simultaneous Ethernet DMA, CPU flash execution, and peripheral access - eliminates bus arbitration delays in real-time comms stacks.
RMII Ethernet interface Reduces PHY pin count to 6 signals (TXD0/1, TX_EN, RXD0/1, CRS_DV) - lowers BOM cost and PCB routing complexity vs. MII.
Configurable pin mux (Pin Connect Block) Allows dynamic assignment of UART, I²C, SSP, PWM, and timer functions to overlapping pins - maximizes peripheral utilization in space-constrained designs.
Advanced Vectored Interrupt Controller (VIC) Supports 32 prioritized, individually maskable vectored interrupts with sub-1 µs latency - critical for deterministic response in industrial control loops.
Battery-backed RTC SRAM 2 kB SRAM powered by VBAT retains configuration and timestamped logs during main power loss - enables fail-safe state recovery.

Applications

Industrial Protocol Converter Embedded Communication Gateway

Use Scenario: Translating Modbus RTU over RS-485 to Ethernet/IP in factory automation networks.

IC Role / Device Role / Timing Role: Central protocol translation engine executing dual-stack firmware with UART-to-Ethernet packet bridging and real-time scheduling.

Use Value: 256 kB flash stores multiple protocol stacks; RMII Ethernet and four UARTs enable concurrent serial/Ethernet traffic; 70 GPIO support discrete I/O mapping for status LEDs and control signals.

Use Scenario: Aggregating sensor data from CAN, I²C, and UART peripherals into unified Ethernet packets for SCADA systems.

IC Role / Device Role / Timing Role: Multi-interface data concentrator with deterministic packet timing via VIC-managed interrupts and hardware timers.

Use Value: 32 kB local bus SRAM buffers high-rate sensor streams; 10-bit ADC and DAC interface analog sensors and actuators; RTC with battery backup maintains accurate timestamps across power cycles.

Medical Data Logger Networked Industrial Controller

Use Scenario: Recording patient vital signs (ECG, SpO₂) with timestamped storage and remote retrieval via Ethernet.

IC Role / Device Role / Timing Role: Real-time acquisition node with ADC sampling, RTC time stamping, and Ethernet upload - meeting IEC 62304 timing requirements.

Use Value: 10-bit ADC provides sufficient resolution for biomedical signals; 2 kB battery-backed SRAM preserves last-recorded data during power loss; 3.3 V single-supply simplifies medical-grade power design.

Use Scenario: Controlling HVAC subsystems using PWM-driven valves, monitoring temperature via I²C sensors, and reporting faults over Ethernet.

IC Role / Device Role / Timing Role: Deterministic motion and thermal control processor with synchronized PWM outputs and interrupt-driven sensor polling.

Use Value: 6-channel PWM supports multi-zone actuator control; three I²C interfaces connect to multiple temperature/humidity sensors; watchdog and brownout detection ensure fail-safe operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
LPC2364FBD100 128 kB flash, 8 kB local SRAM, includes USB device + 4 kB FIFO and dual CAN - lacks LPC2365's larger memory and Ethernet SRAM. Preferred where USB device functionality or CAN bus connectivity is required; unsuitable for memory-intensive protocol stacks. Select when USB/CAN are mandatory and 256 kB flash is not needed.
LPC2366FBD100 256 kB flash and 32 kB SRAM like LPC2365FBD100, but adds USB device + 4 kB FIFO and dual CAN - same package and pinout. Drop-in upgrade path if future USB or CAN support is anticipated; requires verifying USB PHY layout compatibility. Choose for forward-compatible designs needing USB/CAN without changing PCB layout.

Compared with LPC2364FBD100 and LPC2366FBD100, the LPC2365FBD100 trades USB and CAN interfaces for increased SRAM (32 kB vs. 8 kB) and dedicated Ethernet buffers (16 kB), making it optimal for Ethernet-centric gateway applications where memory bandwidth outweighs peripheral count.

Availability

LPC2365FBD100 is available at Aetrix Electronics and suitable for industrial protocol converters, embedded communication gateways, medical data loggers, and networked industrial controllers requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for LPC2365FBD100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based microcontrollers and edge processing.

The LPC2365FBD100 belongs to the LPC2300 series - a family of ARM7-based microcontrollers engineered for high-integration embedded networking, emphasizing Ethernet, multi-serial interface concurrency, and deterministic real-time control in resource-constrained environments.

FAQ

Does the LPC2365FBD100 include a USB device interface?

No, the LPC2365FBD100 does not integrate a USB device controller or on-chip PHY. This is confirmed in Table 2 of the datasheet, which lists "no" under the USB column for LPC2365FBD100. In contrast, LPC2364/66/68 variants include USB 2.0 full-speed device capability. Designers requiring USB must select an alternative variant or add an external USB transceiver.

What is the maximum operating frequency of the LPC2365FBD100?

The LPC2365FBD100 operates at a maximum CPU clock frequency of 72 MHz, achieved via its on-chip PLL that accepts input from the main oscillator (1–24 MHz crystal), internal 4 MHz RC oscillator, or RTC oscillator. The 72 MHz rating is validated across the full industrial temperature range (-40 °C to +85 °C) specified for this part.

How many analog-to-digital converter channels does the LPC2365FBD100 support?

The LPC2365FBD100 integrates a single 10-bit ADC (AD0) with six multiplexed input channels (AD0[0]–AD0[5]), accessible on P0[23], P0[24], P0[25], P0[26], P1[30], and P1[31]. No second ADC is present - this matches the LPC236x family specification and is explicitly listed in Table 2 under the "ADC" column as "6".

Is the LPC2365FBD100 pin-compatible with other LPC236x LQFP100 variants?

Yes, the LPC2365FBD100 shares identical LQFP100 packaging (SOT407-1), mechanical footprint, and pinout with LPC2364FBD100, LPC2366FBD100, LPC2367FBD100, and LPC2368FBD100. All use the same 100-pin arrangement and signal mapping per Tables 3–4, enabling direct PCB substitution where peripheral feature alignment permits.

What power supply requirements does the LPC2365FBD100 have?

The LPC2365FBD100 requires a single 3.3 V supply (VDD(3V3)) operating within 3.0 V to 3.6 V, plus separate analog supply pins VDDA/VSSA and reference VREF for the ADC/DAC. It also supports a dedicated DC-DC converter supply (VDD(DCDC)(3V3)) and RTC battery input (VBAT) - all defined in the pin description table and absolute maximum ratings section.

LPC2365FBD100,551 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-LQFP
Series:
LPC2300
Packaging:
Tray
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
58K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC2365FBD100,551 FAQ

1.How can I place an order for LPC2365FBD100,551 through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC2365FBD100,551 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC2365FBD100,551 reliable?

The price and inventory of LPC2365FBD100,551 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC2365FBD100,551 is usually 5 days.

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5.How can I obtain technical support or documentation for LPC2365FBD100,551?

For technical support, including LPC2365FBD100,551 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC2365FBD100,551 requirements.

6.How does Aetrix verify that LPC2365FBD100,551 is sourced from the original manufacturer or authorized distributors?

All LPC2365FBD100,551 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC2365FBD100,551 meets industry standards.

7.What is the process for return or replacement of LPC2365FBD100,551?

All LPC2365FBD100,551 units undergo pre-shipment inspection (PSI). If there is an issue with LPC2365FBD100,551, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC2365FBD100,551 part is unused and in its original packaging.

Return procedure for LPC2365FBD100,551:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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