NXP Semiconductors LPC2367FD100551

Overview

LPC2367FD100551 from NXP Semiconductors is a 32-bit ARM7TDMI-S microcontroller with 512 kB flash, 32 kB local SRAM, 16 kB Ethernet SRAM, and 8 kB USB/general-purpose SRAM, operating up to 72 MHz. It integrates Ethernet MAC (RMII), SD/MMC interface, four UARTs, three I²C buses, two SSPs, SPI, I²S, 10-bit ADC (6-channel), 10-bit DAC, PWM, RTC, and 70 GPIO pins - deployed in industrial protocol converters and communication gateways.

For engineers reviewing the LPC2367FD100551 datasheet, LPC2367FD100551 pinout, LPC2367FD100551 application, or LPC2367FD100551 equivalent, key selection criteria include RMII Ethernet support, SD/MMC host capability, absence of USB and CAN peripherals, 512 kB flash density, and LQFP100 package compatibility with legacy LPC23xx designs.

Technical Context

The LPC2367FD100551 implements a dual-AHB bus architecture separating Ethernet DMA, program execution, and peripheral access to eliminate bus contention. Its ARM7TDMI-S core supports both 32-bit ARM and 16-bit Thumb instruction sets, enabling up to 30 % performance gain in interrupt service routines versus Thumb mode.

It features an Advanced Vectored Interrupt Controller (VIC) supporting 32 vectored interrupts, a General Purpose DMA controller (GPDMA) servicing SSP, I²S, and SD/MMC interfaces, and independent power domains for fine-grained power management across Ethernet, USB, and real-time subsystems.

Key Specifications

Pinout & Package

LPC2367FD100551 uses a plastic LQFP100 package (14 × 14 × 1.4 mm, SOT407-1) with 100 leads and exposed thermal pad. Pin functions are multiplexed via the Pin Connect Block, supporting dynamic peripheral assignment without hardware redesign.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC2368FBD100, LPC2367FD100551 removes USB/CAN to reduce silicon area and dynamic power, making it more suitable for Ethernet-only gateways; versus LPC2468FBD208, it offers identical core performance and peripheral set at lower BOM cost and smaller footprint, but lacks external bus and multimedia extensions.

Availability

LPC2367FD100551 is available at Aetrix Electronics and suitable for industrial protocol converters, smart energy gateways, medical device controllers, and building automation nodes requiring stable component supply, long-term lifecycle assurance, and drop-in compatibility with existing LPC23xx designs.

Supply support for LPC2367FD100551 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC23xx family was designed specifically for high-integration embedded control applications demanding rich serial connectivity, deterministic real-time performance, and robust industrial temperature operation - targeting protocol conversion, gateway, and automation equipment.

FAQ

Does LPC2367FD100551 support USB device functionality?

No, LPC2367FD100551 does not include a USB physical layer (PHY) or USB device controller. Although pins P0[29] and P0[30] retain USB_D+ and USB_D− labels for package compatibility, these signals are unconnected internally. The LPC2367 variant explicitly omits USB hardware, unlike LPC2364/66/68. Designers requiring USB must select LPC2368FBD100 or migrate to newer families.

What is the maximum operating frequency of LPC2367FD100551?

LPC2367FD100551 operates at a maximum CPU clock frequency of 72 MHz, achieved via its on-chip PLL driven by the main oscillator (1–24 MHz crystal), internal RC oscillator (4 MHz, ±1 %), or RTC oscillator. This frequency is sustained across the full industrial temperature range (−40 °C to +85 °C) under 3.3 V supply conditions.

Does LPC2367FD100551 include CAN bus controllers?

No, LPC2367FD100551 does not integrate CAN controllers. CAN functionality is only present in LPC2364/66/68 variants. The LPC2367 data sheet explicitly lists "CAN" as "–" in Table 2 (Ordering Options), confirming its omission. Designers requiring CAN must use LPC2368FBD100 or evaluate alternative microcontrollers with dual-CAN support.

What package type is used for LPC2367FD100551?

LPC2367FD100551 uses a plastic low-profile quad flat package (LQFP100) with 100 leads, body dimensions 14 × 14 × 1.4 mm (SOT407-1). It features an exposed thermal pad on the underside for improved heat dissipation and is compatible with standard LQFP100 PCB footprints and reflow profiles.

Is SD/MMC interface supported on LPC2367FD100551?

Yes, LPC2367FD100551 fully supports SD/MMC host interface functionality, including SD 2.0 and MMC 4.2 compliance, 1-bit and 4-bit data modes, and high-speed clocking up to 25 MHz. Pins P0[19] (MCICLK), P0[20] (MCICMD), P0[21] (MCIPWR), and P0[22]/P0[23]/P0[24]/P0[25] (MCIDAT[0:3]) are dedicated to this interface and operate independently of USB or CAN modules.