NXP Semiconductors LPC2919FBD144,551

Overview

LPC2919FBD144 from NXP Semiconductors is an ARM968E-S-based microcontroller operating at up to 80 MHz, featuring 768 kB on-chip flash, dual 10-bit ADCs (16 channels total), two CAN 2.0B controllers, and two LIN 2.0 master interfaces - deployed in automotive body control modules for real-time sensor fusion and actuator coordination.

For engineers reviewing the LPC2919FBD144 datasheet, LPC2919FBD144 pinout, LPC2919FBD144 application, or LPC2919FBD144 equivalent, key selection criteria include CAN/LIN coexistence, 144-pin LQFP package with 108 GPIOs, dual 16 kB TCMs for deterministic code execution, and independent clock domains for peripheral power optimization.

Technical Context

The LPC2919FBD144 implements a five-stage ARMv5TE pipeline with Thumb/ARM instruction set support, enabling 65% code density improvement over standard ARM while retaining 160% performance versus 16-bit memory systems. Its AHB-to-APB bridges include write-ahead buffers to decouple CPU writes from peripheral latency.

Peripherals operate on dedicated base clocks (e.g., BASE_CAN_CLK, BASE_LIN_CLK) managed by the Clock Generation Unit (CGU), with fractional dividers enabling precise frequency tuning. The Power Management Unit (PMU) independently gates branch clocks - including CLK_SAFE (always-on watchdog clock) and CLK_SYS_CPU (80 MHz ARM968E-S core clock).

Key Specifications

Pinout & Package

Package: LQFP144 (SOT486-1), 20 × 20 × 1.4 mm, 144-pin plastic low-profile quad flat package with exposed thermal pad (not electrically connected). Pin 1 marked by dot; pin numbering follows standard counter-clockwise sequence from top-left corner.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ARM9-based automotive microcontroller applications.

Compared with LPC2929FBD144, the LPC2919FBD144 trades flash capacity for cost-sensitive body electronics; compared with R7F7010283AFP, it retains native LIN 2.0 support and ARM toolchain compatibility - critical for rapid development of multi-network automotive modules.

Availability

LPC2919FBD144 is available at Aetrix Electronics and suitable for automotive body control, door module design, and roof/seat control systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant sourcing.

Supply support for LPC2919FBD144 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based microcontrollers and automotive networking.

The LPC29xx family was designed specifically for automotive body electronics requiring concurrent CAN and LIN communication, deterministic real-time performance, and robust power management - targeting ASIL-B functional safety compliance in non-safety-critical control units.

FAQ

What is the maximum operating frequency of the LPC2919FBD144?

The LPC2919FBD144 features an ARM968E-S processor with a maximum CPU clock frequency of 80 MHz, achieved via its on-chip PLL using a 10–25 MHz crystal input (with PLL input limited to 15 MHz). This frequency is sustained across the full −40 °C to +85 °C ambient operating range under 1.8 V core supply conditions.

Does the LPC2919FBD144 support both CAN and LIN protocols simultaneously?

Yes, the LPC2919FBD144 integrates two independent CAN 2.0B controllers and two LIN 2.0 master interfaces on-die. They operate concurrently with separate clock domains (BASE_IVNSS_CANCA/CANC0/CANC1 and BASE_IVNSS_LIN0/LIN1), enabling simultaneous communication on CAN backbone and multiple LIN subnetworks without resource contention.

How much embedded memory does the LPC2919FBD144 include?

The LPC2919FBD144 includes 768 kB of on-chip flash memory for program and data storage, plus 80 kB of RAM: two 16 kB Tightly Coupled Memories (ITCM/DTCM), one 32 kB SRAM block, and one 16 kB SRAM block. All memory blocks are accessible via the AHB bus with zero-wait-state operation at 80 MHz.

What package type and pin count does the LPC2919FBD144 use?

The LPC2919FBD144 is housed in a 144-pin LQFP package (SOT486-1) measuring 20 × 20 × 1.4 mm. It provides 108 general-purpose I/O pins with configurable pull-up, pull-down, or bus keeper functionality, alongside dedicated power, clock, reset, JTAG, and peripheral interface pins as defined in the official NXP pin assignment table.

Is the LPC2919FBD144 qualified for automotive applications?

Yes, the LPC2919FBD144 is specified for −40 °C to +85 °C ambient operation and designed to meet automotive reliability standards. While not explicitly AEC-Q100 certified in public documentation, its architecture - including dual CAN/LIN, fail-safe reset generation, and robust power management - aligns with requirements for body electronics ECUs targeting ASIL-B functional safety levels.