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NXP Semiconductors LPC2925FBD100,551

Part No.:
LPC2925FBD100,551
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixLPC2925FBD100,551.pdf
Description:
IC MCU 16/32B 512KB FLSH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,608

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Product details

Overview

LPC2925FBD100 from NXP Semiconductors is an ARM968E-S-based microcontroller operating up to 125 MHz, integrating 512 kB flash, 40 kB SRAM (two 16 kB blocks + 8 kB ETB), dual CAN 2.0B controllers, two LIN 2.0 masters, full-speed USB 2.0 device controller with on-chip PHY, and two 10-bit ADCs - deployed in industrial motor control, automotive body electronics, and USB-connected sensor gateways.

For engineers reviewing the LPC2925FBD100 datasheet, LPC2925FBD100 pinout, LPC2925FBD100 application, or LPC2925FBD100 equivalent, key selection criteria include its dual-CAN/LIN/USB integration, 100-pin LQFP package with 60 GPIOs, TCM-optimized real-time execution, and flexible clock/power management for low-power embedded systems.

Technical Context

The LPC2925FBD100 implements a multilayer AHB bus architecture at 125 MHz with four independent layers, enabling concurrent access to TCM, flash, SRAM, and peripherals without arbitration bottlenecks. Its dual-clock-generation units (CGU0 and CGU1) independently manage system timing: CGU0 supplies base clocks for CPU, timers, UARTs, SPI, I²C, CAN, and LIN, while CGU1 generates dedicated USB 48 MHz and configurable output clocks via its own PLL.

It features a dual-master, eight-channel GPDMA controller supporting memory-to-memory transfers and peripheral DMA (including TCM access), alongside a Vectored Interrupt Controller (VIC) with 16 priority levels and wake-up capability from power-down via CAN/LIN activity or external interrupts - critical for deterministic real-time response in automotive and industrial networks.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core ARM968E-S, 32-bit RISC, up to 125 MHz - enables real-time deterministic execution with THUMB/ARM instruction set support and 5-stage pipeline.
Memory 512 kB embedded flash + 40 kB SRAM (two 16 kB AHB SRAM blocks + 8 kB ETB SRAM) - supports code/data separation, trace buffer usage, and robust firmware storage.
Connectivity Dual CAN 2.0B controllers (FullCAN + message filtering), two LIN 2.0 masters (configurable as UART), USB 2.0 full-speed device with integrated PHY - eliminates need for external transceivers in multi-bus automotive nodes.
Analog Two 10-bit ADCs, 8 channels each, 2.44 μs conversion time, hardware compare triggers - enables high-resolution sensor monitoring with minimal CPU overhead.
Timers & PWM Four 32-bit timers (each with four capture/compare registers), four six-channel PWMs with trap/capture - supports precise motor control, encoder feedback, and PWM-driven actuation.
Package LQFP100 (SOT407-1), 14 × 14 × 1.4 mm, −40 °C to +85 °C - standard industrial-grade footprint with 60 GPIOs, 5 V-tolerant inputs, and dual power domains (1.8 V core / 3.3 V I/O).

Pinout & Package

Package: LQFP100 (SOT407-1), plastic low-profile quad flat package with 100 leads, body size 14 × 14 × 1.4 mm, lead pitch 0.5 mm, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
P0[24]/TXD1/TXDC1/SCS2[0] GPIO0 Pin 24 / UART1 TX / CAN1 TX / SPI2 SCS0 Multi-function pin supporting serial communication, CAN bus transmission, or SPI slave select - configurable via SFSP registers for protocol flexibility.
P5[19]/USB_D+ USB differential data positive Dedicated analog USB pad with internal termination - enables direct connection to USB connector without external components.
VDD(CORE) Digital core supply 1.8 V ±5 % input powering ARM968E-S core and TCMs - requires low-noise regulation to maintain CPU stability at 125 MHz.
VDD(IO) I/O supply 3.3 V supply for all GPIOs, peripherals, and interfaces - supports 5.5 V-tolerant inputs for legacy signal interfacing.
RST Asynchronous reset input Active-low, internally pulled up - initiates full chip reset including CPU, memories, and peripherals; synchronizes with safe clock during power-up.

Key Features

Feature Design Value
Tightly Coupled Memory (TCM) 16 kB ITCM + 16 kB DTCM - provides zero-wait-state instruction/data access for time-critical ISR and real-time control loops.
Dual Clock Generation Units CGU0 manages system/peripheral clocks; CGU1 independently generates USB 48 MHz and configurable CLKOUT - isolates USB timing from system clock jitter.
Power Management Unit (PMU) Per-module clock gating and branch clock control - enables dynamic power scaling across subsystems (e.g., disable LIN while USB active) to minimize active current.
ETM/ETB Debug 8 kB dedicated ETB SRAM accessible for both trace storage and application code - supports non-intrusive real-time instruction tracing without external debug probes.
ADC Trigger Flexibility Multiple start sources: timer, PWM, other ADC, or external signal - allows synchronized sampling across sensors and actuators in closed-loop systems.

Applications

Automotive Body Control Module Industrial USB Sensor Gateway

Use Scenario: Centralized control of door locks, lighting, HVAC, and window motors in 12 V vehicle platforms.

IC Role / Device Role / Timing Role: Primary MCU managing CAN/LIN communication with distributed ECUs, executing safety-critical state machines with sub-millisecond response.

Use Value: Dual CAN controllers enable simultaneous communication with powertrain and chassis networks; LIN masters drive local actuators without external transceivers.

Use Scenario: Aggregating analog and digital sensor data (temperature, pressure, vibration) and forwarding via USB to host PC or edge controller.

IC Role / Device Role / Timing Role: Host-side USB device with integrated PHY and dual ADCs - acts as plug-and-play sensor interface with no external USB IC required.

Use Value: Full-speed USB 2.0 + 40 kB SRAM enables high-throughput streaming (≥1 MB/s) of calibrated sensor data with minimal host driver complexity.

Motor Drive Feedback Controller Smart Home Energy Monitor

Use Scenario: Closed-loop control of BLDC/PMSM motors using quadrature encoder feedback and current sensing.

IC Role / Device Role / Timing Role: Real-time controller with QEI interface, PWM generation, and ADC-triggered sampling - synchronizes PWM updates with rotor position.

Use Value: Four 32-bit timers with capture/compare and six-channel PWMs support precise commutation timing; 2.44 μs ADC conversion enables fast current loop closure.

Use Scenario: Monitoring household AC mains voltage/current, temperature, and appliance status for energy analytics and load shedding.

IC Role / Device Role / Timing Role: Low-power embedded node with LIN for local device interconnection and USB for configuration/data export.

Use Value: Flexible clock gating and 1.8 V core reduce standby current; EEPROM enables secure storage of calibration constants and firmware update metadata.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
LPC2930FBD100 Same ARM968E-S core, 512 kB flash, but adds Ethernet MAC and RMII interface; removes one LIN controller. Suitable for wired industrial networking where Ethernet is required instead of dual LIN. Select when Ethernet connectivity outweighs LIN bus support in gateway or HMI applications.
STM32F407VGT6 Cortex-M4F core (168 MHz), 1 MB flash, 192 kB RAM, no native CAN FD or LIN, USB OTG HS, no EEPROM. Better floating-point performance and DSP capability, but requires external LIN transceiver and lacks byte-erasable EEPROM. Prefer for math-intensive control algorithms; avoid if LIN 2.0 or EEPROM persistence is mandatory.

Compared with LPC2925FBD100, LPC2930FBD100 trades LIN for Ethernet in identical packaging and flash capacity, while STM32F407VGT6 offers higher CPU throughput but lacks integrated LIN/CAN transceivers and EEPROM - making LPC2925FBD100 uniquely suited for cost-sensitive, multi-bus automotive and industrial nodes requiring mixed-protocol integration.

Availability

LPC2925FBD100 is available at Aetrix Electronics and suitable for automotive body electronics, industrial USB gateways, and motor control systems requiring stable component supply, long-term lifecycle assurance, and qualified industrial temperature operation.

Supply support for LPC2925FBD100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based microcontrollers and automotive-grade reliability.

The LPC2900 series was designed specifically for automotive and industrial networked systems requiring integrated CAN, LIN, and USB - delivering deterministic real-time performance, robust power management, and qualification to extended temperature ranges.

FAQ

What is the maximum operating frequency of the LPC2925FBD100 CPU core?

The LPC2925FBD100 integrates an ARM968E-S processor with a maximum operating frequency of 125 MHz, achieved via its on-chip PLL with crystal oscillator input (10–25 MHz range). This frequency is sustained under full load within the specified −40 °C to +85 °C ambient temperature range and 1.8 V core supply.

Does the LPC2925FBD100 support USB device functionality without external components?

Yes, the LPC2925FBD100 includes a full-speed USB 2.0 device controller with an integrated on-chip PHY and dedicated USB_D+/D− pads (pins 12 and 13), enabling direct connection to a USB connector without external transceivers or level shifters - simplifying board design and reducing BOM cost.

How much SRAM is available on the LPC2925FBD100, and how is it allocated?

The LPC2925FBD100 provides 40 kB of total SRAM: two independent 16 kB AHB SRAM blocks (accessible for code/data), plus an 8 kB ETB SRAM that can also be used for application code or data storage - distinct from the separate 16 kB ITCM and 16 kB DTCM used exclusively for zero-wait-state instruction and data caching.

Can the LPC2925FBD100 operate with different voltage domains for core and I/O?

Yes, the LPC2925FBD100 uses dual power domains: VDD(CORE) requires 1.8 V ±5 % for the ARM968E-S core and TCMs, while VDD(IO) operates at 3.3 V for all GPIOs and peripherals. I/O pins are 5.5 V tolerant, allowing safe interfacing with legacy 5 V logic without level shifters.

What types of CAN and LIN protocols does the LPC2925FBD100 support?

The LPC2925FBD100 supports CAN 2.0B (FullCAN mode with extensive message filtering) and LIN 2.0 (with full hardware protocol handling including auto-synchronization, checksum, and schedule table management). Both controllers operate independently and support wake-up from power-down on bus activity.

LPC2925FBD100,551 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-LQFP
Series:
LPC2900
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
40K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC2925FBD100,551 FAQ

1.How can I place an order for LPC2925FBD100,551 through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC2925FBD100,551 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC2925FBD100,551 reliable?

The price and inventory of LPC2925FBD100,551 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC2925FBD100,551 is usually 5 days.

3.What payment methods are accepted for LPC2925FBD100,551?

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4.How is shipping managed for LPC2925FBD100,551?

LPC2925FBD100,551 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC2925FBD100,551 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC2925FBD100,551?

For technical support, including LPC2925FBD100,551 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC2925FBD100,551 requirements.

6.How does Aetrix verify that LPC2925FBD100,551 is sourced from the original manufacturer or authorized distributors?

All LPC2925FBD100,551 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC2925FBD100,551 meets industry standards.

7.What is the process for return or replacement of LPC2925FBD100,551?

All LPC2925FBD100,551 units undergo pre-shipment inspection (PSI). If there is an issue with LPC2925FBD100,551, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC2925FBD100,551 part is unused and in its original packaging.

Return procedure for LPC2925FBD100,551:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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