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NXP Semiconductors LPC2927FBD144,551

Part No.:
LPC2927FBD144,551
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixLPC2927FBD144,551.pdf
Description:
IC MCU 16/32B 512KB FLSH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,365

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Product details

Overview

LPC2927FBD144 from NXP Semiconductors is an ARM968E-S-based microcontroller operating up to 125 MHz, featuring 512 kB flash, 56 kB SRAM + 2 × 32 kB TCM, dual CAN 2.0B controllers, two LIN 2.0 masters, full-speed USB 2.0 OTG, three 10-bit ADCs (24 total channels), and 104 GPIOs in a 144-pin LQFP package - deployed in industrial automation gateways requiring real-time CAN/LIN bridging and USB host-device flexibility.

For engineers reviewing the LPC2927FBD144 datasheet, LPC2927FBD144 pinout, LPC2927FBD144 application, or LPC2927FBD144 equivalent, this page delivers verified core parameters (CPU clock, memory map, peripheral integration), validated LQFP144 pin functions, confirmed use cases in automotive body control and industrial HMI, and two technically documented alternative MCUs with explicit functional and memory trade-offs.

Technical Context

The LPC2927FBD144 implements a multi-layer AHB bus architecture running at 125 MHz with four independent layers, enabling concurrent access to TCM, SRAM, flash, and peripherals without arbitration stalls. Its dual-clock-generation units (CGU0 for CPU/system clocks, CGU1 for USB) support dynamic frequency scaling and independent module-level clock gating.

Peripheral subsystems are partitioned across three APB buses and one dedicated event router APB, with DMA routing via GPDMA controller supporting transfers between UARTs, SPIs, CAN, and both TCM blocks. The Vectored Interrupt Controller (VIC) provides 16 priority levels and supports wake-up from power-down via CAN/LIN activity or external interrupt pins.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM968E-S, 32-bit RISC, 5-stage pipeline, THUMB/ARMv5TE instruction sets - enables deterministic real-time execution and compact firmware deployment.
Max Operating Frequency125 MHz - achieved via on-chip PLL with 10–25 MHz crystal input; supports high-throughput CAN message filtering and USB bulk transfer scheduling.
Flash Memory512 kB - sufficient for dual-bank firmware updates and embedded protocol stacks (CANopen, LIN 2.0, USB CDC/DFU).
SRAM & TCM56 kB SRAM + 32 kB ITCM + 32 kB DTCM - separates critical code (ITCM) and real-time data buffers (DTCM) from general-purpose variables (SRAM).
ADC SystemThree 10-bit ADCs: one 5 V-range (8 ch), two 3.3 V-range (16 ch total); 2.44 μs conversion time - supports fast analog sensor sampling in motor control feedback loops.
Serial Interfaces2× CAN 2.0B, 2× LIN 2.0, 2× UART (RS485-ready), 3× Q-SPI, 2× I²C, USB 2.0 FS OTG - enables mixed-protocol vehicle network gateways with hardware-accelerated message filtering.
Package & Temp RangeLQFP144 (20 × 20 × 1.4 mm), −40 °C to +85 °C - suitable for industrial control panels and automotive under-hood modules with constrained PCB area.

Pinout & Package

144-pin LQFP package (SOT486-1), 20 mm × 20 mm body, 0.5 mm pitch, exposed pad not specified. Pin functions include five GPIO ports (P0–P3, P5), dual USB differential pairs (USB_D+, USB_D−), CAN0/CAN1 transceiver pins, LIN0/LIN1 UART-compatibles, ADC analog inputs (VREFP/VREFN, ADC0–2 channels), and dedicated clock/reset/test signals (XIN_OSC, XOUT_OSC, RST, TRST, TCK, TMS, TDI, TDO, JTAGSEL).

Pin/TerminalCircuit RoleDesign Meaning
P0[24]/TXD1/RXDC1/SCS2[0]UART1 transmit / CAN1 TX / SPI2 chip selectMulti-function pin enabling shared physical layer for serial debug, CAN diagnostics, and SPI peripheral control - requires SFSP register configuration.
P5[19]/USB_D+USB 2.0 full-speed differential data+Dedicated USB PHY interface; no external transceiver needed; supports device/OTG roles with integrated DMA controller.
P3[6]/SCS0[3]/PMAT1[0]/TXDL1LIN1 transmit / SPI0 chip select / PWM1 match outputHardware LIN bus driver output (with slew-rate control); eliminates need for external LIN transceiver in node applications.
VDDA(ADC5V0)Analog supply for ADC0 and 5 V referenceIndependent 5 V rail for high-accuracy voltage measurement; decoupling required per datasheet layout guidelines.
RSTAsynchronous active-low reset inputPulled up internally; initiates full system reset including CPU, peripherals, and clock domains - used for safe firmware recovery.

Key Features

FeatureDesign Value
Dual CAN 2.0B controllers with global acceptance filterEnables simultaneous CAN FD-capable legacy networks (e.g., powertrain + chassis) with hardware message filtering reducing CPU load by >70 %.
Two LIN 2.0 master interfaces with UART fallbackSupports direct connection to LIN slave nodes (sensors, actuators) and reconfigures as extra UARTs when LIN not needed - simplifies BOM in multi-protocol designs.
GPDMA controller with TCM accessPermits zero-CPU-overhead transfers between CAN buffers and DTCM, or USB endpoints and ITCM - essential for deterministic real-time data movement.
Flexible Clock Generation Unit (CGU0 + CGU1)Allows independent clock scaling for CPU (125 MHz), USB (48 MHz), ADC (up to 10 MHz), and peripherals - minimizes dynamic power in battery-operated gateways.
16 kB byte-erasable EEPROMStores calibration data, device IDs, or secure keys with guaranteed 100k write cycles - avoids external EEPROM and reduces board space/cost.

Applications

Automotive Body Control ModuleIndustrial CAN-to-USB Gateway

Use Scenario: Central ECU managing door locks, lighting, and HVAC via LIN slaves and CAN-connected sensors.

IC Role / Device Role / Timing Role: Main application processor executing LIN schedule manager, CAN message router, and PWM dimming control with sub-10 μs interrupt latency.

Use Value: Integrated LIN masters eliminate 2 external transceivers; dual CAN controllers handle separate chassis and comfort networks without software arbitration.

Use Scenario: Field-deployable diagnostic tool connecting legacy CAN machinery to Windows/Linux PCs via USB.

IC Role / Device Role / Timing Role: Protocol bridge with real-time CAN frame buffering (via DTCM), USB CDC ACM class implementation, and configurable baud rates.

Use Value: On-chip USB PHY and GPDMA enable 12 Mbps CAN-to-USB throughput; 512 kB flash hosts dual firmware images for field updates.

Smart Energy Meter InterfaceMedical Device Sensor Hub

Use Scenario: Sub-metering unit aggregating current/voltage readings from isolated ADC channels and communicating via RS485 (UART) and CAN.

IC Role / Device Role / Timing Role: High-precision analog acquisition engine with synchronized ADC triggers (timer/PWM), CRC-protected data framing, and watchdog-monitored communication stack.

Use Value: Three independent 10-bit ADCs provide 24-channel sensing; 2.44 μs conversion time supports 400 kHz sampling for harmonic analysis.

Use Scenario: Portable patient monitor collecting ECG, temperature, and SpO₂ signals with local display and USB data export.

IC Role / Device Role / Timing Role: Low-power signal acquisition MCU with ADC compare functions to reduce interrupts, USB HID class for plug-and-play PC connectivity, and EEPROM for calibration storage.

Use Value: 1.8 V core voltage + dynamic clock gating achieves <15 mW active power; 16 kB EEPROM retains sensor offsets across battery swaps.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ARM9-based microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LPC2930FBD144768 kB flash, same 512 kB SRAM+TCM, identical pinout and peripheral set - differs only in flash density.Preferred where larger firmware (e.g., embedded web server + TLS) or dual-application storage is required.Select LPC2930FBD144 when firmware size exceeds 512 kB; no hardware or software changes needed beyond linker script update.
LPC1788FBD208Cortex-M3 core, 120 MHz, 512 kB flash, 64 kB RAM, no LIN, single CAN, no USB OTG - different architecture and reduced mixed-protocol capability.Suitable for cost-sensitive, non-LIN applications where USB device-only or Ethernet is acceptable.Choose LPC1788FBD208 only if LIN is unnecessary and CAN count can be reduced; requires full firmware porting due to ARMv7-M vs ARMv5TE ISA.

Compared with LPC2927FBD144, LPC2930FBD144 offers higher flash capacity with identical timing/peripheral behavior, while LPC1788FBD208 trades LIN/CAN flexibility and USB OTG for lower cost and Cortex-M3 ecosystem compatibility - making LPC2927FBD144 optimal for mixed-protocol automotive and industrial gateways requiring hardware LIN masters and dual CAN.

Availability

LPC2927FBD144 is available at Aetrix Electronics and suitable for industrial automation gateways, automotive body control modules, and smart energy meter interfaces requiring stable component supply, long-term lifecycle assurance, and qualified sourcing for production ramp.

Supply support for LPC2927FBD144 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based microcontrollers and automotive networking protocols.

The LPC29xx product line was engineered specifically for mixed-protocol embedded systems requiring simultaneous CAN, LIN, and USB connectivity - targeting automotive gateway, industrial control, and medical device applications demanding real-time determinism and low-power operation.

FAQ

What is the maximum CPU clock frequency supported by the LPC2927FBD144?

The LPC2927FBD144 supports a maximum CPU clock frequency of 125 MHz, achieved using its on-chip PLL with a 10–25 MHz crystal oscillator input. This frequency is sustained across the full −40 °C to +85 °C operating range when powered by 1.8 V ±5 % for the core and 2.7–3.6 V for I/O. The LPC2927FBD144 uses dynamic clock scaling to reduce power during low-load periods without compromising real-time response.

Does the LPC2927FBD144 include hardware support for LIN 2.0 communication?

Yes, the LPC2927FBD144 integrates two independent LIN 2.0 master controllers with full hardware protocol handling, including automatic header generation, checksum calculation, and error detection. Each LIN interface can be reconfigured as a standard UART, providing design flexibility. The LPC2927FBD144 does not require external LIN transceivers for basic node operation, reducing BOM cost and board space.

How much on-chip memory does the LPC2927FBD144 provide for code and data storage?

The LPC2927FBD144 provides 512 kB of on-chip flash memory for program storage, 56 kB of general-purpose SRAM, and two tightly coupled memories (32 kB ITCM for instructions and 32 kB DTCM for data). Additionally, it includes 16 kB of byte-erasable EEPROM for non-volatile parameter storage and 8 kB of ETB SRAM accessible for application use. This memory architecture enables deterministic real-time execution and robust firmware update strategies.

What peripheral interfaces are available on the LPC2927FBD144 for industrial communication?

The LPC2927FBD144 offers dual CAN 2.0B controllers with hardware message filtering, two LIN 2.0 masters, two UARTs with RS485/EIA-485 (9-bit) support, three Q-SPI interfaces, two I²C buses, and a full-speed USB 2.0 OTG controller with integrated PHY. These interfaces enable robust industrial communication in gateways, PLCs, and sensor hubs - particularly where mixed-protocol interoperability (e.g., CAN-to-USB bridging) is required without external level shifters or transceivers.

Is the LPC2927FBD144 pin-compatible with other members of the LPC29xx family?

Yes, the LPC2927FBD144 is pin-compatible with LPC2926FBD144 and LPC2929FBD144 in the same LQFP144 package, sharing identical pin assignments, peripheral mappings, and electrical characteristics. Differences are limited to flash memory size (256/512/768 kB) and minor feature enablement - allowing drop-in replacement within the same footprint and PCB layout. It is not pin-compatible with the LPC291x series due to reduced MSCSS/timer pinout.

LPC2927FBD144,551 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
144-LQFP
Series:
LPC2900
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
56K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 24x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC2927FBD144,551 FAQ

1.How can I place an order for LPC2927FBD144,551 through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC2927FBD144,551 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC2927FBD144,551 reliable?

The price and inventory of LPC2927FBD144,551 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC2927FBD144,551 is usually 5 days.

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LPC2927FBD144,551 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC2927FBD144,551 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC2927FBD144,551?

For technical support, including LPC2927FBD144,551 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC2927FBD144,551 requirements.

6.How does Aetrix verify that LPC2927FBD144,551 is sourced from the original manufacturer or authorized distributors?

All LPC2927FBD144,551 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC2927FBD144,551 meets industry standards.

7.What is the process for return or replacement of LPC2927FBD144,551?

All LPC2927FBD144,551 units undergo pre-shipment inspection (PSI). If there is an issue with LPC2927FBD144,551, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC2927FBD144,551 part is unused and in its original packaging.

Return procedure for LPC2927FBD144,551:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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