NXP Semiconductors LPC3152FET208,551

Overview

LPC3152FET208 from NXP Semiconductors is a 180 MHz ARM926EJ-S microcontroller with integrated audio codec, 192 kB SRAM, NAND flash controller, high-speed USB 2.0 OTG, RTC, Li-ion charger, and multi-domain power management - deployed in consumer audio players, industrial HMIs, and medical portable monitors.

For engineers reviewing the LPC3152FET208 datasheet, LPC3152FET208 pinout, LPC3152FET208 application, or LPC3152FET208 equivalent, key selection factors include its TFBGA208 package, dual-die analog/digital architecture, 3-channel 10-bit ADC, 1.2 V core voltage, and absence of AES decryption engine compared to LPC3154.

Technical Context

The LPC3152FET208 implements a two-die MCM architecture: one digital die hosting the ARM926EJ-S CPU, MMU, caches, DMA, and serial interfaces; and one analog die integrating the audio codec, RTC, PSU, and Li-ion charger. It uses dynamic clock gating via a flexible Clock Generation Unit (CGU) and supports boot from SPI flash, NAND flash, SD/MMC, UART, or USB.

It provides three independent 10-bit ADC inputs (GPA0–GPA2), stereo audio ADC/DAC with Class AB headphone amplifier, and a 6800/8080-compatible LCD interface. Unlike the LPC3154, it omits the AES decryption engine and secure boot capability, confirming its role as the cost-optimized variant in the family.

Key Specifications

Pinout & Package

Package: TFBGA208 (plastic thin fine-pitch ball grid array; 208 balls; body 12 × 12 × 0.7 mm; SOT930-1).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC3154FET208, the LPC3152FET208 trades security features for lower cost and reduced complexity; compared with i.MX233, it offers superior analog integration at the expense of CPU speed and memory bandwidth - making it optimal for cost-constrained, battery-powered audio and HMI applications.

Availability

LPC3152FET208 is available at Aetrix Electronics and suitable for portable audio players, industrial HMIs, and medical vital signs monitors requiring stable component supply across extended product lifecycles.

Supply support for LPC3152FET208 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The LPC3152FET208 belongs to the LPC3100 family - designed specifically for cost-sensitive, battery-powered embedded systems requiring integrated audio, power management, and USB connectivity without cryptographic overhead.

FAQ

Does the LPC3152FET208 include an AES decryption engine?

No, the LPC3152FET208 does not include an AES decryption engine. That feature is exclusive to the LPC3154FET208 variant. The LPC3152FET208 is the non-secure counterpart optimized for applications where cryptographic acceleration and secure boot are not required - such as basic audio players or industrial HMIs without DRM or firmware authentication needs.

What is the maximum operating frequency of the ARM926EJ-S core in the LPC3152FET208?

The ARM926EJ-S core in the LPC3152FET208 operates at a maximum frequency of 180 MHz. This speed is achieved under specified voltage (1.2 V core) and temperature (−40 °C to +85 °C) conditions, and is confirmed in the preliminary datasheet Rev. 0.12. The core includes 16 kB instruction and 16 kB data caches to sustain this performance with low-latency memory access.

Can the LPC3152FET208 directly drive 16 Ω headphones?

Yes, the LPC3152FET208 integrates a Class AB headphone amplifier with HP_OUTL and HP_OUTR outputs capable of directly driving 16 Ω loads. Its audio subsystem includes stereo ADC, DAC, and analog reference circuitry (HP_VREF, DAC_VREFP/N), enabling end-to-end audio signal chain implementation without external amplifiers - verified in the pin description table and functional overview of the LPC3152FET208 datasheet.

What package type and dimensions does the LPC3152FET208 use?

The LPC3152FET208 uses a TFBGA208 package: plastic thin fine-pitch ball grid array with 208 balls, body size 12 × 12 × 0.7 mm, and 0.7 mm pitch (SOT930-1). This package is explicitly listed in Table 1 of the datasheet and supports high-density PCB layouts while maintaining thermal performance suitable for handheld applications.

Does the LPC3152FET208 support booting from NAND flash?

Yes, the LPC3152FET208 supports booting from NAND flash via its integrated NAND flash controller. Table 2 confirms "NAND Flash Controller" as present for LPC3152FET208, and Section 2.1 states selectable boot-up includes NAND flash. The controller supports 8-bit ECC (though AES decryption for secure boot is absent - that is reserved for LPC3154FET208).