Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors LPC4350FET180,551

Part No.:
LPC4350FET180,551
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
180-TFBGA
Datasheet:
AetrixLPC4350FET180,551.pdf
Description:
IC MCU 32BIT ROMLESS 180TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:189

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

LPC4350FET180,551 from NXP Semiconductors is a dual-core ARM Cortex-M4/M0 microcontroller for high-performance embedded control, featuring 264 kB SRAM, integrated Ethernet MAC with IEEE 1588 support, dual high-speed USB 2.0 interfaces (one with on-chip HS PHY), and LCD controller - deployed in industrial gateways requiring deterministic real-time processing and multi-protocol connectivity.

For engineers reviewing the LPC4350FET180,551 datasheet, LPC4350FET180,551 pinout, LPC4350FET180,551 application, or LPC4350FET180,551 equivalent, key selection considerations include dual-core asymmetric execution capability, TFBGA180 package pin compatibility with legacy LPC43x0 designs, Ethernet+USB coexistence without bus contention, and SRAM partitioning for secure code/data isolation.

Technical Context

The LPC4350FET180,551 implements a tightly coupled dual-core architecture where the Cortex-M4 (up to 204 MHz) serves as the primary application processor with hardware FPU and MPU, while the Cortex-M0 (up to 204 MHz) operates as a dedicated offload engine for time-critical peripherals including SCTimer/PWM, GIMA event routing, and USB protocol handling. Both cores share access to the AHB multilayer matrix but maintain independent local SRAM blocks (128 kB + 72 kB).

Its clock system integrates three PLLs: one for CPU/AXI operation, one dedicated to USB0 high-speed PHY, and a third configurable as audio PLL; combined with a 12 MHz IRC oscillator trimmed to ±1.5% and RTC crystal oscillator, it enables precise timing across mixed-criticality subsystems without external frequency sources.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreDual ARM Cortex-M4 (204 MHz) + Cortex-M0 (204 MHz); enables asymmetric task partitioning with hardware FPU on M4 and low-overhead peripheral offload on M0.
On-chip Memory264 kB SRAM (128 kB + 72 kB + 32 kB + 16 kB + 16 kB blocks), 64 kB ROM boot code, 64-bit + 256-bit OTP; supports independent power-down of SRAM banks for dynamic power management.
Connectivity10/100T Ethernet MAC with RMII/MII and IEEE 1588-2008 v2 timestamping; two HS USB 2.0 interfaces (USB0 with on-chip HS PHY, USB1 with ULPI support).
Analog PeripheralsTwo 10-bit ADCs (400 kSamples/s, 8 channels each), one 10-bit DAC (400 kSamples/s); shared channel mapping allows synchronized sampling across both ADCs.
Digital InterfacesSGPIO (32 pins), SCTimer/PWM (state-configurable logic engine), GIMA crossbar, EMC supporting SDRAM/NOR/SRAM, LCD controller up to 1024×768.
Package & I/OTFBGA180 (12×12 mm, 0.65 mm pitch); 118 GPIO pins with configurable pull-up/down, eight GPIO group interrupts, and DMA-capable port registers on AHB.
Power ManagementSingle 3.3 V supply (2.2–3.6 V), four low-power modes (Sleep to Deep power-down), RTC domain with 256 B battery-backed registers and alarm timer.

Pinout & Package

Package: TFBGA180 (Thin Fine-Pitch Ball Grid Array), 12 mm × 12 mm, 0.65 mm ball pitch, 180 I/O balls. Pinout conforms to Figure 3 in NXP document Rev. 4.6 (14 March 2016), with digital pins grouped into 16 ports (P0–P9, PA–PF), each supporting up to eight multiplexed functions via SCU configuration.

Pin/Terminal Circuit Role Design Meaning
P0_0GPIO0[0] / SSP1_MISO / ENET_RXD1 / I2S0_TX_WSMulti-function ball supporting Ethernet receive data (RMII/MII), SPI slave input, or I2S word select - selected at runtime via SCU register.
P1_15GPIO0[2] / U2_TXD / ENET_RXD0 / T0_MAT1Shared Ethernet RX0 and USART2 TX; enables compact PHY interface layout while retaining serial debug capability during Ethernet operation.
P1_18GPIO0[13] / ENET_TXD0 / T0_MAT3 / CAN1_RDCombines Ethernet transmit data and CAN1 receive on same ball - requires careful signal integrity planning due to mixed-speed routing constraints.
P2_0GPIO5[0] / U0_TXD / EMC_A13 / USB0_PPWRUSB0 VBUS drive control (active-HIGH, inverted polarity vs. other LPC parts) co-located with UART0 TX and external memory address - mandates explicit reset-state pull-down per datasheet.
P2_3GPIO5[3] / I2C1_SDA / U3_TXD / CTIN_1Supports I2C communication, USART3 transmit, and SCTimer capture input - ideal for sensor hub aggregation with hardware timestamping.

Key Features

Feature Design Value
Asymmetric Dual-Core ArchitectureEnables deterministic real-time response (Cortex-M0) alongside complex algorithm execution (Cortex-M4 with FPU), eliminating RTOS scheduling jitter for critical I/O tasks.
State Configurable Timer (SCTimer/PWM)Hardware state machine with 16 states and 16 events per state - replaces software-based PWM generation and supports complex motor commutation patterns without CPU intervention.
Global Input Multiplexer Array (GIMA)Configurable crossbar connecting 32 inputs (ADC, timers, GPIO) to 16 outputs (SCTimer, PWM, DMA triggers) - enables hardware-synchronized sensor-to-actuator pipelines.
IEEE 1588-2008 v2 Ethernet TimestampingHardware timestamp insertion/removal in MAC layer with sub-microsecond accuracy - essential for industrial time-sensitive networking (TSN) and synchronized motion control.
Secure Boot & OTP ConfigurationROM-based boot loader validates signed firmware images; 64-bit + 256-bit OTP stores cryptographic keys and device-specific calibration data - meets IEC 62443-3-3 SL2 requirements.

Applications

Industrial PLC Controller Audio Gateway for Smart Speakers

Use Scenario: Real-time I/O scanning, motion profiling, and EtherCAT master stack execution in compact DIN-rail controllers.

IC Role / Device Role / Timing Role: LPC4350FET180,551 acts as deterministic control core with Ethernet MAC handling fieldbus traffic and SCTimer/PWM generating servo drive signals.

Use Value: Dual-core separation isolates EtherCAT stack (M0) from HMI/application logic (M4), achieving <10 µs cycle jitter while maintaining full USB/SD/MMC host capability.

Use Scenario: Multi-mic array processing, voice assistant protocol bridging (BLE/Wi-Fi → USB Audio Class), and local audio playback in always-on smart speakers.

IC Role / Device Role / Timing Role: LPC4350FET180,551 serves as audio subsystem controller with I2S interfaces driving DAC/ADC, USB0 hosting UAC2 device, and M0 core managing real-time echo cancellation.

Use Value: On-chip 264 kB SRAM eliminates external PSRAM, reducing BOM cost and PCB area; hardware FPU accelerates neural network inference for wake-word detection.

Energy Metering Hub RFID Reader with Edge Analytics

Use Scenario: Polyphase electricity meter with waveform capture, harmonic analysis, and DLMS/COSEM protocol over PRIME/PLC or LTE.

IC Role / Device Role / Timing Role: LPC4350FET180,551 performs simultaneous 10-bit ADC sampling (400 kS/s) across multiple current/voltage channels, with M4 running FFT and M0 handling PLC modem framing.

Use Value: Dedicated ADC trigger routing via GIMA ensures phase-aligned sampling across all channels; RTC alarm timer enables scheduled firmware updates during off-peak hours.

Use Scenario: UHF RFID reader with tag inventory, anti-collision, and lightweight ML-based anomaly detection at warehouse choke points.

IC Role / Device Role / Timing Role: LPC4350FET180,551 integrates ISO18000-6C baseband processing (M0), edge inference (M4+FPU), and USB/Ethernet backhaul - replacing discrete FPGA+MCU solutions.

Use Value: SCTimer/PWM generates precise RF carrier modulation waveforms; 118 GPIOs support parallel antenna switching and sensor fusion (temperature/humidity).

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
LPC4357FET180,551Same dual-core architecture and TFBGA180 package, but includes 1 MB Quad-SPI Flash (SPIFI) integrated on-die - eliminates need for external flash memory.Preferred for standalone firmware storage without external SPI NOR; not suitable when external flash is required for field upgrades or security partitioning.Select LPC4357FET180,551 if boot-from-flash is mandatory and SPIFI bandwidth suffices for application code density.
LPC4370FET256,551Higher pin count (LBGA256), adds LCD RGB interface (24-bit), additional USB1 HS PHY, and 164 GPIO - no change to core architecture or memory size.Required for full-color TFT displays or multi-port USB host systems; incompatible with TFBGA180 footprint and layout.Choose LPC4370FET256,551 only when LCD video output or >118 GPIOs are essential - otherwise, LPC4350FET180,551 offers optimal cost/performance for space-constrained designs.

Compared with LPC4357FET180,551, the LPC4350FET180,551 trades integrated flash for lower unit cost and design flexibility with external memory; versus LPC4370FET256,551, it delivers identical dual-core performance in a smaller, lower-cost package at the expense of display and I/O scalability.

Availability

LPC4350FET180,551 is available at Aetrix Electronics and suitable for industrial automation, energy metering, and embedded audio applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from authorized NXP distribution channels.

Supply support for LPC4350FET180,551 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.

The LPC4300 series was designed specifically for high-integrity embedded applications demanding dual-core determinism, hardware-accelerated peripherals, and robust security - targeting industrial control, metering, and audio gateway use cases.

FAQ

What is the maximum operating frequency of the LPC4350FET180,551 dual-core system?

The LPC4350FET180,551 supports independent operation of both the ARM Cortex-M4 and Cortex-M0 cores at up to 204 MHz. This frequency is achieved using the on-chip CPU PLL with an external 1–25 MHz crystal or the internal 12 MHz IRC oscillator. The actual sustained frequency depends on thermal conditions and power supply stability, but the device is fully characterized to 204 MHz across its specified voltage (2.2–3.6 V) and temperature (-40°C to +85°C) range. The LPC4350FET180,551 datasheet confirms this rating in Section 2.2 "Features and benefits".

Does the LPC4350FET180,551 include on-chip flash memory?

No, the LPC4350FET180,551 is a flashless microcontroller. It contains 264 kB of SRAM and 64 kB of ROM (for boot code and drivers), but no embedded flash memory. Firmware must be loaded externally via SPIFI, USB, Ethernet, or SD/MMC interfaces, or stored in external QSPI/NOR flash. This architecture allows flexible memory mapping and avoids flash wear limitations - a key differentiator from flash-based variants like the LPC4357FET180,551. The LPC4350FET180,551 product brief explicitly states "flashless MCU" in its title.

How many Ethernet MAC interfaces does the LPC4350FET180,551 support?

The LPC4350FET180,551 integrates a single 10/100T Ethernet MAC with support for both RMII and MII physical layer interfaces, plus hardware-accelerated IEEE 1588-2008 v2 timestamping. It does not include multiple independent MACs. The MAC connects directly to the AHB bus and supports DMA for zero-CPU-load packet processing. This single MAC is confirmed in Table 2 ("Ordering options") and Section 2.2 of the LPC4350FET180,551 datasheet, which lists "Ethernet" as a yes/no feature per variant - and "yes" for LPC4350FET180.

What is the GPIO count and pin multiplexing capability of the LPC4350FET180,551?

The LPC4350FET180,551 provides 118 GPIO pins in its TFBGA180 package, organized across 16 ports (P0–P9, PA–PF). Each pin supports up to eight configurable functions - including GPIO, UART, I2C, SPI, USB, Ethernet, ADC, and SCTimer - selected dynamically via the System Configuration Unit (SCU) registers. Pin function assignment is fully software-defined at runtime, enabling flexible board design and firmware reuse across variants. This specification is documented in Section 6.2 "Pin description" of the LPC4350FET180,551 datasheet.

Is the LPC4350FET180,551 pin-compatible with other LPC43x0 family members in TFBGA180?

Yes, the LPC4350FET180,551 shares identical pinout and package dimensions (TFBGA180, SOT570-3) with other TFBGA180 variants in the LPC43x0 family, including LPC4330FET180 and LPC4330FET180. Signal mapping is consistent across these parts, enabling drop-in replacement where functional differences (e.g., LCD presence, USB1 PHY integration) are not required. This mechanical and electrical compatibility is verified in NXP's ordering information tables and pin configuration diagrams (Fig. 3) for LPC4350FET180,551.

LPC4350FET180,551 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
180-TFBGA
Series:
LPC43xx
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Number of I/O:
118
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
264K x 8
Voltage - Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC4350FET180,551 FAQ

1.How can I place an order for LPC4350FET180,551 through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC4350FET180,551 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC4350FET180,551 reliable?

The price and inventory of LPC4350FET180,551 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC4350FET180,551 is usually 5 days.

3.What payment methods are accepted for LPC4350FET180,551?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC4350FET180,551 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC4350FET180,551?

LPC4350FET180,551 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC4350FET180,551 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC4350FET180,551?

For technical support, including LPC4350FET180,551 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC4350FET180,551 requirements.

6.How does Aetrix verify that LPC4350FET180,551 is sourced from the original manufacturer or authorized distributors?

All LPC4350FET180,551 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC4350FET180,551 meets industry standards.

7.What is the process for return or replacement of LPC4350FET180,551?

All LPC4350FET180,551 units undergo pre-shipment inspection (PSI). If there is an issue with LPC4350FET180,551, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC4350FET180,551 part is unused and in its original packaging.

Return procedure for LPC4350FET180,551:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LPC4350FET180,551 Tags

  • LPC4350FET180,551
  • LPC4350FET180,551 PDF
  • LPC4350FET180,551 Datasheet
  • LPC4350FET180,551 Specifications
  • LPC4350FET180,551 Images
  • NXP Semiconductors
  • NXP Semiconductors LPC4350FET180,551
  • Buy LPC4350FET180,551
  • LPC4350FET180,551 Price
  • LPC4350FET180,551 Distributor
  • LPC4350FET180,551 Supplier
  • LPC4350FET180,551 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER