NXP Semiconductors LPC43S67JET100E
- Part No.:
- LPC43S67JET100E
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-TFBGA
- Datasheet:
-
LPC43S67JET100E.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 100TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,824
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LPC43S67JET100E from NXP Semiconductors is a dual-core ARM Cortex-M4/M0 microcontroller for industrial and embedded control applications, featuring 1 MB flash, 154 kB SRAM, dual High-speed USB 2.0 interfaces (one with on-chip HS PHY, one with ULPI), 10/100T Ethernet MAC with IEEE 1588 support, and AES encryption engine. It operates at up to 204 MHz and targets secure, real-time, connectivity-rich systems such as e-metering gateways and industrial IoT edge nodes.
For engineers reviewing the LPC43S67JET100E datasheet, LPC43S67JET100E pinout, LPC43S67JET100E application, or LPC43S67JET100E equivalent, key selection considerations include its TFBGA100 package (9 × 9 mm), absence of integrated LCD controller, 4-channel ADC support (vs. 8 in larger variants), and 49 GPIO pins - critical for space-constrained, cost-optimized designs requiring USB/Ethernet coexistence without display output.
Technical Context
The LPC43S67JET100E integrates an ARM Cortex-M4 core (r0p1) with hardware FPU and MPU, paired with an application-oriented ARM Cortex-M0 coprocessor (r0p0) and a dedicated Cortex-M0 subsystem managing SGPIO/SPI peripherals via a core-to-core bridge. Its memory architecture includes dual-bank 512 kB flash per bank, 16 kB EEPROM, and segmented SRAM blocks - two of which support independent power-down.
Peripherals are distributed across three AHB multilayer matrices: main (Cortex-M4), subsystem (Cortex-M0), and peripheral bridges. The device supports IEEE 1588-2008 v2 time stamping via Ethernet MAC, uses three independent PLLs (CPU, USB, audio), and implements AES decryption/encryption with DMA and ROM-based API access - all validated for boot image security.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual-core: ARM Cortex-M4 @ 204 MHz + ARM Cortex-M0 coprocessor @ 204 MHz - enables real-time task partitioning with shared memory and inter-core messaging. |
| Memory | 1 MB flash (dual-bank, 512 kB each), 154 kB SRAM, 16 kB EEPROM - supports robust firmware updates, data logging, and secure key storage. |
| Connectivity | 10/100T Ethernet MAC with RMII/MII and IEEE 1588 v2 timestamping; two High-speed USB 2.0 interfaces - one with on-chip HS PHY, one with ULPI - enabling simultaneous wired network and host/device connectivity. |
| Analog I/O | Two 10-bit ADCs (400 kSamples/s, 4 channels total), one 10-bit DAC (400 kSamples/s) - sufficient for sensor acquisition and basic waveform generation in metering or motor feedback loops. |
| Security | AES engine with DMA support and ROM-based API; two 256-bit OTP banks for encrypted boot key storage - ensures authenticated, tamper-resistant boot and runtime data protection. |
| Package | TFBGA100 (9 × 9 × 0.7 mm, 100-ball grid) - compact footprint ideal for space-limited industrial modules and smart sensors. |
| GPIO & Peripherals | 49 GPIO pins with configurable pull-up/down; External Memory Controller (EMC); SCTimer/PWM; GIMA crossbar; Quad SPI Flash Interface (SPIFI) - enables flexible peripheral routing and external memory expansion. |
Pinout & Package
Package: TFBGA100 (9 × 9 × 0.7 mm, 100-ball fine-pitch ball grid array). Pin assignments follow NXP's standardized LPC43S6x TFBGA100 layout (SOT926-1), with multiplexed functions per pin including GPIO, Ethernet, USB, SPI, I²C, I²S, ADC, and timer I/O. Ball A1 is index corner; top-side view orientation matches standard BGA conventions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G2 (P0_0) | GPIO / SSP1_MISO / ENET_RXD1 | Primary Ethernet receive data line (RMII/MII); also serves as SPI slave input or general-purpose I/O - requires careful signal integrity routing for 100 Mbps operation. |
| G1 (P0_1) | GPIO / SSP1_MOSI / ENET_TX_EN | Ethernet transmit enable control; also SPI master output - critical for RMII timing compliance and must be driven synchronously with TX clock. |
| H1 (P1_0) | GPIO / EMC_A5 / SSP0_SSEL | External memory address line 5; also slave select for SSP0 - used when expanding with NOR flash or SRAM via EMC interface. |
| K2 (P1_1) | GPIO / CTOUT_7 / EMC_A6 | SCTimer match output 7; also EMC address line 6 - enables synchronized PWM generation or precise timing events tied to external memory addressing. |
| J1 (P1_2) | GPIO / CTOUT_6 / EMC_A7 | SCTimer match output 6; also EMC address line 7 - supports coordinated peripheral triggering during memory-mapped operations. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core asymmetric processing | ARM Cortex-M4 handles application logic and DSP tasks; Cortex-M0 coprocessor offloads peripheral management (SGPIO/SPI), reducing M4 interrupt load and improving real-time determinism. |
| IEEE 1588-2008 v2 support | Hardware timestamping in Ethernet MAC enables sub-microsecond synchronization for industrial automation and precision timing networks without external timestamping ICs. |
| Secure boot with AES | ROM-based AES API and dedicated OTP key storage allow encrypted boot image validation - essential for certified e-metering and payment-terminal applications. |
| Configurable peripheral routing | Global Input Multiplexer Array (GIMA) cross-connects timers, ADCs, and SCTimer inputs/outputs - eliminates fixed signal-path constraints and simplifies PCB layout for custom event-driven architectures. |
| Low-power operation | Four reduced-power modes (Sleep, Deep-sleep, Power-down, Deep power-down) with RTC domain retention and wake-up via battery-backed interrupts - extends battery life in portable or energy-harvested edge devices. |
Applications
| Smart Energy Metering Gateway | Industrial Ethernet I/O Module |
|---|---|
Use Scenario: Aggregating data from multiple utility meters (electricity, gas, water) and transmitting securely over Ethernet or USB to cloud infrastructure. IC Role / Device Role / Timing Role: Main system controller executing secure boot, AES-encrypted data packaging, IEEE 1588-synchronized timestamping, and dual-interface communication stack. Use Value: Eliminates need for external crypto co-processor or timestamping IC; TFBGA100 package enables compact gateway design meeting IEC 62056 and DLMS/COSEM certification requirements. | Use Scenario: Field-deployable remote I/O node collecting analog/digital sensor data and controlling actuators via industrial Ethernet (PROFINET, EtherNet/IP). IC Role / Device Role / Timing Role: Real-time deterministic controller running EtherCAT or TCP/IP stack while managing ADC sampling, PWM outputs, and GPIO-based safety interlocks. Use Value: Dual USB + Ethernet coexistence allows local configuration via USB and network integration without protocol translation; EMC interface supports external FPGA for custom I/O expansion. |
| USB/Ethernet Bridge for Test Equipment | Secure RFID Reader Controller |
Use Scenario: Converting legacy RS-485 or parallel instrument interfaces to modern USB 2.0 High-speed and 100BASE-TX Ethernet connections. IC Role / Device Role / Timing Role: Protocol translation hub with hardware-accelerated USB and Ethernet MACs, managed by Cortex-M4; Cortex-M0 handles low-level packet framing and error recovery. Use Value: Achieves >40 MB/s aggregate throughput (SPIFI + USB + Ethernet); TFBGA100 footprint fits into handheld test adapters with minimal board area. | Use Scenario: Contactless payment terminal or access control reader requiring secure credential handling, ISO14443-A/B support, and tamper detection. IC Role / Device Role / Timing Role: Secure application processor executing EMV-compliant cryptographic operations, managing NFC frontend via SPI/UART, and enforcing secure boot chain. Use Value: On-chip AES engine and OTP key storage meet PCI PTS v6.0 and Common Criteria EAL4+ requirements; 49 GPIO support LED indicators, buzzer, and tamper switches. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core ARM microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC4357JET100E | Same TFBGA100 package; adds LCD controller and 8-channel ADC (vs. 4); retains identical CPU cores, memory, USB/Ethernet, and security features. | Required where embedded GUI or higher-resolution analog sensing is needed; not suitable if LCD is unused and BOM cost must be minimized. | Select LPC4357JET100E only when display output or expanded ADC channel count justifies incremental cost and power consumption. |
| LPC43S57JET100E | Same TFBGA100 package and peripheral set, but lacks AES engine and OTP key storage; otherwise identical flash/SRAM, USB/Ethernet, and dual-core architecture. | Applicable in non-security-critical industrial controls where cryptographic acceleration is unnecessary and cost sensitivity is high. | Choose LPC43S57JET100E for cost-sensitive designs without boot authentication or encrypted data storage requirements. |
Compared with LPC43S57JET100E and LPC4357JET100E, the LPC43S67JET100E uniquely balances security (AES + OTP), compact packaging (TFBGA100), and dual high-speed connectivity - making it optimal for certified metering and secure edge nodes where LCD is omitted and crypto is mandatory.
Availability
LPC43S67JET100E is available at Aetrix Electronics and suitable for smart metering gateways, industrial Ethernet I/O modules, and secure RFID reader controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for LPC43S67JET100E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and trusted execution environments.
The LPC43S6x product line was designed for high-performance, security-critical embedded applications demanding dual-core real-time processing, hardware-accelerated cryptography, and multi-protocol wired connectivity - particularly in utility metering, industrial control, and secure peripherals.
FAQ
What is the maximum operating frequency of the LPC43S67JET100E?
The LPC43S67JET100E operates at a maximum CPU frequency of 204 MHz for both its ARM Cortex-M4 and ARM Cortex-M0 cores. This performance level is achieved using internal PLLs that allow full-speed operation without requiring a high-frequency external crystal oscillator, supporting deterministic real-time response in demanding industrial applications.
Does the LPC43S67JET100E include an LCD controller?
No, the LPC43S67JET100E does not include an LCD controller. As confirmed in Table 2 of the official datasheet, the "LCD" column for LPC43S67JET100 is marked "no", distinguishing it from larger-package variants like LPC43S67JBD208 and LPC43S67JET256. This omission reduces die size and cost while maintaining full USB/Ethernet functionality in the TFBGA100 package.
How many ADC channels does the LPC43S67JET100E support?
The LPC43S67JET100E supports four total ADC input channels - two 10-bit ADCs (ADC0 and ADC1), each with four dedicated input channels. This is explicitly stated in Table 2 ("ADC channels: 4") and aligns with the device's positioning as a compact, cost-optimized variant within the LPC43S6x family, targeting applications where full 8-channel capability is unnecessary.
What security features are integrated into the LPC43S67JET100E?
The LPC43S67JET100E integrates a hardware AES engine with DMA support, programmable via a ROM-based API, and two 256-bit OTP memory banks for encrypted boot key storage - one bank stores an encrypted key used to decode the boot image. These features enable secure boot verification and runtime data encryption, satisfying requirements for certified e-metering and payment-terminal applications.
Which package type is used for the LPC43S67JET100E?
The LPC43S67JET100E uses the TFBGA100 package (SOT926-1): a plastic thin fine-pitch ball grid array with 100 balls, 9 mm × 9 mm body size, and 0.7 mm height. This compact, surface-mount package is optimized for space-constrained industrial modules and supports automated assembly with standard reflow profiles.
LPC43S67JET100E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-TFBGA
- Series:
- LPC43xx
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4/M0
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 204MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 49
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 16K x 8
- RAM Size:
- 154K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.4V ~ 3.6V
- Data Converters:
- A/D 16x10b; D/A 1x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC43S67JET100E FAQ
1.How can I place an order for LPC43S67JET100E through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC43S67JET100E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC43S67JET100E reliable?
The price and inventory of LPC43S67JET100E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC43S67JET100E is usually 5 days.
3.What payment methods are accepted for LPC43S67JET100E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC43S67JET100E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC43S67JET100E?
LPC43S67JET100E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC43S67JET100E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC43S67JET100E?
For technical support, including LPC43S67JET100E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC43S67JET100E requirements.
6.How does Aetrix verify that LPC43S67JET100E is sourced from the original manufacturer or authorized distributors?
All LPC43S67JET100E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC43S67JET100E meets industry standards.
7.What is the process for return or replacement of LPC43S67JET100E?
All LPC43S67JET100E units undergo pre-shipment inspection (PSI). If there is an issue with LPC43S67JET100E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC43S67JET100E part is unused and in its original packaging.
Return procedure for LPC43S67JET100E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LPC43S67JET100E Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

