NXP Semiconductors LPC54113J128BD64QL

Overview

LPC54113J128BD64QL from NXP Semiconductors is a dual-core ARM Cortex-M4/M0+ microcontroller in LQFP64 package, featuring 128 KB flash, 96 KB SRAM (32 KB SRAMX + 64 KB SRAM0), 12-bit 5.0 Msamples/sec ADC with 12 input channels, crystal-less USB 2.0 full-speed device interface, and DMIC subsystem for PDM microphone processing - deployed in industrial sensor hubs and low-power audio edge nodes.

For engineers reviewing the LPC54113J128BD64QL datasheet, LPC54113J128BD64QL pinout, LPC54113J128BD64QL application, or LPC54113J128BD64QL equivalent, key selection criteria include dual-core real-time partitioning capability, USB crystal-less operation for BOM cost reduction, integrated temperature sensor with ADC, Flexcomm configurable serial interfaces, and -40 °C to +105 °C extended temperature rating.

Technical Context

The LPC54113J128BD64QL implements tightly coupled dual ARM cores: Cortex-M4 (150 MHz, FPU, MPU, NVIC) for signal processing and real-time control, and Cortex-M0+ (150 MHz, single-cycle I/O) for low-power peripheral management and offload tasks. Both cores share memory map via multilayer AHB matrix and communicate via mailbox registers.

Its clock system integrates a 12 MHz internal FRO trimmed to ±1 % accuracy, System PLL for CPU scaling, 32.768 kHz RTC oscillator, and watchdog oscillator - enabling precise timing across sleep/deep-sleep modes and supporting wake-up from USB, USART, SPI, or I2C slave activity without external crystals.

Key Specifications

Pinout & Package

LQFP64 package: plastic low profile quad flat package, 64 leads, body size 10 × 10 × 1.4 mm (SOT314-2), lead pitch 0.5 mm, RoHS-compliant, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core ARM microcontroller applications.

Compared with LPC54114J256BD64 and LPC54606J512ET100, the LPC54113J128BD64QL delivers optimal cost-performance balance for compact, battery-aware audio and sensor edge nodes - retaining dual-core flexibility and crystal-less USB while minimizing flash/SRAM overhead.

Availability

LPC54113J128BD64QL is available at Aetrix Electronics and suitable for industrial sensor hubs, smart audio edge nodes, USB-C test fixtures, and low-power RTUs requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for LPC54113J128BD64QL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.

The LPC5411x product line targets resource-constrained, power-sensitive edge applications requiring real-time responsiveness, integrated analog/audio peripherals, and robust security - with LPC54113J128BD64QL optimized for cost-driven dual-core deployments.

FAQ

What is the maximum operating frequency of the LPC54113J128BD64QL's CPU cores?

The LPC54113J128BD64QL features two ARM cores both rated for up to 150 MHz operation: the Cortex-M4 core includes FPU and MPU, while the Cortex-M0+ core provides energy-efficient peripheral management. Both cores derive clock from the same system source and maintain synchronization via the AHB matrix and mailbox registers. This dual-frequency capability is confirmed in Section 2.1 of the Rev. 2.6 datasheet.

Does the LPC54113J128BD64QL support crystal-less USB operation?

Yes, the LPC54113J128BD64QL integrates a USB 2.0 full-speed device controller with on-chip PHY and supports crystal-less operation in device mode using NXP's software library (documented in Technical Note TN00031). This eliminates the need for an external 12 MHz crystal, reducing BOM count and PCB footprint - a verified feature explicitly listed in the General Description and Features sections of the datasheet.

How much SRAM is allocated in the LPC54113J128BD64QL, and how is it distributed?

The LPC54113J128BD64QL contains 96 KB of total SRAM, allocated as 32 KB SRAMX (on I&D buses) and 64 KB SRAM0 (contiguous main SRAM), with no SRAM1 or SRAM2 enabled per Table 2 (Ordering Options). This configuration is distinct from higher-memory variants like LPC54114J256BD64 and is validated in the LPC5411x datasheet Rev. 2.6, page 5.

Which pins on the LPC54113J128BD64QL support analog input for the 12-bit ADC?

The LPC54113J128BD64QL supports ADC input on 12 dedicated pins: PIO0_29 through PIO0_31, PIO1_0 through PIO1_5, and PIO1_12 through PIO1_15 - all marked with "ADC0_x" in Table 4 (Pin Description). Each requires DIGIMODE=0 in its IOCON register to enable analog function, and all connect to the same 12-bit, 5.0 MS/s ADC block as specified in Section 2.7 (Analog Peripherals).

What is the operating temperature range and package type of the LPC54113J128BD64QL?

The LPC54113J128BD64QL is packaged in LQFP64 (SOT314-2) with dimensions 10 × 10 × 1.4 mm and is rated for operation from −40 °C to +105 °C. This extended temperature grade is explicitly stated in Section 2.13 (Operating Temperature Range) and confirmed in Table 1 (Ordering Information) of the Rev. 2.6 datasheet.