Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors LPC54113J256BD64QL

Part No.:
LPC54113J256BD64QL
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixLPC54113J256BD64QL.pdf
Description:
IC MCU 32BIT 256KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,165

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

LPC54113J256BD64QL from NXP Semiconductors is a dual-core ARM Cortex-M4/M0+ microcontroller for embedded edge-sensing and low-power USB-connected applications. It integrates 256 KB flash, 192 KB SRAM (including 32 KB SRAMX), crystal-less USB 2.0 FS device interface, 12-bit 5.0 MS/s ADC with 12 channels, and DMIC subsystem with PDM microphone support - deployed in industrial sensor nodes and audio-enabled IoT endpoints.

For engineers reviewing the LPC54113J256BD64QL datasheet, LPC54113J256BD64QL pinout, LPC54113J256BD64QL application, or LPC54113J256BD64QL equivalent, key selection criteria include dual-core real-time partitioning, USB device boot capability, on-chip temperature sensor integration, and Flexcomm-peripheral reconfigurability across USART/SPI/I2C/I2S.

Technical Context

The LPC54113J256BD64QL implements two independent 32-bit ARM cores: Cortex-M4 (with FPU and MPU) and Cortex-M0+ (code- and tool-compatible), both operating up to 150 MHz from shared clock sources. Its memory subsystem includes 256 KB flash with accelerator and page-erase, plus 192 KB SRAM split as 64 KB SRAM0, 64 KB SRAM1, 32 KB SRAM2, and 32 KB SRAMX - enabling segregated code/data/real-time buffer allocation.

Peripheral architecture centers on eight Flexcomm interfaces (FC0–FC7), each software-configurable as USART, SPI, or I2C; FC6 and FC7 also support I2S. The DMIC subsystem provides dual-channel PDM input with hardware decimation, FIFO buffering, and voice activity detection - directly feeding processed audio to I2S or internal memory via DMA.

Key Specifications

Parameter Value and Actual Design Meaning
Cores Dual ARM: Cortex-M4 @ 150 MHz (FPU + MPU) + Cortex-M0+ @ 150 MHz (single-cycle I/O, same clock domain)
Memory 256 KB on-chip flash (256-byte page erase); 192 KB SRAM (64+64+32+32 KB banks) with AHB-accessible GPIO registers
ADC 12-bit, 5.0 MSamples/sec, 12-channel with dual independent sequences and integrated temperature sensor
USB Full-speed (12 Mbps) device controller with on-chip PHY and crystal-less operation using software library (TN00031)
Flexcomm Interfaces 8 configurable serial peripherals (FC0–FC7); FC6/FC7 add I2S; each includes FIFO and fractional baud-rate generator
DMIC Subsystem Dual-channel PDM input, flexible decimators, 16-entry FIFO, hardware VAD, optional DC locking, I2S streaming output
Timers Five 32-bit general-purpose timers (four with capture/compare/PWM), SCTimer/PWM (10 events/states), RTC (1 s resolution, wake-up from deep power-down), MRT (four fixed-rate interrupts)

Pinout & Package

LQFP64 package: plastic low-profile quad flat package, 64 leads, 10 × 10 × 1.4 mm body, lead pitch 0.5 mm, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
PIO0_0 – PIO0_26
PIO0_29 – PIO1_5
Multi-function GPIO bank 48 total digital I/O pins; each supports up to four digital functions (e.g., FCx_TXD, FCx_SCK) plus analog input (ADC0_0–ADC0_8); configurable pull-up/down, open-drain, input inverter
USB_DP / USB_DM USB 2.0 full-speed differential pair On-chip PHY enables crystal-less USB device operation; no external oscillator required for USB enumeration
SWCLK / SWDIO Serial Wire Debug interface Default post-boot function; enables JTAG/SWD debug access with six breakpoints (M4) and four (M0+); supports Serial Wire Output trace
VDD / VSS / VDDA / VSSA / VREFP / VREFN Power and reference supply terminals Single 1.62–3.6 V supply; separate analog domain (VDDA/VSSA) and precision reference (VREFP/VREFN) for ADC accuracy
RESET Active-low reset input Asynchronous reset with Power-On Reset (POR) and Brown-Out Detect (BOD) thresholds for interrupt and forced reset

Key Features

Feature Design Value
Dual-core deterministic partitioning ARM Cortex-M4 handles signal processing/audio algorithms with FPU; Cortex-M0+ manages USB protocol stack or sensor polling - eliminating RTOS inter-core messaging overhead
Crystal-less USB FS Eliminates external 12 MHz crystal and associated load capacitors; reduces BOM cost and PCB area while maintaining USB device compliance via internal FRO-based timing
Flexcomm peripheral reconfiguration Runtime software-selectable interface type per Flexcomm (USART/SPI/I2C/I2S) enables dynamic peripheral allocation without hardware change - ideal for field-upgradable firmware
DMIC + ADC co-processing PDM microphone data processed by dedicated hardware decimator and FIFO before routing to I2S or memory; offloads CPU and ensures deterministic latency for voice wake-up
Multi-bank SRAM architecture SRAMX (32 KB) accessible only by Cortex-M0+, SRAM0/SRAM1 (64 KB each) shared but AHB-optimized, SRAM2 (32 KB) for DMA buffers - enforces memory isolation and cacheless real-time determinism

Applications

Industrial Sensor Node USB Audio Endpoint

Use Scenario: Battery-powered vibration/temperature monitoring node with local FFT analysis and USB-triggered firmware update.

IC Role / Device Role / Timing Role: LPC54113J256BD64QL serves as main controller: Cortex-M4 runs real-time FFT on ADC samples; Cortex-M0+ handles USB CDC class for host command parsing and flash IAP.

Use Value: Dual-core separation prevents USB interrupt latency from disrupting sensor sampling; crystal-less USB reduces component count in compact enclosure.

Use Scenario: Low-cost USB microphone dongle with PDM MEMS mics, hardware noise suppression, and plug-and-play Windows/macOS compatibility.

IC Role / Device Role / Timing Role: LPC54113J256BD64QL acts as audio SoC: DMIC subsystem digitizes and decimates dual PDM streams; SCTimer synchronizes I2S output; USB FS delivers PCM to host.

Use Value: On-chip DMIC hardware eliminates external DSP; 5.0 MS/s ADC supports ultrasonic sensing alongside audio; ROM-based USB drivers reduce firmware size.

Smart Home Hub Controller Programmable Logic Interface

Use Scenario: Zigbee/Z-Wave hub aggregating sensor data and exposing local web UI via USB-CDC virtual COM port.

IC Role / Device Role / Timing Role: LPC54113J256BD64QL hosts protocol stacks: Cortex-M0+ runs radio MAC layer; Cortex-M4 manages TCP/IP stack, TLS, and USB CDC bridge to host PC.

Use Value: Independent power domains allow Cortex-M0+ to remain active during Cortex-M4 sleep; RTC alarm wakes system for scheduled sensor polling.

Use Scenario: Field-reconfigurable industrial I/O module supporting RS-485, CAN FD, and analog input via software-defined peripheral mapping.

IC Role / Device Role / Timing Role: LPC54113J256BD64QL replaces FPGA logic: Flexcomm interfaces dynamically assigned to UART/RS-485 transceivers; SCTimer generates precise PWM for analog output calibration.

Use Value: No hardware redesign needed for new protocols; 8 Flexcomm units provide headroom for future expansion; 12-bit ADC with 12 channels enables multi-sensor fusion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
LPC54114J256BD64 Includes second Cortex-M0+ core enabled (LPC54113 has single M0+); adds extra 32 KB SRAM (SRAMX) and additional GPIOs Required when dual M0+ instances are needed for parallel peripheral management (e.g., simultaneous USB + radio stacks) Select LPC54114J256BD64 only if application requires two independent M0+ coprocessors; otherwise LPC54113J256BD64QL offers identical dual-core M4/M0+ performance at lower cost
LPC55S16JBD64 Higher-performance Cortex-M33 (150 MHz), TrustZone security, 256 KB flash, 192 KB SRAM, but no crystal-less USB or DMIC subsystem Suitable for secure boot and encrypted communication use cases; lacks integrated PDM audio front-end Choose LPC55S16JBD64 when hardware security (TrustZone, AES engine) is mandatory; retain LPC54113J256BD64QL for cost-sensitive audio/sensor edge nodes requiring crystal-less USB and DMIC

Compared with LPC54114J256BD64, the LPC54113J256BD64QL reduces SRAMX usage and disables secondary M0+ - lowering power and cost for single-coprocessor workloads. Against LPC55S16JBD64, it trades security extensions for integrated audio peripherals and USB crystal-less operation - optimizing for audio- and sensor-centric designs.

Availability

LPC54113J256BD64QL is available at Aetrix Electronics and suitable for industrial sensor nodes, USB audio endpoints, smart home hubs, and programmable logic interfaces requiring stable component supply across production lifecycles.

Supply support for LPC54113J256BD64QL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 50 years of embedded systems expertise.

The LPC5411x series targets resource-constrained edge devices needing dual-core real-time responsiveness, integrated analog/audio interfaces, and robust USB connectivity - designed specifically for intelligent sensors and audio-aware embedded endpoints.

FAQ

What is the maximum operating frequency of the LPC54113J256BD64QL cores?

The LPC54113J256BD64QL features two ARM cores both rated for up to 150 MHz operation: the Cortex-M4 core includes a hardware floating-point unit and memory protection unit, while the Cortex-M0+ coprocessor shares the same clock source and delivers energy-efficient execution with single-cycle I/O. Both cores maintain deterministic timing at this frequency under specified voltage (1.62–3.6 V) and temperature (−40 °C to +105 °C) conditions.

Does the LPC54113J256BD64QL support crystal-less USB operation?

Yes, the LPC54113J256BD64QL supports crystal-less USB 2.0 full-speed device operation using its internal 48/96 MHz Free Running Oscillator (FRO) and software timing compensation library (Technical Note TN00031). This eliminates the need for an external 12 MHz crystal and associated load capacitors, reducing bill-of-materials cost and PCB footprint while maintaining USB device compliance.

How many ADC channels does the LPC54113J256BD64QL support, and what is its sampling rate?

The LPC54113J256BD64QL integrates a 12-bit successive-approximation ADC with 12 input channels (ADC0_0 through ADC0_11), capable of sampling at up to 5.0 million samples per second. It supports two independent conversion sequences with multiple trigger sources (timer, DMA, software), and includes an integrated temperature sensor connected directly to the ADC input path.

What package type is used for the LPC54113J256BD64QL?

The LPC54113J256BD64QL is supplied in the LQFP64 package: a plastic low-profile quad flat package with 64 leads, 10 mm × 10 mm body size, 1.4 mm height, and 0.5 mm lead pitch. This package is RoHS-compliant and optimized for automated assembly and thermal dissipation in industrial and consumer applications.

Can the LPC54113J256BD64QL boot from USB?

Yes, the LPC54113J256BD64QL supports USB-based booting via its ROM-resident USB device stack (HID, CDC, MSC, DFU classes). When configured in USB DFU mode, the device enumerates as a USB device allowing in-system programming of flash memory directly over USB - enabling field firmware updates without external debug hardware or bootloader development.

LPC54113J256BD64QL Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-LQFP
Series:
LPC54100
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
192K x 8
Voltage - Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC54113J256BD64QL FAQ

1.How can I place an order for LPC54113J256BD64QL through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC54113J256BD64QL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC54113J256BD64QL reliable?

The price and inventory of LPC54113J256BD64QL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC54113J256BD64QL is usually 5 days.

3.What payment methods are accepted for LPC54113J256BD64QL?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC54113J256BD64QL transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC54113J256BD64QL?

LPC54113J256BD64QL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC54113J256BD64QL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC54113J256BD64QL?

For technical support, including LPC54113J256BD64QL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC54113J256BD64QL requirements.

6.How does Aetrix verify that LPC54113J256BD64QL is sourced from the original manufacturer or authorized distributors?

All LPC54113J256BD64QL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC54113J256BD64QL meets industry standards.

7.What is the process for return or replacement of LPC54113J256BD64QL?

All LPC54113J256BD64QL units undergo pre-shipment inspection (PSI). If there is an issue with LPC54113J256BD64QL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC54113J256BD64QL part is unused and in its original packaging.

Return procedure for LPC54113J256BD64QL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LPC54113J256BD64QL Tags

  • LPC54113J256BD64QL
  • LPC54113J256BD64QL PDF
  • LPC54113J256BD64QL Datasheet
  • LPC54113J256BD64QL Specifications
  • LPC54113J256BD64QL Images
  • NXP Semiconductors
  • NXP Semiconductors LPC54113J256BD64QL
  • Buy LPC54113J256BD64QL
  • LPC54113J256BD64QL Price
  • LPC54113J256BD64QL Distributor
  • LPC54113J256BD64QL Supplier
  • LPC54113J256BD64QL Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER