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NXP Semiconductors LPC54114J256BD64QL
- Part No.:
- LPC54114J256BD64QL
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
LPC54114J256BD64QL.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,655
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Product details
Overview
LPC54114J256BD64QL from NXP Semiconductors is a dual-core ARM Cortex-M4/M0+ microcontroller for embedded edge-sensing and low-power USB-connected applications. It integrates 256 KB flash, 192 KB SRAM (including 32 KB on I&D buses), crystal-less USB 2.0 full-speed device interface, 12-bit 5.0 Msamples/sec ADC with 12 channels, and DMIC subsystem with dual PDM microphone support - deployed in industrial sensor hubs and voice-enabled IoT endpoints.
For engineers reviewing the LPC54114J256BD64QL datasheet, LPC54114J256BD64QL pinout, LPC54114J256BD64QL application, or LPC54114J256BD64QL equivalent, key selection criteria include dual-core real-time partitioning, crystal-less USB device compliance, PDM microphone interface capability, and LQFP64 package compatibility with legacy LPC541xx layouts.
Technical Context
The LPC54114J256BD64QL implements tightly coupled dual ARM cores: Cortex-M4 (150 MHz, FPU, MPU, NVIC) and Cortex-M0+ (150 MHz, single-cycle I/O, shared clock domain), enabling asymmetric task distribution - e.g., M4 handles signal processing and USB protocol stack while M0+ manages sensor polling and low-power state transitions. Both cores access unified memory via multilayer AHB matrix and share peripherals including DMA controller (20 channels), SCTimer/PWM, and Flexcomm interfaces.
Its eight Flexcomm peripherals each support software-selectable USART/SPI/I2C modes; FC6 and FC7 add I2S functionality. The DMIC subsystem includes dual-channel PDM decimation, hardware voice activity detection, and FIFO-based streaming to I2S - all operating independently of CPU load. Clocking relies on 12 MHz FRO (±1% over voltage/temperature), system PLL, and 32.768 kHz RTC oscillator.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Cores | Dual ARM: Cortex-M4 @ 150 MHz (FPU + MPU) + Cortex-M0+ @ 150 MHz (code/tool compatible) |
| Memory | 256 KB on-chip flash (256-byte page erase); 192 KB SRAM (160 KB contiguous main + 32 KB I&D bus SRAMX) |
| USB Interface | Full-speed (12 Mbps) device controller with on-chip PHY and crystal-less operation using software library |
| ADC | 12-bit, 12-channel, up to 5.0 MSamples/sec with dual independent conversion sequences |
| DMIC Subsystem | Dual PDM input, flexible decimators, 16-entry FIFOs, hardware VAD, optional DC locking, I2S output streaming |
| Package | LQFP64 (10 × 10 × 1.4 mm), lead-free, RoHS-compliant, -40 °C to +105 °C operating range |
| Power Supply | Single 1.62 V to 3.6 V supply; programmable PMU supports sleep/deep-sleep/deep power-down modes |
Pinout & Package
LQFP64 package: plastic low-profile quad flat package, 64 leads, body size 10 × 10 × 1.4 mm, thermal pad exposed on underside (not electrically connected), compliant with JEDEC MO-210AB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0 to PIO0_26, PIO1_0 to PIO1_15 | Configurable GPIO bank | 48 total GPIO pins with pull-up/down, open-drain, input inverter; most support pin interrupts (PINT) or grouped logic (GINT) |
| USB_DP / USB_DM | USB 2.0 full-speed differential pair | Direct connection to USB host without external PHY; supports crystal-less mode via internal timing recovery |
| SWCLK / SWDIO | ARM Serial Wire Debug interface | Primary debug interface (default after boot); supports breakpoints, watchpoints, and SWO trace output |
| RESET | Active-low reset input | Asynchronous reset with Power-On Reset (POR) and Brown-Out Detect (BOD) integration |
| VDD / VSS / VDDA / VSSA / VREFP / VREFN | Power and reference rails | Digital (1.62–3.6 V), analog (separate VDDA/VSSA), and ADC reference (VREFP/VREFN) domains enable noise-isolated precision sampling |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core asymmetric processing | Enables real-time separation: M4 runs USB stack + DSP algorithms; M0+ handles sensor I/O and low-power scheduling - no inter-core contention |
| Crystal-less USB device | Eliminates external 12 MHz crystal and associated capacitors, reducing BOM cost and PCB area while maintaining USB compliance via FRO-based timing recovery |
| Flexcomm serial interfaces | Eight software-configurable peripherals (FC0–FC7), each supporting USART/SPI/I2C; FC6/FC7 add I2S - simplifies peripheral reuse across designs |
| DMIC subsystem with hardware VAD | Offloads PDM microphone preprocessing (decimation, filtering, voice activity detection) from CPU, enabling ultra-low-power always-on listening |
| SCTimer/PWM with routing flexibility | State-configurable timer with 8 inputs/8 outputs, internal peripheral routing, and 10-event/state machine - replaces discrete logic in motor control and lighting |
| 12-bit 5.0 MS/s ADC with dual sequences | Supports simultaneous high-speed acquisition (e.g., vibration + temperature) and background calibration without CPU intervention |
Applications
| Industrial Sensor Hub | Voice-Enabled Edge Node |
|---|---|
Use Scenario: Multi-sensor data aggregation (vibration, temperature, humidity) in predictive maintenance gateways with local FFT analysis and threshold-triggered alerts. IC Role / Device Role / Timing Role: Dual-core orchestrator: M4 executes real-time signal processing; M0+ polls sensors and manages SPI/I2C peripherals at precise intervals. Use Value: 5.0 MS/s ADC enables high-fidelity vibration sampling; crystal-less USB allows direct firmware updates over USB without external clock components. | Use Scenario: Battery-powered smart speaker node performing wake-word detection and audio streaming to cloud via USB or UART-to-bridge. IC Role / Device Role / Timing Role: Audio subsystem controller: DMIC subsystem captures and pre-processes dual-mic PDM streams; M0+ handles low-power wake-word inference; M4 manages USB audio class (UAC) streaming. Use Value: Hardware VAD reduces average current draw during idle; integrated 12-bit ADC supports analog sensor fusion (e.g., ambient light + mic bias). |
| USB Human Interface Device | Low-Power Industrial Controller |
Use Scenario: Programmable HID device (e.g., custom keyboard/mouse with macro keys and RGB lighting) requiring plug-and-play USB enumeration and fast response latency. IC Role / Device Role / Timing Role: USB device controller with HID class stack execution on M4 core; GPIO matrix scanned by M0+ for key debouncing and LED PWM control. Use Value: Crystal-less USB ensures reliable enumeration across host platforms; SCTimer/PWM drives precise RGB LED timing without CPU overhead. | Use Scenario: DIN-rail mounted PLC I/O module monitoring 16 digital inputs and controlling 8 relay outputs with Modbus RTU over RS-485. IC Role / Device Role / Timing Role: Real-time I/O coordinator: M0+ handles deterministic GPIO scanning and RS-485 UART framing; M4 runs Modbus RTU stack and diagnostics. Use Value: 48 GPIO pins with configurable pull/resistors simplify direct connection to industrial sensors; wide temperature range (-40°C to +105°C) ensures field reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC54113J256BD64 | Single Cortex-M4 core (no M0+ coprocessor); identical flash/SRAM/USB/ADC/DMIC peripherals and LQFP64 package | Lacks hardware partitioning for concurrent real-time + low-power tasks; requires software-based task scheduling on single core | Select when dual-core complexity is unnecessary and cost reduction is prioritized over asymmetric workload isolation |
| LPC55S16JBD64 | ARM Cortex-M33 core (with TrustZone), 256 KB flash, 192 KB SRAM, same LQFP64 package, but no DMIC subsystem or crystal-less USB | Targets secure firmware update and trusted execution; lacks PDM microphone interface and hardware VAD required for voice edge nodes | Select when security isolation (TrustZone) is critical and voice capture is handled externally or omitted |
Compared with LPC54113J256BD64, the LPC54114J256BD64QL adds true hardware-isolated dual-core execution for deterministic real-time + low-power coexistence; compared with LPC55S16JBD64, it retains crystal-less USB and integrated DMIC - making it uniquely suited for cost-sensitive, voice-first edge devices without external audio ICs.
Availability
LPC54114J256BD64QL is available at Aetrix Electronics and suitable for industrial sensor hubs, voice-enabled edge nodes, USB HID devices, and low-power industrial controllers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for LPC54114J256BD64QL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.
The LPC5411x product line targets resource-constrained, battery-aware embedded systems requiring dual-core flexibility, crystal-less USB, and integrated analog/digital audio front-ends - optimized for voice, sensing, and human interface applications.
FAQ
What is the maximum operating frequency of the LPC54114J256BD64QL dual-core system?
The LPC54114J256BD64QL supports both ARM Cortex-M4 and Cortex-M0+ cores running concurrently at up to 150 MHz. This frequency is achieved using the internal 12 MHz Free Running Oscillator (FRO) with system PLL multiplication, eliminating need for external high-frequency crystals while maintaining ±1% accuracy across voltage and temperature.
Does the LPC54114J256BD64QL support crystal-less USB operation, and what does that mean for board design?
Yes, the LPC54114J256BD64QL supports crystal-less USB 2.0 full-speed device operation using its internal FRO and software timing recovery library (TN00031). This eliminates the external 12 MHz crystal and load capacitors, reducing BOM count, PCB area, and layout sensitivity - critical for compact, cost-sensitive USB-peripheral designs.
How many ADC channels and what sampling rate does the LPC54114J256BD64QL provide?
The LPC54114J256BD64QL integrates a 12-bit successive-approximation ADC with 12 input channels and supports sampling rates up to 5.0 million samples per second. It features two independent conversion sequences, enabling simultaneous high-speed acquisition (e.g., vibration + temperature) with hardware-triggered start and DMA-driven data transfer - all without CPU intervention.
What is the role of the DMIC subsystem in the LPC54114J256BD64QL, and which interfaces does it support?
The DMIC subsystem in the LPC54114J256BD64QL provides hardware-accelerated digital microphone interface handling, including dual-channel PDM input, flexible decimation filters, 16-entry FIFOs, optional DC locking, and hardware voice activity detection (VAD). It can stream processed audio directly to I2S (via FC6/FC7) or route to internal memory - offloading CPU and enabling ultra-low-power always-on listening.
Which package type and pin count does the LPC54114J256BD64QL use, and what are its thermal characteristics?
The LPC54114J256BD64QL uses an LQFP64 package (10 × 10 × 1.4 mm, SOT314-2), with exposed thermal pad for enhanced heat dissipation. It operates across -40 °C to +105 °C ambient temperature, qualified for industrial environments, and supports solder reflow per JEDEC J-STD-020D.3 with peak temperature ≤260 °C.
LPC54114J256BD64QL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- LPC54100
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4/M0+
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz
- Connectivity:
- I2C, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 50
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.62V ~ 3.6V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC54114J256BD64QL FAQ
1.How can I place an order for LPC54114J256BD64QL through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC54114J256BD64QL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC54114J256BD64QL reliable?
The price and inventory of LPC54114J256BD64QL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC54114J256BD64QL is usually 5 days.
3.What payment methods are accepted for LPC54114J256BD64QL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC54114J256BD64QL transactions.
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LPC54114J256BD64QL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC54114J256BD64QL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC54114J256BD64QL?
For technical support, including LPC54114J256BD64QL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC54114J256BD64QL requirements.
6.How does Aetrix verify that LPC54114J256BD64QL is sourced from the original manufacturer or authorized distributors?
All LPC54114J256BD64QL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC54114J256BD64QL meets industry standards.
7.What is the process for return or replacement of LPC54114J256BD64QL?
All LPC54114J256BD64QL units undergo pre-shipment inspection (PSI). If there is an issue with LPC54114J256BD64QL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC54114J256BD64QL part is unused and in its original packaging.
Return procedure for LPC54114J256BD64QL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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