NXP Semiconductors LPC54114J256UK49Z
- Part No.:
- LPC54114J256UK49Z
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 49-UFBGA, WLCSP
- Datasheet:
-
LPC54114J256UK49Z.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 49WLCSP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LPC54114J256UK49Z from NXP Semiconductors is a dual-core ARM Cortex-M4/M0+ microcontroller with 256 KB flash, 192 KB SRAM, crystal-less USB 2.0 full-speed device interface, integrated DMIC subsystem for PDM microphone processing, and a 12-bit 5.0 Msamples/sec ADC. It operates across −40 °C to +105 °C and targets low-power audio edge nodes, industrial sensor hubs, and USB-connected embedded control systems.
For engineers reviewing the LPC54114J256UK49Z datasheet, LPC54114J256UK49Z pinout, LPC54114J256UK49Z application, or LPC54114J256UK49Z equivalent, key selection criteria include dual-core real-time partitioning, crystal-less USB device readiness, on-chip DMIC decimation and voice activity detection, and WLCSP49 package suitability for space-constrained PCB layouts.
Technical Context
The LPC54114J256UK49Z integrates two independent 32-bit ARM cores: the Cortex-M4 (with FPU and MPU) and Cortex-M0+ (code- and tool-compatible), both running up to 150 MHz from a shared clock source. Core isolation enables asymmetric task distribution-e.g., M4 handles signal processing and USB protocol stack while M0+ manages peripheral I/O and low-power state coordination.
Its Flexcomm Interface architecture provides eight software-configurable serial peripherals (USART/SPI/I2C), with two supporting I2S and PDM data streaming directly to the DMIC subsystem. The 24-pin WLCSP49 package maps all core functions-including USB_DP/DM, PDM0_CLK/DATA, ADC0_0–ADC0_11, and SWDIO/SWCLK-to a 3.436 × 3.436 mm footprint with 49 bumps.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Cores | Dual ARM Cortex-M4 (150 MHz, FPU, MPU) + Cortex-M0+ (150 MHz, single-cycle I/O) |
| Memory | 256 KB on-chip flash (256-byte page erase); 192 KB SRAM (160 KB main + 32 KB I&D bus SRAM) |
| USB Interface | Full-speed (12 Mbps) device controller with on-chip PHY and crystal-less operation via software library |
| ADC | 12-bit, 12-channel, up to 5.0 MSamples/sec with dual independent conversion sequences |
| DMIC Subsystem | Dual-channel PDM input with hardware decimation, 16-entry FIFO, DC locking, and voice activity detection |
| Operating Range | −40 °C to +105 °C; single 1.62 V–3.6 V supply; supports deep power-down with RTC wake-up |
| Package | WLCSP49 (7 × 7 bumps; 3.436 × 3.436 × 0.525 mm; ball pitch 0.4 mm) |
Pinout & Package
Package: Wafer-level chip-scale package (WLCSP49), 7 × 7 bump array, 0.4 mm pitch, 3.436 × 3.436 × 0.525 mm body height. Bump A1 is pin #1 index area.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_29 / ADC0_0 | Analog input / GPIO | Primary ADC channel 0 input; configurable as digital I/O or PDM interface function |
| PIO0_31 / ADC0_2 | Analog input / PDM clock | ADC channel 2 input; also serves as PDM0_CLK for digital microphone clocking |
| PIO1_0 / ADC0_3 | Analog input / PDM data | ADC channel 3 input; also functions as PDM0_DATA for digital microphone data capture |
| USB_DP / USB_DM | USB differential pair | Full-speed USB 2.0 physical layer interface; supports crystal-less operation in device mode |
| SWDIO / SWCLK | JTAG/SWD debug interface | Serial Wire Debug I/O and clock; default post-boot function for programming and real-time debugging |
| VDD / VSS / VDDA / VSSA | Power domains | VDD/VSS: digital core supply; VDDA/VSSA: analog domain supply for ADC and DMIC subsystem |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core asymmetric processing | Enables real-time separation of compute-intensive tasks (M4) and deterministic I/O management (M0+), reducing software complexity and latency in mixed-workload applications |
| Crystal-less USB FS device | Eliminates external 12 MHz crystal and associated load capacitors, lowering BOM cost and board area in USB-peripheral designs |
| Integrated DMIC subsystem | Hardware-accelerated PDM-to-PCM conversion with voice activity detection and FIFO buffering reduces CPU loading by >70% vs. software-based decimation |
| Flexcomm serial interfaces | Eight software-reconfigurable USART/SPI/I2C peripherals (two with I2S) allow dynamic interface allocation without hardware changes or pin remapping |
| 12-bit 5.0 MS/s ADC | Supports high-fidelity sensor sampling (e.g., vibration, acoustic emission) with dual sequence triggering for synchronized multi-sensor acquisition |
| Low-power operation | Deep power-down mode with RTC wake-up and Micro-Tick Timer support enables <2 µA sleep current for battery-powered edge nodes |
Applications
| Smart Audio Endpoint | Industrial Sensor Hub |
|---|---|
|
Use Scenario: Compact voice-controlled IoT node with dual digital microphones and USB-C connectivity for firmware updates and audio streaming. IC Role / Device Role / Timing Role: LPC54114J256UK49Z acts as primary audio processor: DMIC subsystem captures and decimates PDM streams; M4 runs AEC/NS algorithms; M0+ handles USB CDC ACM and GPIO monitoring. Use Value: Crystal-less USB eliminates timing component count; WLCSP49 enables sub-100 mm² PCB area; integrated temperature sensor enables thermal compensation of microphone gain. |
Use Scenario: DIN-rail mounted condition monitoring unit acquiring vibration, temperature, and humidity data from multiple sensors, transmitting via USB to gateway. IC Role / Device Role / Timing Role: LPC54114J256UK49Z serves as sensor fusion controller: ADC samples analog sensors at 5 MS/s; SCTimer/PWM generates precise PWM excitation for RTD measurement; RTC triggers periodic wake-up for data logging. Use Value: Dual-core partitioning isolates time-critical sensor acquisition (M4) from USB communication stack (M0+), guaranteeing <10 µs jitter on analog sample triggers. |
| USB Human Interface Device | Low-Power Edge AI Node |
|
Use Scenario: Secure, tamper-resistant USB HID device (e.g., biometric reader) requiring secure boot, encrypted firmware updates, and low-latency button/key reporting. IC Role / Device Role / Timing Role: LPC54114J256UK49Z implements secure boot from flash, ROM-based USB HID class driver, and GPIO-interrupt-driven key scanning with wake-from-deep-sleep capability. Use Value: On-chip ROM USB drivers reduce flash usage by 8 KB; 128-bit unique serial number enables per-device cryptographic key binding; WWDT ensures fail-safe reset during firmware update. |
Use Scenario: Battery-powered predictive maintenance node performing lightweight neural inference on accelerometer data before transmitting alerts over USB. IC Role / Device Role / Timing Role: LPC54114J256UK49Z executes quantized CNN inference on M4 FPU; M0+ manages ultra-low-power sensor polling and USB suspend/resume negotiation. Use Value: 192 KB SRAM enables on-chip inference buffer storage; 256 KB flash accommodates model weights and runtime interpreter; DMIC subsystem pre-processes audio features for hybrid audio/vibration analysis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC54114J256BD64 | LQFP64 package (10 × 10 mm), 48 GPIOs vs. 37 in WLCSP49; identical core, memory, and peripheral specs | Better suited for prototyping, manual soldering, or designs requiring higher GPIO count and thermal dissipation | Select when board space allows larger footprint and hand-soldering or test probe access is needed |
| LPC54606J512ET180 | Higher flash (512 KB), larger SRAM (360 KB), 180 MHz max CPU speed, LQFP100 package; adds Ethernet MAC and SDIO | Targeted at more complex networking or multimedia applications where USB-only connectivity is insufficient | Choose only if additional memory, speed, or Ethernet/SDIO interfaces are required-adds cost and size overhead |
Compared with LPC54114J256BD64 and LPC54606J512ET180, the LPC54114J256UK49Z delivers optimal density and power efficiency for miniaturized USB/audio edge devices, trading package accessibility and peripheral expansion for minimal footprint and crystal-less USB integration.
Availability
LPC54114J256UK49Z is available at Aetrix Electronics and suitable for smart audio endpoints, industrial sensor hubs, and USB human interface devices requiring stable component supply, long-term lifecycle assurance, and wafer-level packaging for compact designs.
Supply support for LPC54114J256UK49Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.
The LPC5411x family was designed for resource-constrained, USB-connected intelligent edge devices requiring dual-core real-time processing, ultra-low-power operation, and integrated audio subsystems-targeting audio, sensing, and human interface applications.
FAQ
What is the maximum operating frequency of the LPC54114J256UK49Z cores?
The LPC54114J256UK49Z supports both the ARM Cortex-M4 and Cortex-M0+ cores at up to 150 MHz. This maximum frequency is achievable using the system PLL driven by the internal 12 MHz FRO oscillator, an external clock input up to 25 MHz, or the 32.768 kHz RTC oscillator. The cores share the same clock source and operate synchronously.
Does the LPC54114J256UK49Z support crystal-less USB operation?
Yes, the LPC54114J256UK49Z includes a full-speed USB 2.0 device controller with on-chip PHY and dedicated DMA that supports crystal-less operation in device mode. This functionality relies on NXP's software library (documented in Technical Note TN00031) and eliminates the need for an external 12 MHz crystal and associated load capacitors.
How many ADC channels does the LPC54114J256UK49Z have, and what is its maximum sampling rate?
The LPC54114J256UK49Z integrates a 12-bit successive approximation ADC with 12 input channels and supports sampling rates up to 5.0 million samples per second. It provides two independent conversion sequences with flexible trigger sources-including timers, DMA requests, and external pins-for synchronized multi-sensor acquisition.
What package type is used for the LPC54114J256UK49Z, and how many I/O pins are available?
The LPC54114J256UK49Z uses a WLCSP49 package (wafer-level chip-scale package with 49 bumps in a 7 × 7 array). It provides 37 usable GPIO pins, including dedicated ADC inputs, PDM interface signals, USB_DP/DM, and SWD debug pins-all mapped within the 3.436 × 3.436 mm footprint.
Can the LPC54114J256UK49Z boot from sources other than internal flash?
Yes, the LPC54114J256UK49Z supports multiple boot sources: valid user code in internal flash, UART (USART), SPI, and I2C interfaces. Boot mode selection is determined at reset by the state of specific pins (e.g., PIO0_4, PIO0_31, PIO1_6) and supports legacy, single-image, and dual-image configurations via ROM API.
LPC54114J256UK49Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 49-UFBGA, WLCSP
- Series:
- LPC54100
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4/M0+
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 100MHz
- Connectivity:
- I2C, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.62V ~ 3.6V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC54114J256UK49Z FAQ
1.How can I place an order for LPC54114J256UK49Z through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC54114J256UK49Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of LPC54114J256UK49Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC54114J256UK49Z is usually 5 days.
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For technical support, including LPC54114J256UK49Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC54114J256UK49Z requirements.
6.How does Aetrix verify that LPC54114J256UK49Z is sourced from the original manufacturer or authorized distributors?
All LPC54114J256UK49Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC54114J256UK49Z meets industry standards.
7.What is the process for return or replacement of LPC54114J256UK49Z?
All LPC54114J256UK49Z units undergo pre-shipment inspection (PSI). If there is an issue with LPC54114J256UK49Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC54114J256UK49Z part is unused and in its original packaging.
Return procedure for LPC54114J256UK49Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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