My Inquiry
My Account
NXP Semiconductors LPC54606J256ET180E
- Part No.:
- LPC54606J256ET180E
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 180-TFBGA
- Datasheet:
-
LPC54606J256ET180E.pdf
- Description:
- IC MCU 32BIT 256KB FLSH 180TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,791
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LPC54606J256ET180E from NXP Semiconductors is a 32-bit ARM Cortex-M4 microcontroller with FPU and MPU, operating at up to 180 MHz, featuring 256 KB flash, 136 KB SRAM, dual USB (HS/FS), Ethernet AVB, two CAN 2.0 controllers, and a 12-bit 5.0 MS/s ADC - deployed in industrial gateways requiring real-time protocol bridging and secure fieldbus connectivity.
For engineers reviewing the LPC54606J256ET180E datasheet, LPC54606J256ET180E pinout, LPC54606J256ET180E application, or LPC54606J256ET180E equivalent, key selection criteria include TFBGA180 package compatibility, Ethernet AVB + dual CAN 2.0 coexistence, 180 MHz deterministic execution, and boot-source configurability via PIO0_4/5/6.
Technical Context
The LPC54606J256ET180E implements an ARM Cortex-M4 core (r0p1) with hardware FPU, MPU, and NVIC, executing at 180 MHz using a 3-stage Harvard pipeline with speculative branching and prefetch unit. Its clock system integrates a 12 MHz ±1% FRO, system PLL, and dedicated USB/audio PLLs.
Digital subsystems include a 30-channel general-purpose DMA controller, SCTimer/PWM with 10 match/capture events and flexible peripheral routing, and ten Flexcomm interfaces configurable as USART/SPI/I2C/I2S - two of which support I2S for audio preprocessing. The device supports legacy, single, and dual-image boot modes with ROM-based USB drivers (CDC/HID/MSC/DFU).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4 (r0p1) with FPU and MPU - enables floating-point math acceleration and memory protection for safety-critical firmware. |
| Max Clock Frequency | 180 MHz - delivers deterministic real-time response for industrial control loops and protocol stack processing. |
| Memory | 256 KB flash / 136 KB SRAM / 16 KB EEPROM - supports robust firmware storage, dual-bank OTA updates, and persistent configuration data. |
| USB Interfaces | High-speed (480 Mbps) and full-speed (12 Mbps) host/device controllers with on-chip PHY - eliminates external transceivers and reduces BOM cost. |
| Ethernet & CAN | Ethernet MAC with MII/RMII and AVB support + two CAN 2.0 controllers - enables time-synchronized industrial networking and legacy fieldbus integration. |
| Analog Peripherals | 12-bit 5.0 MS/s ADC with 12 channels and dual conversion sequences - suitable for high-fidelity sensor acquisition in motor control and power monitoring. |
| Package | TFBGA180 (12 × 12 × 0.8 mm) - provides high I/O density (145 GPIOs) and thermal performance for compact industrial PCB layouts. |
Pinout & Package
Package: TFBGA180 (SOT570-3), 12 mm × 12 mm × 0.8 mm body, 180-ball array with 0.8 mm pitch. Ball A1 index located at top-left corner per JEDEC MO-275.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0 | GPIO / Flexcomm 3 SPI SCK / CAN1_RD | Multi-function digital I/O supporting debug, communication, and bus interface roles - default reset state is pull-up I/O. |
| PIO0_5 / TDI | JTAG Test Data In / CAN0_TD | Boundary scan input and CAN transmitter output - used for production test and fieldbus transmission. |
| ENET_MDC / ENET_MDIO | Ethernet Management Clock / Data I/O | IEEE 802.3-compliant MDIO interface for PHY register access - required for Ethernet AVB initialization and link management. |
| USB_DP / USB_DM | USB 2.0 High-Speed Differential Pair | Integrated HS PHY pins - require 90 Ω differential impedance routing and series 22–33 Ω termination near the MCU. |
| VDDA / VSSA | Analog Power / Ground | Separate 3.3 V analog supply domain - must be filtered with ≥10 µF ceramic + 100 nF bypass capacitors to ensure ADC accuracy. |
Key Features
| Feature | Design Value |
|---|---|
| Floating-Point Unit (FPU) | Hardware-accelerated IEEE 754 single-precision math - reduces DSP loop latency by >8× vs software emulation. |
| Flexcomm Interface | 10 software-configurable serial peripherals (USART/SPI/I2C/I2S) with shared fractional baud-rate generator - eliminates need for discrete level shifters or protocol converters. |
| Secure Boot & eCRP | Enhanced Code Read Protection with OTP-backed settings - prevents unauthorized firmware extraction and enforces signed image validation. |
| Micro-tick Timer | Ultra-low-power timer running from Watchdog Oscillator (6 kHz–1.5 MHz) - enables wake-up from deep power-down in <10 µs for event-driven sensing. |
| EMC Interface | External Memory Controller supporting SDRAM (100 MHz clock) and static RAM/ROM - allows expansion of code/data space beyond on-chip limits for complex HMI or logging applications. |
Applications
| Industrial Ethernet Gateway | Smart Energy Metering Hub |
|---|---|
Use Scenario: Protocol translation between Modbus TCP, CANopen, and EtherCAT in factory automation edge nodes. IC Role / Device Role / Timing Role: Central real-time controller managing dual CAN 2.0 buses, Ethernet AVB traffic scheduling, and deterministic USB CDC virtual COM ports. Use Value: 180 MHz CPU + dual CAN + Ethernet AVB enables concurrent protocol stacks without external ASICs or FPGA offload. | Use Scenario: Multi-tariff electricity meter with waveform capture, tamper detection, and remote firmware update over cellular backhaul. IC Role / Device Role / Timing Role: Primary measurement engine interfacing 12-bit ADC (5 MS/s) to current/voltage sensors, managing SHA-1 secure OTA updates via USB or UART. Use Value: On-chip 256 KB flash + 16 KB EEPROM ensures reliable firmware rollback and calibration data retention across power cycles. |
| Building Automation Controller | Medical Diagnostic Interface Module |
Use Scenario: HVAC supervisory controller integrating BACnet/IP, LonWorks, and RS-485 Modbus RTU networks. IC Role / Device Role / Timing Role: Network bridge with Ethernet AVB QoS, dual CAN for legacy equipment, and Flexcomm-configured RS-485 transceivers. Use Value: TFBGA180 package provides 145 GPIOs for discrete I/O expansion while maintaining compact footprint for DIN-rail mounted enclosures. | Use Scenario: Portable ultrasound front-end module acquiring analog RF signals and streaming processed data to host PC via USB 2.0 HS. IC Role / Device Role / Timing Role: Signal processor handling PDM microphone decimation, I2S audio streaming, and USB bulk transfer with DMA-coherent buffers. Use Value: Integrated DMIC subsystem + 12-bit ADC + USB HS eliminates external audio codec and reduces signal path noise by 12 dB. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC54606J512ET180 | 512 KB flash / 200 KB SRAM vs. 256 KB / 136 KB - same CPU, peripherals, and package. | Supports larger firmware images, dual-bank OTA, and extended buffer space for encrypted communications. | Select when firmware size exceeds 200 KB or secure boot requires additional signature storage. |
| LPC54606J256BD100 | LQFP100 (100-pin) vs. TFBGA180 (180-ball) - identical memory, clock, and peripheral specs. | Lower I/O count (64 GPIOs), no EMC or LCD support, reduced Flexcomm count (9 vs. 10). | Select for cost-sensitive designs where 145 GPIOs and SDRAM expansion are unnecessary. |
Compared with LPC54606J256ET180E, the LPC54606J512ET180 offers higher memory headroom for cryptographic operations and future firmware growth, while the LPC54606J256BD100 trades package density and peripheral scalability for simplified layout and lower assembly cost - both retain identical real-time performance and protocol stack compatibility.
Availability
LPC54606J256ET180E is available at Aetrix Electronics and suitable for industrial gateways, smart energy meters, building automation controllers, and medical diagnostic modules requiring stable component supply across extended temperature ranges (−40 °C to +105 °C).
Supply support for LPC54606J256ET180E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.
The LPC546xx product line targets high-performance industrial edge devices requiring real-time protocol bridging, secure firmware execution, and mixed-signal integration - designed specifically for deterministic control, networked sensing, and low-latency human-machine interaction.
FAQ
What is the maximum operating frequency of the LPC54606J256ET180E?
The LPC54606J256ET180E operates at a maximum CPU frequency of 180 MHz, achieved using the system PLL driven by the internal 12 MHz FRO or external crystal. This frequency is validated across the full −40 °C to +105 °C temperature range and 1.71 V to 3.6 V supply voltage, enabling deterministic real-time execution for industrial control tasks. The LPC54606J256ET180E maintains timing compliance without derating under worst-case conditions.
Does the LPC54606J256ET180E support CAN FD or only classic CAN 2.0?
The LPC54606J256ET180E integrates two CAN 2.0 controllers but does not include CAN FD capability. This is confirmed in Table 2 of the datasheet, where "CAN FD" is marked "no" for all LPC54606 devices. For CAN FD support, engineers must select LPC54616 or higher variants. The LPC54606J256ET180E remains fully compatible with ISO 11898-1 standard CAN networks up to 1 Mbps.
What package type and pin count does the LPC54606J256ET180E use?
The LPC54606J256ET180E uses a TFBGA180 package (SOT570-3) with 180 solder balls arranged in a 12 mm × 12 mm body and 0.8 mm pitch. It provides 145 GPIOs, including dedicated Ethernet, USB, and CAN signal balls. The ball map follows JEDEC MO-275, with A1 index in the top-left corner - distinct from LQFP100 or TFBGA100 variants of the same family.
How much SRAM and flash memory does the LPC54606J256ET180E include?
The LPC54606J256ET180E includes 256 KB of on-chip flash memory and 136 KB of total SRAM - composed of 128 KB main SRAM, 8 KB USB-dedicated SRAM, and separate 32 KB I&D bus SRAM. This memory configuration supports complex RTOS deployments, dual-bank firmware updates, and real-time buffering for Ethernet AVB and USB HS streams without external memory.
Is the LPC54606J256ET180E pin-compatible with other LPC546xx variants in TFBGA180?
Yes, the LPC54606J256ET180E shares identical pinout and ball assignment with all other TFBGA180-packaged LPC546xx devices (e.g., LPC54605J256ET180, LPC54616J256ET180), as confirmed in Figure 5 and Table 4 of the datasheet. Signal mapping, power/ground ball locations, and boundary scan functionality are fully consistent - enabling hardware reuse across memory and feature variants.
LPC54606J256ET180E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 180-TFBGA
- Series:
- LPC546xx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 145
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 16K x 8
- RAM Size:
- 136K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC54606J256ET180E FAQ
1.How can I place an order for LPC54606J256ET180E through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC54606J256ET180E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC54606J256ET180E reliable?
The price and inventory of LPC54606J256ET180E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC54606J256ET180E is usually 5 days.
3.What payment methods are accepted for LPC54606J256ET180E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC54606J256ET180E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC54606J256ET180E?
LPC54606J256ET180E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC54606J256ET180E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC54606J256ET180E?
For technical support, including LPC54606J256ET180E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC54606J256ET180E requirements.
6.How does Aetrix verify that LPC54606J256ET180E is sourced from the original manufacturer or authorized distributors?
All LPC54606J256ET180E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC54606J256ET180E meets industry standards.
7.What is the process for return or replacement of LPC54606J256ET180E?
All LPC54606J256ET180E units undergo pre-shipment inspection (PSI). If there is an issue with LPC54606J256ET180E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC54606J256ET180E part is unused and in its original packaging.
Return procedure for LPC54606J256ET180E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LPC54606J256ET180E Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
