NXP Semiconductors LPC5504JBD64K

Overview

LPC5504JBD64 from NXP Semiconductors is a 32-bit ARM Cortex-M33 microcontroller designed for secure embedded control applications. It operates at up to 96 MHz, integrates 128 KB flash and 80 KB SRAM, includes CAN 2.0 interface, and supports TrustZone-based isolation - deployed in industrial gateways requiring deterministic real-time response and firmware integrity.

For engineers reviewing the LPC5504JBD64 datasheet, LPC5504JBD64 pinout, LPC5504JBD64 application, or LPC5504JBD64 equivalent, key selection criteria include its HTQFP64 package with 45 GPIOs, PRINCE-enabled flash encryption, 16-bit 2.0 Msamples/sec ADC with simultaneous conversion capability, and absence of CASPER crypto co-processor or PUF compared to LPC55S variants.

Technical Context

The LPC5504JBD64 implements ARMv8-M architecture with TrustZone security extensions but excludes CASPER and PUF hardware blocks present in LPC55S-series parts. Its memory subsystem comprises 128 KB on-chip flash (512-byte page erase), 80 KB SRAM split across Code Bus (16 KB), System Bus (64 KB contiguous), and additional System Bus (16 KB).

It features nine Flexcomm interfaces (FC0–FC7 + HS SPI), each configurable as USART, SPI, I2C, or I2S, plus dedicated CAN 2.0 controller, five 32-bit general-purpose timers, SCTimer/PWM, MRT, RTC, WWDT, and PLU logic unit - all accessible via AHB/APB interconnect with DMA0/DMA1 support.

Key Specifications

Pinout & Package

HTQFP64 package: plastic low-profile quad flat package with 64 leads, 0.5 mm pitch, 10 × 10 × 0.5 mm body size, exposed thermal pad connected to VSS.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC5504JBD64, LPC5504JHI48 offers smaller footprint and lower thermal resistance but sacrifices 15 GPIOs and two Flexcomm interfaces; LPC5506JBD64 retains full pin compatibility while upgrading to CAN FD and doubling flash/SRAM capacity - both require firmware revalidation due to memory layout and peripheral register differences.

Availability

LPC5504JBD64 is available at Aetrix Electronics and suitable for industrial automation, smart metering, and building control systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for LPC5504JBD64 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC550x series targets cost-optimized, security-aware embedded control applications - delivering TrustZone isolation, PRINCE flash encryption, and rich analog/digital peripherals without premium crypto accelerators like CASPER or PUF.

FAQ

What is the maximum operating frequency of the LPC5504JBD64?

The LPC5504JBD64 runs at a maximum CPU frequency of 96 MHz using its ARM Cortex-M33 core. This speed is achievable with the internal 96 MHz Free Running Oscillator (FRO), PLL0, or PLL1 clock sources. The FRO is factory-trimmed to ±1% accuracy across voltage and 0 °C to 85 °C, and ±2% over −40 °C to 105 °C. All timing-critical peripherals - including the 16-bit ADC sampling at 2.0 Msamples/sec - are synchronized to this clock domain. The LPC5504JBD64 does not require an external high-frequency crystal to reach full performance.

Does the LPC5504JBD64 support CAN FD or only classical CAN?

The LPC5504JBD64 integrates a CAN 2.0 controller only - it does not support CAN FD. This is confirmed in Table 2 of the datasheet, which explicitly lists "CAN2.0" under the LPC5504JBD64 row, contrasting with "CAN FD" entries for LPC55S0x variants. While it shares the same pinout and peripheral register map as CAN FD-capable siblings, the CAN module lacks FD-specific features such as variable bit rates, extended data length (up to 64 bytes), and ISO 11898-1:2015 compliance. The LPC5504JBD64 remains fully compatible with legacy CAN 2.0B networks operating at up to 1 Mbps.

What security features are included in the LPC5504JBD64?

The LPC5504JBD64 includes ARM TrustZone for hardware-enforced secure/non-secure world separation, PRINCE flash encryption/decryption, secure boot with RSA-2048/4096 signature verification, SHA2 hash engine, AES-256 encryption, True Random Number Generator (TRNG), and 128-bit unique device serial number (UUID). It lacks CASPER crypto co-processor and Physical Unclonable Function (PUF), distinguishing it from LPC55S-series parts. All security features are implemented in silicon and validated per NXP's TBSA compliance - enabling secure firmware updates, anti-rollback protection, and device identity binding without external secure elements. The LPC5504JBD64 supports debug authentication via RSA-2048/4096 but does not include DICE specification support.

How many ADC channels does the LPC5504JBD64 support and what is its sampling rate?

The LPC5504JBD64 integrates a single 16-bit SAR ADC supporting up to 9 input channels - configured as five differential pairs (10 single-ended equivalents). Its maximum sampling rate is 2.0 Msamples/sec, with simultaneous conversion capability across two channels within the same differential pair. This allows time-aligned voltage/current measurements critical for power quality analysis. The ADC supports multiple trigger sources including timers, software, and external events, and connects directly to the integrated temperature sensor and analog comparator. No external ADC driver or synchronization circuitry is required to achieve full-rate operation. The LPC5504JBD64 ADC performance is identical to that of LPC55S0x variants despite lacking CASPER or PUF.

What is the package type and pin count of the LPC5504JBD64?

The LPC5504JBD64 uses the HTQFP64 package: a plastic low-profile quad flat package with 64 leads, 0.5 mm pitch, and 10 × 10 × 0.5 mm body dimensions. It includes an exposed thermal pad that must be connected to VSS for optimal thermal performance. This package provides 45 GPIO pins, all accessible via standard PCB assembly processes. Pin configuration matches other LPC550x/LPC55S0x HTQFP64 variants, enabling direct PCB reuse across the family - though functional differences (e.g., CAN 2.0 vs CAN FD, flash size, security blocks) require firmware adaptation. The LPC5504JBD64 is not available in HVQFN48; that variant is designated LPC5504JHI48.