NXP Semiconductors LPC5512JBD100E

Overview

LPC5512JBD100E from NXP Semiconductors is an Arm Cortex-M33 microcontroller designed for secure embedded control applications. It operates at up to 150 MHz, integrates 64 KB flash and 48 KB SRAM, features a 16-bit 2.0 Msamples/sec ADC with simultaneous conversion capability, and supports CAN 2.0 (not CAN FD) and USB Full-Speed interfaces. It targets industrial sensor nodes requiring cryptographic integrity and low-power operation.

For engineers reviewing the LPC5512JBD100E datasheet, LPC5512JBD100E pinout, LPC5512JBD100E application, or LPC5512JBD100E equivalent, key selection criteria include its HLQFP100 package, TrustZone®-enabled security architecture, PRINCE flash encryption support, CASPER crypto acceleration, and absence of CAN FD or high-speed USB-distinguishing it from LPC55S1x variants.

Technical Context

The LPC5512JBD100E implements Arm TrustZone® for hardware-enforced memory and peripheral isolation, enabling secure boot with RSA-2048/4096 signature verification and DICE-compliant device identity composition. Its PRINCE module provides real-time on-the-fly flash encryption/decryption, while the CASPER co-processor accelerates ECC operations without CPU intervention.

It integrates two DMA controllers (23+10 channels), nine Flexcomm peripherals configurable as USART/SPI/I2C/I2S, five 32-bit general-purpose timers, SCTimer/PWM, MRT, RTC, WWDT, and a programmable logic unit (PLU) for custom state-machine logic. The analog subsystem includes a temperature sensor and comparator alongside the 16-bit ADC.

Key Specifications

Pinout & Package

HLQFP100 package: 100-pin plastic low-profile quad flat package with 0.5 mm pitch, body size 14 × 14 × 0.5 mm. Pin 1 index located at top-left corner with beveled edge marking.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC5512JBD100E, LPC5514JBD100 offers scalable memory for complex firmware, while LPC5512JBD64 trades I/O count and package size for board area savings-neither provides CAN FD or USB HS, preserving direct applicability in legacy CAN 2.0/FS USB systems.

Availability

LPC5512JBD100E is available at Aetrix Electronics and suitable for industrial sensor nodes, secure firmware gateways, low-power HMIs, and automotive body control modules requiring stable component supply across multi-year production cycles.

Supply support for LPC5512JBD100E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC551x product line delivers cost-optimized, TrustZone®-enabled microcontrollers targeting secure embedded control where CAN 2.0, USB Full-Speed, and hardware-accelerated cryptography are required without CAN FD or high-speed USB overhead.

FAQ

Does LPC5512JBD100E support CAN FD?

No, LPC5512JBD100E implements only CAN 2.0 protocol. Unlike LPC55S1x variants, it lacks the CAN FD controller and associated hardware features. This distinction is explicitly confirmed in Table 2 of the datasheet, which lists "CAN 2.0" under the CAN FD column for LPC5512JBD100E. Designers requiring CAN FD must select an LPC55S1x part such as LPC55S12JBD100E.

What is the maximum clock frequency of LPC5512JBD100E?

The LPC5512JBD100E operates at up to 150 MHz using its Arm Cortex-M33 core. This maximum frequency is achievable when powered from the internal 96 MHz FRO (Free Running Oscillator) or external crystal/PLL sources. The FRO is factory-trimmed to ±2% accuracy over −40 °C to +105 °C, ensuring reliable timing across the full industrial temperature range.

Does LPC5512JBD100E include TrustZone® and secure boot capabilities?

Yes, LPC5512JBD100E includes Arm TrustZone® for hardware-enforced memory and peripheral isolation, and supports secure boot using RSASSA-PKCS1-v1_5 signatures of SHA256 digests. It validates RSA-2048/4096 public keys in x509 format, enforces anti-rollback via image key revocation, and complies with DICE Specification v2.0 Level 00 for device identity composition.

What package type is used for LPC5512JBD100E?

LPC5512JBD100E uses the HLQFP100 package: a 100-pin plastic low-profile quad flat package with 14 × 14 × 0.5 mm body dimensions and 0.5 mm lead pitch. This package is pin-compatible with other LPC551x/LPC55S1x variants in the same footprint, including LPC5514JBD100 and LPC5516JBD100.

How much on-chip memory does LPC5512JBD100E provide?

LPC5512JBD100E integrates 64 KB of on-chip flash program memory and 48 KB of total SRAM. The SRAM is partitioned as 16 KB on the code bus and 32 KB on the system bus. It does not include the additional 16 KB USB SRAM found in higher-tier LPC55S1x parts, consistent with its cost-optimized positioning within the family.