NXP Semiconductors LPC5512JBD100K

Overview

LPC5512JBD100 from NXP Semiconductors is an Arm Cortex-M33 microcontroller designed for secure, low-power embedded control applications. It operates at up to 150 MHz, integrates 64 KB flash and 48 KB SRAM, supports CAN 2.0 (not CAN FD), USB Full-Speed with crystal-less operation, and features a 16-bit 2.0 Msamples/sec ADC with simultaneous differential conversion capability - deployed in industrial sensor nodes requiring deterministic real-time response and firmware integrity.

For engineers reviewing the LPC5512JBD100 datasheet, LPC5512JBD100 pinout, LPC5512JBD100 application, or LPC5512JBD100 equivalent, this page delivers verified specifications, package-confirmed pin functions, security architecture context, and validated alternative options - all aligned to the HLQFP100 variant with TrustZone-disabled, PRINCE-enabled, and CASPER-absent configuration per official ordering table.

Technical Context

The LPC5512JBD100 implements a single-core Arm Cortex-M33 without TrustZone or PUF, distinguishing it from LPC55S1x variants. Its security stack centers on PRINCE-based flash encryption and ROM-based secure boot using RSA-2048/4096 signatures, SHA256 hash verification, and anti-rollback via x.509 certificate revocation - enabling authenticated firmware updates without hardware-enforced memory isolation.

It provides nine Flexcomm interfaces (FC0–FC8), each configurable as USART/SPI/I2C/I2S, with FC8 dedicated to high-speed SPI. The analog subsystem includes five differential ADC channels (10 single-ended), internal temperature sensor, and comparator with external reference support - all synchronized to the 32 kHz FRO or external 32.768 kHz crystal for RTC wake-up and low-power timing.

Key Specifications

Pinout & Package

Package: HLQFP100 (14 × 14 × 0.5 mm, 0.5 mm pitch), lead-free, RoHS-compliant - compatible with standard surface-mount reflow processes and accessible for manual prototyping.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC5512JBD100, the LPC5514JBD100 offers scalable memory for evolving firmware, while the LPC55S12JBD100 adds silicon-rooted security primitives - neither is pin-compatible with LPC5512JBD100 due to different die configurations, though all share HLQFP100 mechanical footprint.

Availability

LPC5512JBD100 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart energy meters, and programmable logic controller I/O modules requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for LPC5512JBD100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets - with over 40 years of microcontroller innovation and ISO 9001-certified manufacturing.

The LPC551x product line targets cost-optimized, security-aware embedded control applications where full TrustZone is unnecessary - delivering PRINCE encryption, secure boot, and rich analog/peripheral integration in compact packages.

FAQ

What is the maximum operating frequency of the LPC5512JBD100?

The LPC5512JBD100 operates at a maximum CPU frequency of 150 MHz, achieved via PLL0 or PLL1 driven by internal FRO (12 MHz or 96 MHz), external crystal (12–32 MHz), or 32.768 kHz RTC oscillator. This frequency is sustained across the full −40 °C to +105 °C temperature range and 1.8 V to 3.6 V supply voltage, enabling deterministic real-time execution in industrial control loops. The LPC5512JBD100 achieves this without external high-frequency clocks, reducing system BOM cost and layout complexity.

Does the LPC5512JBD100 support CAN FD or only classical CAN?

The LPC5512JBD100 supports only CAN 2.0 (Classical CAN) at up to 1 Mbps - not CAN FD. This is confirmed in Table 2 of the official datasheet, where "CAN FD" is marked "-" for LPC5512JBD100, while "CAN 2.0" is explicitly listed. CAN FD support is reserved for LPC55S1x and LPC5516/14 variants. Designers requiring CAN FD must select LPC5514JBD100 or higher-tier parts, as the LPC5512JBD100's CAN peripheral lacks FD frame handling, bit-rate switching, and extended data length capabilities.

What security features are included in the LPC5512JBD100?

The LPC5512JBD100 includes PRINCE flash encryption/decryption, ROM-based secure boot with RSA-2048/4096 signature verification, SHA256 hashing, CRC32 image integrity checking, and Code Watchdog for runtime flow integrity - but excludes TrustZone, PUF, CASPER, and AES-256 hardware acceleration. These omissions are intentional per its positioning as a cost-optimized variant. The LPC5512JBD100 relies on software-managed security boundaries and PRINCE for asset protection, making it suitable for applications where hardware-enforced isolation is not mandated.

Which package type does the LPC5512JBD100 use, and what are its key mechanical properties?

The LPC5512JBD100 uses the HLQFP100 package: plastic low-profile quad flat package with 100 leads, body dimensions of 14 mm × 14 mm × 0.5 mm, and 0.5 mm lead pitch. It is lead-free and RoHS-compliant, with thermal pad exposed on the bottom for enhanced heat dissipation. Pin 1 is located at the top-left corner adjacent to the terminal index area, and marking includes "LPC5512" on the first line, date code (yyww) on the third line, and revision "AR" - fully documented in Section 4 of the datasheet.

How many ADC channels does the LPC5512JBD100 support, and what is its sampling rate?

The LPC5512JBD100 integrates a 16-bit SAR ADC supporting five differential channel pairs (10 single-ended inputs) with simultaneous conversion capability on paired channels. Its maximum sample rate is 2.0 Msamples/sec - verified in Section 2 ("Features and benefits") and Figure 5 (block diagram). This performance enables high-fidelity acquisition of fast transients in motor control or power quality monitoring, with internal temperature sensor and comparator sharing the same analog front-end for system-level health monitoring.