NXP Semiconductors LPC5512JBD100Y
- Part No.:
- LPC5512JBD100Y
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP Exposed Pad
- Datasheet:
-
LPC5512JBD100Y.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,000
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Product details
Overview
LPC5512JBD100Y from NXP Semiconductors is a 32-bit Arm Cortex-M33 microcontroller designed for secure embedded control applications. It operates at up to 150 MHz, integrates 64 KB flash and 48 KB SRAM, features CAN 2.0 (not CAN FD), full-speed USB, and a 16-bit 2.0 Msamples/sec ADC with simultaneous conversion capability - deployed in industrial sensor nodes requiring deterministic real-time response and firmware integrity.
For engineers reviewing the LPC5512JBD100Y datasheet, LPC5512JBD100Y pinout, LPC5512JBD100Y application, or LPC5512JBD100Y equivalent, key selection criteria include its HLQFP100 package with 100 leads, TrustZone®-enabled security foundation, PRINCE flash encryption support, CASPER crypto acceleration, and compatibility with NXP's MCUXpresso SDK for secure boot and peripheral configuration.
Technical Context
The LPC5512JBD100Y implements Arm TrustZone® for hardware-enforced memory and peripheral isolation, enabling secure firmware execution alongside non-secure application code. Its CASPER co-processor accelerates ECC-based asymmetric cryptography, while PRINCE provides real-time on-the-fly AES-128 encryption/decryption of flash contents during read/write operations.
It integrates two DMA controllers (23-channel DMA0 and 10-channel DMA1), nine Flexcomm interfaces configurable as USART/SPI/I²C/I²S, and a programmable SCTimer/PWM with 16 capture/match registers. The device lacks TrustZone®, PUF, Secure Boot, HASH-AES, and CASPER - confirmed by Table 2 ordering options - distinguishing it from LPC55S1x variants.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ up to 150 MHz - delivers deterministic real-time control with DSP instructions and FPU support. |
| Memory | 64 KB on-chip flash + 48 KB SRAM (16 KB Code Bus + 32 KB System Bus) - sufficient for compact RTOS-based firmware with local data buffering. |
| USB Interface | Full-speed USB 2.0 host/device with on-chip PHY - enables crystal-less operation in device mode, reducing BOM cost and board space. |
| Analog Peripherals | 16-bit ADC @ 2.0 Msamples/sec with simultaneous dual-channel conversion; integrated temperature sensor and comparator - supports high-fidelity sensor acquisition in industrial monitoring. |
| Serial Interfaces | Nine Flexcomm peripherals (FC0–FC8), each configurable as USART/SPI/I²C/I²S - provides flexible connectivity for multi-protocol fieldbus gateways. |
| Timers & PWM | Five 32-bit general-purpose timers, one SCTimer/PWM (8 inputs / 10 outputs), RTC with wake-up from deep power-down - enables precise timing, motor control, and low-power scheduling. |
| Package | HLQFP100 (14 × 14 × 0.5 mm, 0.5 mm pitch) - surface-mount package with 100 I/O pins, compatible with standard reflow processes and debug via SWD. |
Pinout & Package
HLQFP100 package: 100-lead plastic low-profile quad flat package, body size 14 mm × 14 mm × 0.5 mm, 0.5 mm lead pitch, exposed thermal pad, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0–PIO0_14, PIO1_0–PIO1_31, PIO2_0–PIO2_15, PIO3_0–PIO3_15 | General-purpose I/O with multiplexed functions | 64 GPIOs support digital I/O, pin interrupts (PINT), grouped interrupts (GINT), and secure GPIO configuration - enables direct sensor/actuator interfacing without external logic. |
| FC0–FC8 | Configurable serial interface blocks | Each Flexcomm supports USART/SPI/I²C/I²S with FIFO and fractional baud-rate generator - eliminates need for discrete level shifters or protocol translators in mixed-interface systems. |
| ADC0_IN0–ADC0_IN9 | Analog input channels | 10 single-ended or 5 differential ADC inputs with internal reference - allows direct connection of thermocouples, RTDs, or voltage-scaled transducer outputs. |
| CAN0_TD / CAN0_RD | CAN 2.0 transceiver interface | Dedicated CAN TX/RX pins compliant with ISO 11898-1 - supports 1 Mbps operation in automotive and industrial networks without external CAN transceiver logic-level adaptation. |
| SWDIO / SWCLK | Serial Wire Debug interface | Two-pin debug interface supporting breakpoints, watchpoints, and Serial Wire Output - enables non-intrusive firmware validation and field diagnostics without JTAG overhead. |
Key Features
| Feature | Design Value |
|---|---|
| Arm Cortex-M33 core | Includes FPU, MPU, NVIC, and system tick timer - simplifies floating-point math, memory protection, and interrupt-driven real-time task scheduling. |
| PRINCE flash encryption | Hardware-accelerated AES-128 encryption/decryption of flash reads/writes - protects firmware IP and enables secure over-the-air updates without software overhead. |
| Flexcomm serial interfaces | Nine software-configurable peripherals with shared clocking and FIFO - reduces PCB routing complexity and supports dynamic protocol switching in adaptive communication stacks. |
| High-speed ADC | 16-bit resolution at 2.0 Msamples/sec with simultaneous dual-channel sampling - captures transient events in motor current sensing or vibration analysis without external sample-and-hold circuits. |
| Low-power operation | Deep power-down mode with RAM retention and RTC wake-up - extends battery life in wireless sensor nodes to multi-year intervals using 32.768 kHz crystal timing. |
Applications
| Industrial Sensor Node | Smart Energy Meter |
|---|---|
|
Use Scenario: Compact, battery-powered environmental monitor collecting temperature, humidity, and vibration data in factory settings. IC Role / Device Role / Timing Role: Central controller executing sensor fusion algorithms, managing low-power sleep cycles, and transmitting encrypted telemetry via CAN or UART. Use Value: 64 KB flash stores firmware with secure boot validation; 48 KB SRAM buffers burst-acquired ADC samples; PRINCE prevents firmware tampering during remote updates. |
Use Scenario: DIN-rail mounted electricity meter performing real-time RMS voltage/current calculation and tariff-based logging. IC Role / Device Role / Timing Role: Real-time measurement engine synchronizing ADC sampling to AC line cycle using SCTimer/PWM event triggers. Use Value: 2.0 Msamples/sec ADC captures harmonic distortion; five 32-bit timers coordinate metrology calculations; CAN 2.0 enables interoperability with legacy utility infrastructure. |
| Secure Gateway Controller | Motor Control Edge Node |
|
Use Scenario: Field gateway aggregating Modbus RTU, I²C sensor data, and BLE telemetry before forwarding to cloud via Ethernet or cellular. IC Role / Device Role / Timing Role: Protocol translation hub with isolated memory regions for trusted firmware and untrusted application partitions. Use Value: Nine Flexcomm interfaces eliminate external bridge ICs; 150 MHz CPU handles concurrent TLS handshakes and packet parsing; USB FS supports local configuration via PC. |
Use Scenario: Brushless DC motor driver with position feedback, current sensing, and fault protection in HVAC blowers or pumps. IC Role / Device Role / Timing Role: Motion controller generating PWM waveforms, sampling phase currents via ADC, and executing field-oriented control (FOC) loops. Use Value: SCTimer/PWM delivers sub-microsecond PWM dead-time control; simultaneous ADC sampling captures both phase currents in one cycle; GPIOs drive gate drivers directly. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC5514JBD100 | 128 KB flash, 80 KB SRAM, same HLQFP100 package, identical peripheral set except CAN 2.0 and USB FS. | Supports larger firmware images and more complex RTOS tasks; retains same industrial temperature range (−40 °C to +105 °C). | Select when firmware size exceeds 64 KB or additional SRAM is required for data logging or protocol stacks. |
| LPC55S12JBD100 | 64 KB flash, 48 KB SRAM, but adds TrustZone®, PUF, Secure Boot, HASH-AES, and CASPER - not present in LPC5512JBD100. | Required for applications needing certified secure boot, cryptographic key generation, or DICE-compliant device identity. | Choose only if hardware-enforced security features are mandatory; otherwise, LPC5512JBD100 offers lower cost and identical real-time performance. |
Compared with LPC5514JBD100, the LPC5512JBD100 trades flash/SRAM capacity for lower unit cost and footprint-equivalent integration; compared with LPC55S12JBD100, it omits security accelerators to reduce silicon area and power consumption - making it optimal for cost-sensitive, non-certified industrial control where deterministic timing outweighs cryptographic requirements.
Availability
LPC5512JBD100Y is available at Aetrix Electronics and suitable for industrial sensor nodes, smart energy meters, secure gateway controllers, and motor control edge nodes requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for LPC5512JBD100Y includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with headquarters in Eindhoven, Netherlands.
The LPC551x series targets cost-optimized, real-time embedded control applications where deterministic performance, analog integration, and industrial-grade reliability are prioritized over advanced security features - distinguishing it from the security-focused LPC55S1x family.
FAQ
What is the maximum operating frequency of the LPC5512JBD100Y?
The LPC5512JBD100Y operates at a maximum CPU frequency of 150 MHz, enabled by its Arm Cortex-M33 core with integrated FPU and DSP instructions. This clock speed is achievable using internal PLLs driven by the 12 MHz FRO or external crystal sources. The device maintains timing integrity across its full industrial temperature range of −40 °C to +105 °C, and the LPC5512JBD100Y datasheet specifies stable operation under all supported voltage conditions (1.8 V to 3.6 V).
Does the LPC5512JBD100Y support CAN FD or only classical CAN?
The LPC5512JBD100Y supports only CAN 2.0 (Classical CAN) with bit rates up to 1 Mbps, as confirmed in Table 2 of the official NXP datasheet. It does not include the CAN FD module present in LPC55S1x and higher-tier LPC551x variants. The CAN0_TD and CAN0_RD pins on the HLQFP100 package are functionally limited to ISO 11898-1 compliance, and no CAN FD-specific registers or DMA channels are implemented in the LPC5512JBD100Y silicon.
What security features are included in the LPC5512JBD100Y?
The LPC5512JBD100Y includes PRINCE flash encryption and basic Code Watchdog for runtime code flow integrity, but excludes TrustZone®, PUF, Secure Boot, HASH-AES, CASPER, and DICE - all explicitly marked as "–" in Table 2 of the NXP datasheet. Its security model centers on firmware IP protection via PRINCE and deterministic execution monitoring, making it suitable for applications where cryptographic acceleration or certified secure boot is not required.
Which development tools are officially supported for the LPC5512JBD100Y?
NXP officially supports the LPC5512JBD100Y with MCUXpresso IDE, SDK, and Config Tools - including drivers for Flexcomm, SCTimer/PWM, ADC, and USB FS. Hardware debugging uses standard SWD via LPC-Link2 or J-Link probes. The LPC5512JBD100Y is compatible with the LPCXpresso55S16 development board for evaluation, though users must disable S1x-specific features (e.g., PUF, CASPER) in software to match LPC5512JBD100Y capabilities.
What is the ADC resolution and sampling rate of the LPC5512JBD100Y?
The LPC5512JBD100Y integrates a 16-bit successive-approximation ADC capable of 2.0 million samples per second (2.0 Msamples/sec), with support for simultaneous conversions on paired differential channels. It provides 10 single-ended or 5 differential input channels, internal temperature sensor integration, and multiple trigger sources including timers and external pins - all documented in the LPC55S1x/LPC551x product data sheet Rev. 1.8.
LPC5512JBD100Y Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP Exposed Pad
- Series:
- LPC551x
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O:
- 64
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 48K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x16b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC5512JBD100Y FAQ
1.How can I place an order for LPC5512JBD100Y through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC5512JBD100Y on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC5512JBD100Y reliable?
The price and inventory of LPC5512JBD100Y are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC5512JBD100Y is usually 5 days.
3.What payment methods are accepted for LPC5512JBD100Y?
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LPC5512JBD100Y orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC5512JBD100Y order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC5512JBD100Y?
For technical support, including LPC5512JBD100Y datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC5512JBD100Y requirements.
6.How does Aetrix verify that LPC5512JBD100Y is sourced from the original manufacturer or authorized distributors?
All LPC5512JBD100Y products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC5512JBD100Y meets industry standards.
7.What is the process for return or replacement of LPC5512JBD100Y?
All LPC5512JBD100Y units undergo pre-shipment inspection (PSI). If there is an issue with LPC5512JBD100Y, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC5512JBD100Y part is unused and in its original packaging.
Return procedure for LPC5512JBD100Y:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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