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NXP Semiconductors LPC5512JBD64K
- Part No.:
- LPC5512JBD64K
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
LPC5512JBD64K.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 64TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:800
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Product details
Overview
LPC5512JBD64K from NXP Semiconductors is a 32-bit Arm Cortex-M33 microcontroller designed for secure, low-power embedded control applications. It integrates 64 KB on-chip flash, 48 KB SRAM, CAN 2.0 interface, full-speed USB device controller, and a 16-bit 2.0 Msamples/sec ADC with simultaneous conversion capability - deployed in industrial sensor nodes requiring deterministic real-time response and firmware integrity.
For engineers reviewing the LPC5512JBD64K datasheet, LPC5512JBD64K pinout, LPC5512JBD64K application, or LPC5512JBD64K equivalent, this page delivers verified technical context, package-specific pin mapping, security feature implementation details, and validated alternative options for cost-optimized, secure MCU selection in temperature-constrained industrial designs.
Technical Context
The LPC5512JBD64K implements Arm TrustZone® at the hardware level to isolate secure and non-secure execution environments, enabling secure boot with RSA-2048/4096 signature verification and PRINCE-based flash encryption. Its dual DMA controllers (23+10 channels) offload data movement from the CPU across peripherals including CAN, USB, Flexcomm interfaces, and ADC.
It features two independent clock domains: a high-frequency system domain (up to 150 MHz via PLL/FRO) and an always-on RTC domain (32 kHz FRO or external crystal), supporting wake-up from deep power-down using either the RTC alarm or Micro-Tick Timer. The 64-pin HTQFP package supports 36 GPIOs with configurable I/O functions, pin interrupts, and secure GPIO capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ up to 150 MHz with TrustZone®, FPU, and MPU - enables secure RTOS deployment and DSP-accelerated signal processing. |
| Memory | 64 KB flash + 48 KB SRAM (16 KB code bus, 32 KB system bus) - sufficient for compact firmware with encrypted bootloader and runtime crypto operations. |
| USB Interface | Full-speed USB 2.0 device controller with on-chip PHY and crystal-less operation - eliminates external oscillator for cost-sensitive USB peripheral designs. |
| CAN Interface | CAN 2.0 compliant (not CAN FD) - supports legacy automotive and industrial fieldbus communication without FD protocol stack overhead. |
| ADC | 16-bit, 2.0 Msamples/sec SAR ADC with 10 single-ended or 5 differential channels and simultaneous dual-channel conversion - suitable for high-fidelity analog sensing in motor control or power monitoring. |
| Security | Hardware AES-256, SHA-2, TRNG, PUF, and Code Watchdog - provides root-of-trust foundation for secure firmware updates and runtime code-flow integrity checking. |
| Package | HTQFP64 (10 × 10 × 0.5 mm, 0.5 mm pitch) - surface-mount compatible with standard reflow profiles and accessible debug/test access via JTAG/SWD pins. |
Pinout & Package
HTQFP64 package: 64-lead plastic low-profile quad flat package, 10 mm × 10 mm body, 0.5 mm lead pitch, exposed thermal pad (EP), RoHS-compliant. Pin 1 marked by dot or bevelled corner; pin numbering follows counter-clockwise convention from top-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0–PIO0_35 | General-purpose I/O / alternate function multiplexing | 36 GPIOs support UART/SPI/I2C/ADC/CAN/USB functions via software-configurable IOCON registers; default reset state disables pull-ups/downs except on debug pins. |
| PIO0_11 / PIO0_12 | SWD Debug Interface | Serial Wire Debug clock (SWCLK) and data (SWDIO); enabled at reset for out-of-box programming and trace without JTAG header. |
| PIO0_5 | Boot Mode Selection | State at reset determines boot source (flash vs. ISP handler); requires external pull-up/down for reliable factory or field firmware recovery. |
| VDD / VSS | Power Supply / Ground | Single 1.8–3.6 V supply rail; internal DC-DC converter reduces external component count; dedicated VSS pins minimize noise coupling to analog sections. |
| XTAL_IN / XTAL_OUT | 32.768 kHz Crystal Oscillator | Connects to external 32.768 kHz crystal for RTC accuracy; bypass mode supports 100 kHz external clock input for battery-backed timekeeping. |
Key Features
| Feature | Design Value |
|---|---|
| TrustZone®-enabled Secure Execution | Hardware-isolated secure/non-secure memory and peripheral access - enables certified secure boot, encrypted firmware storage, and protected key management without software-only trust assumptions. |
| PRINCE Flash Encryption | Real-time AES-128 encryption/decryption of flash reads/writes - protects intellectual property and prevents unauthorized firmware extraction or modification during field updates. |
| Flexcomm Serial Interfaces | Nine configurable serial peripherals (Flexcomm 0–8) supporting USART/SPI/I2C/I2S - allows dynamic allocation of communication protocols per application need without hardware redesign. |
| SCTimer/PWM | State-configurable timer with 8 inputs, 10 outputs, and 16 match/capture registers - implements complex PWM waveforms, event sequencing, and input capture for motor control or power conversion timing. |
| Secure Boot with DICE | Device Identifier Composition Engine (DICE) Level 00 compliance - generates cryptographically bound device identity for zero-touch provisioning and attestation in IoT edge deployments. |
Applications
| Industrial Sensor Node | Secure USB Peripheral |
|---|---|
Use Scenario: Remote environmental monitoring unit with temperature, humidity, and vibration sensors, transmitting data over USB to host PC with firmware update capability. IC Role / Device Role / Timing Role: Central MCU managing sensor acquisition via ADC and comparator, executing secure firmware updates via USB HID-class bootloader, and enforcing code integrity with Code Watchdog. Use Value: 64 KB flash accommodates sensor fusion algorithms and SB2-format secure bootloader; full-speed USB crystal-less operation reduces BOM cost and board space. |
Use Scenario: USB HID keyboard or custom HID device requiring tamper-resistant firmware and authenticated host communication. IC Role / Device Role / Timing Role: USB device controller with integrated PHY and secure ROM bootloader; handles HID report generation, USB enumeration, and secure firmware validation before execution. Use Value: Hardware AES/SHA/TRNG enables signed firmware image verification; PUF-derived keys prevent cloning; 36 GPIOs support matrix scanning and LED feedback without external logic. |
| Legacy CAN Bus Gateway | Low-Power Edge Controller |
Use Scenario: Protocol translator between CAN 2.0 field devices and Ethernet/Wi-Fi gateway, operating in harsh industrial environments (-40 °C to +105 °C). IC Role / Device Role / Timing Role: CAN 2.0 controller with dedicated message RAM and FIFO handling; manages CAN frame filtering, buffering, and bridging to higher-layer protocols. Use Value: CAN 2.0 support ensures compatibility with existing machinery; wide temperature range and brown-out detection enable reliable operation in unregulated power environments. |
Use Scenario: Battery-powered smart actuator with motion sensing, local decision logic, and wake-on-event capability. IC Role / Device Role / Timing Role: Low-power MCU with deep-sleep modes (RAM retention), RTC alarm wake-up, and Micro-Tick Timer for sub-millisecond event response. Use Value: Integrated DC-DC converter and multiple power domains extend battery life; 48 KB SRAM retains context across sleep cycles; secure GPIO prevents unauthorized physical interface access. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar secure microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC5514JBD64 | 128 KB flash, 80 KB SRAM, same package and peripheral set - adds 64 KB flash headroom for larger firmware or OTA update staging. | Preferred where field-upgradable firmware requires dual-bank flash layout or advanced cryptographic libraries exceed 64 KB capacity. | Select when future firmware growth or secure OTA staging is required; maintains identical pinout and software compatibility. |
| LPC55S12JBD64 | Includes CASPER crypto co-processor, TrustZone®, PUF, and secure boot - adds hardware acceleration for ECC and RSA operations beyond LPC5512JBD64's software-only crypto. | Suitable for PKI-based authentication, TLS handshake offload, or DICE-compliant device onboarding where asymmetric crypto performance is critical. | Choose when elliptic curve cryptography or certificate-based identity provisioning is mandatory; shares same footprint but requires updated SDK support. |
Compared with LPC5512JBD64, LPC5514JBD64 offers scalable flash for evolving firmware while maintaining identical security and peripheral capabilities; LPC55S12JBD64 extends cryptographic capability with CASPER for asymmetric algorithm acceleration - both retain HTQFP64 compatibility but differ in secure boot enforcement and crypto subsystem depth.
Availability
LPC5512JBD64K is available at Aetrix Electronics and suitable for industrial sensor nodes, secure USB peripherals, legacy CAN gateways, and low-power edge controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for LPC5512JBD64K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with core expertise in Arm-based microcontrollers and trusted execution technologies.
The LPC551x series targets cost-conscious, security-aware embedded systems where CAN 2.0 interoperability, USB device functionality, and hardware-enforced firmware integrity are prioritized over CAN FD or advanced crypto acceleration.
FAQ
What is the maximum operating frequency of the LPC5512JBD64K?
The LPC5512JBD64K operates at up to 150 MHz using its Arm Cortex-M33 core, supported by PLL0/PLL1 clock synthesis from internal FRO (12 MHz or 96 MHz), external crystal (12–32 MHz), or 32.768 kHz RTC oscillator. This frequency is fully supported across the specified -40 °C to +105 °C temperature range and 1.8–3.6 V supply voltage.
Does the LPC5512JBD64K support CAN FD?
No, the LPC5512JBD64K implements CAN 2.0 only, as confirmed in Table 2 of the official datasheet. Unlike LPC55S1x/LPC5516 variants, it lacks CAN FD protocol support and associated hardware features such as bit-rate switching and extended data length handling.
What security features are included in the LPC5512JBD64K?
The LPC5512JBD64K includes hardware AES-256, SHA-2, TRNG, PUF, Code Watchdog, and PRINCE flash encryption. It supports secure boot with RSA-2048/4096 signatures and x.509 certificate validation, but omits CASPER crypto co-processor and TrustZone® - distinguishing it from LPC55S1x family members.
What is the ADC resolution and sampling rate of the LPC5512JBD64K?
The LPC5512JBD64K integrates a 16-bit SAR ADC capable of up to 2.0 million samples per second, supporting simultaneous conversions on differential channel pairs. It offers 10 single-ended or 5 differential input channels, with internal temperature sensor and comparator inputs routed to dedicated ADC channels.
Which package type does the LPC5512JBD64K use?
The LPC5512JBD64K uses the HTQFP64 package: a 64-lead plastic low-profile quad flat package measuring 10 mm × 10 mm with 0.5 mm lead pitch and an exposed thermal pad. This package is documented in Table 1 of the datasheet under ordering option "LPC5512JBD64".
LPC5512JBD64K Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- LPC551x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 48K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x16b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC5512JBD64K FAQ
1.How can I place an order for LPC5512JBD64K through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC5512JBD64K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC5512JBD64K reliable?
The price and inventory of LPC5512JBD64K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC5512JBD64K is usually 5 days.
3.What payment methods are accepted for LPC5512JBD64K?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC5512JBD64K transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC5512JBD64K?
LPC5512JBD64K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC5512JBD64K order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC5512JBD64K?
For technical support, including LPC5512JBD64K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC5512JBD64K requirements.
6.How does Aetrix verify that LPC5512JBD64K is sourced from the original manufacturer or authorized distributors?
All LPC5512JBD64K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC5512JBD64K meets industry standards.
7.What is the process for return or replacement of LPC5512JBD64K?
All LPC5512JBD64K units undergo pre-shipment inspection (PSI). If there is an issue with LPC5512JBD64K, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC5512JBD64K part is unused and in its original packaging.
Return procedure for LPC5512JBD64K:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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