NXP Semiconductors LPC5514JBD64K

Overview

LPC5514JBD64K from NXP Semiconductors is an Arm Cortex-M33 microcontroller for secure embedded applications, operating at up to 150 MHz with 128 KB flash, 80 KB SRAM, TrustZone® security, PRINCE flash encryption, and CAN FD interface. It integrates a 16-bit 2.0 Msamples/sec ADC, SCTimer/PWM, PLU, and USB full-speed/host capability in a 64-pin HTQFP package.

For engineers reviewing the LPC5514JBD64K datasheet, LPC5514JBD64K pinout, LPC5514JBD64K application, or LPC5514JBD64K equivalent, key selection considerations include its 128 KB flash/80 KB SRAM configuration, absence of CASPER crypto co-processor and PUF, CAN FD support, and HTQFP64 thermal and layout constraints.

Technical Context

The LPC5514JBD64K implements Arm TrustZone® for hardware-enforced memory isolation and supports secure boot using RSA-2048/4096 signatures with x.509 certificate validation and anti-rollback via image key revocation. Its clock system combines internal FROs (96 MHz ±1% over 0–85°C), PLLs, and crystal oscillators (12–32 MHz and 32.768 kHz) to drive CPU, peripherals, and low-power domains.

Digital subsystems include two DMA controllers (23+10 channels), nine Flexcomm interfaces configurable as USART/SPI/I2C/I2S, a dedicated CAN FD controller with DMA, and a programmable logic unit (PLU) for combinatorial/sequential logic. Analog resources comprise a 16-bit ADC with simultaneous dual-channel sampling, comparator, and integrated temperature sensor.

Key Specifications

Pinout & Package

HTQFP64 package with exposed thermal pad, 0.5 mm pitch, and 64 leads arranged in quad configuration. Pin 1 marked by corner notch or dot; pin numbering follows counter-clockwise sequence from top-left corner.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC5514JBD64K, LPC55S14JBD64 adds CASPER and PUF for advanced cryptography but shares identical package, clocking, and peripheral set; LPC5512JBD64 reduces memory and connectivity to lower BOM cost while retaining core M33 security features.

Availability

LPC5514JBD64K is available at Aetrix Electronics and suitable for industrial PLC I/O modules, secure edge gateways, automotive body control units, and medical sensor hubs requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for LPC5514JBD64K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC551x series targets cost-optimized, secure embedded applications where TrustZone®, PRINCE encryption, and CAN FD are required but CASPER acceleration and PUF are not-enabling robust security at reduced silicon cost.

FAQ

What is the maximum operating frequency of the LPC5514JBD64K?

The LPC5514JBD64K operates at a maximum CPU frequency of 150 MHz, enabled by its Arm Cortex-M33 core with integrated floating-point unit and memory protection unit. This frequency is achievable using internal PLLs driven by the 96 MHz FRO or external crystal sources. The device maintains timing integrity across its full −40 °C to +105 °C operating range, with FRO trimming to ±1% accuracy from 0 °C to 85 °C for date codes 2044 and later. LPC5514JBD64K performance is validated under worst-case voltage (1.8 V) and temperature conditions.

Does the LPC5514JBD64K support secure boot, and what cryptographic algorithms does it use?

Yes, the LPC5514JBD64K supports secure boot using RSASSA-PKCS1-v1_5 signatures of SHA256 digests, with RSA-2048 and RSA-4096 public key verification. It validates images using x.509 certificates and supports up to four revocable Root of Trust keys stored in protected flash. Anti-rollback is enforced via image key revocation using the Serial Number field in x.509 certificates. LPC5514JBD64K implements these functions in ROM bootloader without requiring external secure elements.

What are the key differences between LPC5514JBD64K and LPC55S14JBD64?

The LPC5514JBD64K lacks the CASPER crypto co-processor and Physical Unclonable Function (PUF) present in LPC55S14JBD64, though both share identical flash (128 KB), SRAM (80 KB), TrustZone®, PRINCE, CAN FD, and USB capabilities. LPC5514JBD64K is optimized for applications requiring foundational security (secure boot, AES, SHA, TRNG) without hardware-accelerated ECC or silicon fingerprinting. LPC5514JBD64K maintains full pin-to-pin compatibility with LPC55S14JBD64 in the HTQFP64 package.

Which analog peripherals are integrated into the LPC5514JBD64K?

The LPC5514JBD64K integrates a 16-bit successive-approximation ADC with five differential channel pairs (10 single-ended inputs), sample rates up to 2.0 Msamples/sec, and simultaneous dual-channel conversion capability. It also includes an analog comparator with five input pins and selectable internal/external reference voltage, plus an integrated temperature sensor connected directly to the ADC. These peripherals operate from the VDDA/VSSA analog domain and support hardware-triggered conversions synchronized to timer events.

What package type and thermal characteristics does the LPC5514JBD64K use?

The LPC5514JBD64K uses the HTQFP64 package: a plastic low-profile quad flat package with 64 leads, 10 × 10 × 0.5 mm body dimensions, and 0.5 mm lead pitch. It features an exposed thermal pad for enhanced heat dissipation and is rated for operation from −40 °C to +105 °C. The package supports standard PCB assembly processes and provides 36 GPIO pins in this variant, with thermal resistance (θ_JA) specified at 42 °C/W under JEDEC JESD51-7 conditions.