NXP Semiconductors LPC5514JBD64Y

Overview

LPC5514JBD64Y from NXP Semiconductors is a 32-bit Arm Cortex-M33 microcontroller designed for secure embedded applications, featuring 128 KB flash, 80 KB SRAM, TrustZone® security, PRINCE flash encryption, CASPER crypto acceleration, and CAN FD interface in a 64-pin HTQFP package. It operates up to 150 MHz and integrates a 16-bit 2.0 Msamples/sec ADC, SCTimer/PWM, PLU, USB full-speed/host, and temperature sensor - deployed in industrial gateways requiring firmware integrity and real-time fieldbus communication.

For engineers reviewing the LPC5514JBD64Y datasheet, LPC5514JBD64Y pinout, LPC5514JBD64Y application, or LPC5514JBD64Y equivalent, key selection criteria include its 128 KB flash/80 KB SRAM configuration, absence of PUF and Secure Boot (vs. LPC55S1x), HTQFP64 thermal performance, and CAN FD + USB FS dual-interface capability for edge node control.

Technical Context

The LPC5514JBD64Y implements Arm TrustZone® at the hardware level to isolate secure and non-secure execution states, with memory protection enforced by an MPU and cryptographic services routed through dedicated peripherals including HASH-AES and PRINCE. Its clock system combines FROs (96 MHz, 32 kHz, 1 MHz), crystal oscillators (12–32 MHz, 32.768 kHz), and dual PLLs enabling deterministic timing for real-time control loops.

Peripheral routing uses a flexible I/O configuration engine (IOCON) supporting up to 16 function options per pin, with Flexcomm interfaces 0–7 configurable as USART/SPI/I2C/I2S - five of which support I2S channel pairs. The SCTimer/PWM provides 16 capture/match registers and 32 states for complex waveform generation, while DMA0 (23 channels) and DMA1 (10 channels) offload data movement from CPU across ADC, USB, CAN FD, and GPIO.

Key Specifications

Pinout & Package

HTQFP64 package with 64 leads, body size 10 × 10 × 0.5 mm, 0.5 mm pitch, and exposed thermal pad for enhanced thermal performance in continuous industrial operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC55S14JBD64, LPC5514JBD64Y omits PUF and Secure Boot but retains PRINCE and HASH-AES for asset protection; versus LPC5524JBD64, it trades flash/SRAM capacity for lower unit cost in resource-constrained control applications.

Availability

LPC5514JBD64Y is available at Aetrix Electronics and suitable for industrial motor control, secure edge gateways, medical sensor hubs, and automotive body electronics requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for LPC5514JBD64Y includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 50 years of embedded systems expertise and ISO 9001-certified manufacturing.

The LPC551x series targets cost-sensitive, security-aware embedded applications where hardware-accelerated flash encryption and CAN FD connectivity are essential - balancing performance, power efficiency, and tamper resistance without premium secure-boot features.

FAQ

What is the maximum operating frequency of the LPC5514JBD64Y?

The LPC5514JBD64Y runs at a maximum CPU frequency of 150 MHz using its Arm Cortex-M33 core. This speed is achievable with internal FRO 96 MHz or PLL-synthesized clocks derived from FRO, crystal, or RTC sources. The device maintains timing compliance across its full −40 °C to +105 °C operating range, with FRO accuracy specified at ±2% over voltage and temperature.

Does the LPC5514JBD64Y support secure boot functionality?

No, the LPC5514JBD64Y does not include secure boot capability. Unlike the LPC55S1x family, it lacks RSA signature verification, x509 certificate validation, and revocable Root of Trust keys. It does support PRINCE flash encryption and HASH-AES for runtime data protection, but boot image authentication must be implemented externally or omitted per application requirements.

How many GPIO pins are available on the LPC5514JBD64Y in the HTQFP64 package?

The LPC5514JBD64Y provides 36 GPIO pins in the HTQFP64 package. This count is confirmed in Table 2 of the datasheet under the "GPIO" column for all JBD64 variants. Each GPIO supports up to 16 configurable functions via IOCON registers, including ADC inputs, comparator channels, Flexcomm peripherals, and secure GPIO modes.

What USB capabilities does the LPC5514JBD64Y offer?

The LPC5514JBD64Y integrates a USB 2.0 full-speed host/device controller with on-chip PHY and dedicated DMA. It supports crystal-less operation in device mode using internal FRO trimming, eliminating the need for an external 12 MHz crystal. It does not include USB high-speed (HS) functionality - that feature is reserved for LPC55S1x and LPC552x variants.

Is the LPC5514JBD64Y pin-compatible with other LPC55xx devices in HTQFP64?

Yes, the LPC5514JBD64Y shares identical pinout and package dimensions (HTQFP64, SOT 855-5) with LPC55S14JBD64, LPC5524JBD64, and LPC5516JBD64. Signal mapping, power/ground pin locations, and thermal pad layout are consistent across this package variant, enabling direct PCB reuse when migrating between these models based on memory, security, or peripheral requirements.