NXP Semiconductors LPC5516JBD64E
- Part No.:
- LPC5516JBD64E
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
LPC5516JBD64E.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 64HTQFP
- Quantity:
- Payment:

- Shipping:

Inventory:161
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Product details
Overview
LPC5516JBD64E from NXP Semiconductors is a 32-bit Arm Cortex-M33 microcontroller designed for secure embedded applications requiring cryptographic acceleration, real-time control, and low-power operation. It integrates 256 KB flash, 96 KB SRAM, PRINCE flash encryption, CASPER crypto co-processor, CAN FD, USB full-speed and high-speed interfaces, and a 16-bit 2.0 Msamples/sec ADC. It operates up to 150 MHz and supports TrustZone® isolation for firmware integrity in industrial gateways and secure IoT edge nodes.
For engineers reviewing the LPC5516JBD64E datasheet, LPC5516JBD64E pinout, LPC5516JBD64E application, or LPC5516JBD64E equivalent, key selection criteria include its HTQFP64 package with 36 GPIOs, absence of TrustZone and PUF (vs. LPC55S16 variants), PRINCE-enabled secure flash updates, and CAN FD + dual USB capability - all validated for automotive body electronics and industrial PLC I/O modules.
Technical Context
The LPC5516JBD64E implements an Arm Cortex-M33 core (r0p4) with FPU, MPU, and NVIC, running at up to 150 MHz with integrated DSP instructions but without TrustZone or PUF hardware - distinguishing it from LPC55S1x siblings. Its security architecture relies on PRINCE-based flash encryption, HASH-AES engine, TRNG, and secure boot using RSA-2048/4096 signatures, enabling certified firmware validation without silicon-level isolation.
It features nine Flexcomm peripherals (USART/SPI/I2C/I2S configurable), a dedicated CAN FD controller with DMA, SCTimer/PWM with 16 capture/match registers, five 32-bit general-purpose timers, and a 24-bit multi-rate timer. Analog subsystem includes a 16-bit ADC with simultaneous dual-channel sampling, comparator, and integrated temperature sensor - all accessible via 36 GPIO pins in HTQFP64 package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 (r0p4), 150 MHz max - delivers deterministic real-time control with DSP extensions for motor control or audio preprocessing. |
| Memory | 256 KB flash + 96 KB SRAM (16 KB code bus, 64 KB system bus, 16 KB USB SRAM) - supports dual-bank OTA updates and USB buffer offloading. |
| Security | PRINCE flash encryption/decryption, HASH-AES engine, TRNG, RSA-2048/4096 secure boot - enables field-upgradable encrypted firmware without TrustZone hardware. |
| Connectivity | CAN FD + USB 2.0 full-speed & high-speed (with on-chip PHY) - meets automotive diagnostics (UDS over CAN FD) and host/device bridging requirements. |
| Analog | 16-bit ADC, 2.0 Msamples/sec, 5 differential/10 single-ended channels, simultaneous dual-channel conversion - suitable for precision current/voltage sensing in power converters. |
| Timers | Five 32-bit CTIMERs, SCTimer/PWM (10 outputs, 8 inputs), RTC with wake-up from deep power-down, WWDT - enables complex PWM generation and low-power scheduling. |
| Package | HTQFP64, 10 × 10 × 0.5 mm, 0.5 mm pitch - compatible with standard PCB assembly processes and offers 36 GPIOs for compact industrial control designs. |
Pinout & Package
HTQFP64 package (SOT 855-5), 10 × 10 × 0.5 mm body, 0.5 mm lead pitch, exposed thermal pad. Pin functions are software-configurable via IOCON registers; default reset state disables most pull-ups/pull-downs except specific debug and boot pins (e.g., PIO0_5 determines boot source).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0–PIO0_35 | Configurable GPIO / peripheral multiplexing | 36 general-purpose I/Os supporting UART, SPI, I2C, I2S, CAN FD, ADC, comparator, and SCTimer signals - enables flexible interface routing without external logic. |
| VDD / VSS | Power supply / ground | Single 1.8–3.6 V supply with internal DC-DC converter - simplifies power design and reduces external component count. |
| XTAL_IN / XTAL_OUT | External crystal oscillator input/output | Supports 12–32 MHz crystals for precise clocking; internal FRO provides 96/12 MHz backup - eliminates need for external oscillator in cost-sensitive designs. |
| USB_DP / USB_DM | USB 2.0 differential data pair | Integrated HS/FS PHY with crystal-less FS operation - enables USB device functionality without external crystal, reducing BOM cost. |
| CAN_H / CAN_L | CAN FD transceiver interface | Dedicated differential pair supporting ISO 11898-1 compliant signaling up to 5 Mbps - suitable for automotive and industrial networked sensors. |
Key Features
| Feature | Design Value |
|---|---|
| PRINCE Flash Encryption | Real-time AES-128 encryption/decryption of on-chip flash during read/write - protects firmware IP and enables secure over-the-air updates without external crypto ICs. |
| CASPER Crypto Co-processor | Hardware acceleration for ECC scalar multiplication (NIST P-256/P-384) - reduces CPU load and latency for TLS handshake and device attestation in constrained edge devices. |
| Flexcomm Interface | Nine software-configurable serial peripherals (USART/SPI/I2C/I2S) with shared fractional baud-rate generator - allows dynamic reassignment of communication interfaces at runtime for multi-protocol gateways. |
| SCTimer/PWM | State-configurable timer with 16 match/capture registers and 32 states - supports complex waveform generation (e.g., three-phase motor control, lighting dimming) without CPU intervention. |
| ADC with Simultaneous Sampling | 16-bit resolution, 2.0 Msamples/sec, dual-channel simultaneous conversion on differential pairs - enables accurate current/voltage measurement in switched-mode power supplies. |
Applications
| Industrial PLC I/O Module | Automotive Body Control Unit |
|---|---|
Use Scenario: Modular digital/analog I/O expansion for programmable logic controllers handling sensor inputs and actuator outputs in factory automation. IC Role / Device Role / Timing Role: Central MCU managing CAN FD fieldbus communication, analog current loop (4–20 mA) conditioning via ADC, and isolated GPIO control with precise timing for PWM-driven valves. Use Value: PRINCE-encrypted firmware prevents unauthorized configuration changes; 36 GPIOs and dual USB support HMI debugging and firmware updates without interrupting CAN traffic. |
Use Scenario: Centralized control of door locks, window lifts, lighting, and HVAC actuators in 12 V vehicle architectures. IC Role / Device Role / Timing Role: Real-time CAN FD node executing safety-critical diagnostics (UDS), driving LIN transceivers via UART, and monitoring battery voltage/current via 16-bit ADC. Use Value: 150 MHz Cortex-M33 ensures sub-millisecond response to CAN messages; integrated TRNG and secure boot meet ISO/SAE 21434 cybersecurity requirements. |
| Secure IoT Edge Gateway | Medical Sensor Hub |
Use Scenario: Low-power gateway aggregating BLE/Wi-Fi sensor data, performing local analytics, and forwarding encrypted payloads to cloud via cellular or Ethernet. IC Role / Device Role / Timing Role: Trusted execution environment for TLS 1.3 stack using CASPER-accelerated ECC, with USB HS host for peripheral attachment and RTC wake-up for scheduled data bursts. Use Value: PRINCE + HASH-AES enable end-to-end payload encryption; 96 KB SRAM accommodates multiple concurrent TLS sessions and protocol stacks. |
Use Scenario: Portable patient monitor collecting ECG, temperature, and SpO₂ data with local anomaly detection before transmission. IC Role / Device Role / Timing Role: High-fidelity analog front-end controller with simultaneous 16-bit ADC sampling across differential leads, comparator-based arrhythmia trigger, and secure bootloader for FDA-compliant firmware updates. Use Value: 2.0 Msamples/sec ADC resolves microvolt-level ECG signals; secure boot and device UUID ensure traceability and regulatory compliance (IEC 62304). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC55S16JBD64 | Includes TrustZone, PUF, and CASPER; same flash/SRAM/CAN FD/USB specs. | Required for applications needing hardware-enforced secure enclave (e.g., payment terminals, secure boot root-of-trust). | Select when silicon-level isolation and device-unique key generation are mandatory - LPC5516JBD64 lacks these features. |
| LPC5526JBD64 | Same package and core, but adds 1 MB flash, 256 KB SRAM, and dual CAN FD channels. | Suitable for complex gateway applications requiring larger code footprint and redundant CAN networks. | Choose for future-proofing or higher memory density; LPC5516JBD64 remains optimal for cost-sensitive, single-CAN FD designs. |
Compared with LPC55S16JBD64, the LPC5516JBD64 omits TrustZone and PUF but retains PRINCE, CASPER, and CAN FD - making it ideal for applications needing strong firmware encryption without hardware isolation overhead. Versus LPC5526JBD64, it trades memory capacity for lower unit cost and power consumption in resource-constrained edge nodes.
Availability
LPC5516JBD64E is available at Aetrix Electronics and suitable for industrial PLC I/O modules, automotive body control units, secure IoT edge gateways, and medical sensor hubs requiring stable component supply across extended product lifecycles.
Supply support for LPC5516JBD64E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with R&D centers across Europe, Asia, and North America.
The LPC551x series targets cost-optimized, secure embedded control applications where PRINCE-based flash encryption and CAN FD connectivity are essential, but hardware-enforced TrustZone isolation is not required.
FAQ
What is the maximum operating frequency of the LPC5516JBD64E?
The LPC5516JBD64E operates at a maximum CPU frequency of 150 MHz, enabled by its Arm Cortex-M33 core with integrated flash accelerator and PLL clock synthesis. This speed is sustained across the full industrial temperature range (−40 °C to +105 °C) and 1.8–3.6 V supply, making LPC5516JBD64E suitable for real-time control tasks such as motor commutation and protocol stack processing.
Does the LPC5516JBD64E support TrustZone security technology?
No, the LPC5516JBD64E does not include Arm TrustZone hardware. Unlike the LPC55S1x variants, this part omits TrustZone and PUF, relying instead on PRINCE flash encryption, HASH-AES, and secure boot with RSA-2048/4096 signatures for firmware protection. The LPC5516JBD64E is designed for applications where cryptographic enforcement suffices without silicon-level memory isolation.
How many GPIO pins are available on the LPC5516JBD64E in HTQFP64 package?
The LPC5516JBD64E in HTQFP64 package provides 36 GPIO pins (PIO0_0 through PIO0_35), each configurable via IOCON registers for digital I/O, peripheral functions (UART, SPI, I2C, CAN FD), ADC inputs, or comparator channels. This count is confirmed in Table 2 of the datasheet and reflects the reduced pin count versus 64-pin HLQFP variants.
What USB capabilities does the LPC5516JBD64E support?
The LPC5516JBD64E integrates both USB 2.0 full-speed and high-speed host/device controllers with on-chip PHYs. Full-speed mode supports crystal-less operation using internal FRO, while high-speed mode requires external 12 MHz clock. Both interfaces share dedicated DMA controllers and 16 KB USB SRAM, enabling simultaneous host-peripheral and device-host communication in LPC5516JBD64E-based designs.
Is the LPC5516JBD64E pin-compatible with other LPC55xx family members in HTQFP64?
Yes, the LPC5516JBD64E shares identical pinout and package (HTQFP64, SOT 855-5) with LPC55S16JBD64, LPC5514JBD64, and LPC55S14JBD64. Signal mapping, power/ground pin locations, and debug interface (SWD) pins are functionally identical, allowing direct PCB reuse across these variants - though firmware must account for feature differences like TrustZone or PUF presence.
LPC5516JBD64E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- LPC551x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x16b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC5516JBD64E FAQ
1.How can I place an order for LPC5516JBD64E through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC5516JBD64E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC5516JBD64E reliable?
The price and inventory of LPC5516JBD64E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC5516JBD64E is usually 5 days.
3.What payment methods are accepted for LPC5516JBD64E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC5516JBD64E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC5516JBD64E?
LPC5516JBD64E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC5516JBD64E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC5516JBD64E?
For technical support, including LPC5516JBD64E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC5516JBD64E requirements.
6.How does Aetrix verify that LPC5516JBD64E is sourced from the original manufacturer or authorized distributors?
All LPC5516JBD64E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC5516JBD64E meets industry standards.
7.What is the process for return or replacement of LPC5516JBD64E?
All LPC5516JBD64E units undergo pre-shipment inspection (PSI). If there is an issue with LPC5516JBD64E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC5516JBD64E part is unused and in its original packaging.
Return procedure for LPC5516JBD64E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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