NXP Semiconductors LPC5526JBD100E

Overview

LPC5526JBD100 from NXP Semiconductors is a 32-bit Arm Cortex-M33 microcontroller operating at up to 150 MHz, featuring 256 KB on-chip flash, 144 KB SRAM, full-speed and high-speed USB interfaces, and 64 GPIO pins. It integrates a 16-bit 1.0 Msamples/sec ADC, SCTimer/PWM, PRINCE flash encryption, and supports SDIO for embedded industrial control and secure IoT edge nodes.

For engineers reviewing the LPC5526JBD100 datasheet, LPC5526JBD100 pinout, LPC5526JBD100 application, or LPC5526JBD100 equivalent, key selection considerations include its HLQFP100 package, absence of CASPER crypto co-processor and PUF, secure boot capability via RSA-2048/4096, and compatibility with NXP's MCUXpresso SDK and LPCXpresso55S26 development boards.

Technical Context

The LPC5526JBD100 implements an Arm Cortex-M33 core with Memory Protection Unit (MPU), FPU, DSP extensions, and ETM trace support, running at up to 150 MHz using PLL0/PLL1 clock sources derived from internal FROs or external crystals. Its memory subsystem includes 256 KB flash (512-byte page erase/write) and 144 KB SRAM-comprising 32 KB Code Bus SRAM, 96 KB System Bus SRAM, and 16 KB USB-dedicated SRAM.

Peripheral integration centers on nine Flexcomm interfaces (FC0–FC8), each configurable as USART/SPI/I2C/I2S, plus dedicated SDIO, dual USB (FS+HS), SCTimer/PWM with 10 outputs, five general-purpose timers, RTC, MRT, WWDT, PLU, TRNG, and analog peripherals including a 16-bit ADC with simultaneous differential sampling and integrated temperature sensor.

Key Specifications

Pinout & Package

Package: HLQFP100 (SOT1570-3), 100-pin plastic low-profile quad flat package, body size 14 × 14 × 0.5 mm, 0.5 mm pitch, lead finish matte tin.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC5526JBD100, the LPC55S26JBD100 adds CASPER and PUF for advanced cryptographic operations but shares identical power, timing, and peripheral architecture; the LPC5526JEV98 offers identical functionality in a smaller BGA package but requires PCB redesign due to incompatible pinout and soldering process.

Availability

LPC5526JBD100 is available at Aetrix Electronics and suitable for industrial motor control, secure edge gateways, smart building sensor hubs, and medical wearable controllers requiring stable component supply across multi-year production cycles.

Supply support for LPC5526JBD100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC552x series targets cost-optimized, secure embedded applications where full cryptographic acceleration is not required - delivering M33 performance, PRINCE encryption, and rich analog/digital peripherals in standard packages like HLQFP100.

FAQ

Does LPC5526JBD100 support secure boot, and what cryptographic algorithms does it use?

Yes, LPC5526JBD100 supports secure boot using RSASSA-PKCS1-v1_5 signatures of SHA256 digests, validated against RSA-2048 or RSA-4096 public keys stored in x.509 certificates. It enforces anti-rollback via image key revocation and stores Root of Trust hashes in protected flash. The LPC5526JBD100 implements these features in ROM bootloader without requiring CASPER or PUF hardware.

What is the maximum ADC sampling rate supported by LPC5526JBD100, and does it support differential mode?

The LPC5526JBD100 integrates a 16-bit ADC capable of 1.0 Msamples/sec with simultaneous conversion on two channels within a differential pair. It supports five differential input pairs (10 single-ended channels), and differential sampling is enabled by configuring ANAMODE and DIGIMODE bits in the IOCON register for corresponding pins like PIO0_9/PIO0_11.

Can LPC5526JBD100 operate without an external crystal, and which clocks support crystal-less operation?

Yes, LPC5526JBD100 supports crystal-less operation for USB full-speed device mode using its internal 96 MHz FRO trimmed to ±1% accuracy (0°C to 85°C). The 32 kHz FRO also operates without external crystal for RTC and WWDT. However, USB high-speed mode and precise timing-critical applications require an external 12 MHz or 32.768 kHz crystal.

How many Flexcomm interfaces does LPC5526JBD100 provide, and what protocols can they support?

LPC5526JBD100 provides nine Flexcomm interfaces (FC0–FC8), each configurable in software as USART, SPI, I2C, or I2S. FC8 is dedicated to high-speed SPI only. All Flexcomm blocks include FIFOs, fractional baud-rate generators, and timeout features - enabling concurrent mixed-protocol communication such as I2C sensor reads and SPI display updates without CPU intervention.

What power-saving modes are available on LPC5526JBD100, and how is wake-up managed?

LPC5526JBD100 supports Sleep, Deep-sleep (with RAM retention), Power-down (with RAM/CPU retention), and Deep power-down (with RAM retention). Wake-up is configurable from RTC alarms, Micro-Tick Timer events, GPIO pin interrupts (PINT/GINT), or peripheral triggers like UART receive. The 32 kHz FRO or external 32.768 kHz crystal clocks the RTC for sub-second wake-up precision.