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NXP Semiconductors LPC5526JBD100K
- Part No.:
- LPC5526JBD100K
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP Exposed Pad
- Datasheet:
-
LPC5526JBD100K.pdf
- Description:
- IC MCU 32BIT 256KB FLSH 100HLQFP
- Quantity:
- Payment:
- Shipping:
Inventory:447
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Product details
Overview
LPC5526JBD100K from NXP is a 150 MHz Arm Cortex-M33 microcontroller with 256 KB flash, 144 KB SRAM, dual USB (FS/HS) with on-chip PHY, SDIO interface, and integrated power management - deployed in industrial IoT gateways requiring secure firmware updates and real-time sensor aggregation.
For engineers reviewing the LPC5526JBD100K datasheet, LPC5526JBD100K pinout, LPC5526JBD100K application, or LPC5526JBD100K equivalent, key selection criteria include flash/SRAM capacity, FlexComm configurability (UART/SPI/I²C/I²S), SRAM PUF-based root-of-trust, PRINCE on-the-fly encryption support, and HLQFP100 package compatibility with thermal and routing constraints for dense industrial PCBs.
Technical Context
The LPC5526JBD100K implements a single Arm Cortex-M33 core with FPU and SIMD extensions, operating at up to 150 MHz, and integrates a dedicated Crypto Engine supporting AES-256 and SHA-2 without software overhead. It lacks Arm TrustZone but delivers hardware-enforced security via SRAM PUF, PRINCE, and secure debug lockdown.
Its system architecture includes two DMA controllers (22-channel + 10-channel), eight FlexComm peripherals configurable as UART/SPI/I²C/I²S, one SCTimer/PWM, RTC, and micro-timer - all synchronized by a Clock Generation Unit with System PLL and USB PLL, enabling deterministic timing for industrial control loops and USB audio streaming.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ 150 MHz with FPU and SIMD - enables floating-point math for motor control and sensor fusion without external coprocessor |
| Memory | 256 KB flash + 144 KB SRAM - supports dual-bank OTA updates and real-time data buffering for edge inference workloads |
| Security | SRAM PUF + PRINCE + AES-256/SHA-2 crypto engine - provides hardware-rooted device identity and encrypted code execution from flash |
| Connectivity | FS/HS USB with on-chip PHY + SDIO + 8× FlexComm - eliminates external transceivers and enables direct SD card boot and HID-class peripheral attachment |
| Analog | 16-bit 1 MSPS ADC + ACMP + temperature sensor - supports high-precision analog monitoring in building automation sensors |
| Power | Single Vdd supply with POR/BOD and DC converter - simplifies power design for battery-backed industrial nodes with low-power sleep modes |
Pinout & Package
Package: HLQFP100 (14 × 14 mm, 0.5 mm pitch, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA/VSSA | Analog power/ground | Separate analog domain for ADC/ACMP reference stability; requires local decoupling near pin |
| USB_DP/USB_DM | High-speed USB differential pair | On-chip HS USB PHY - no external transceiver needed; routed as controlled-impedance 90 Ω differential trace |
| SDIO_CLK/SDIO_CMD/SDIO_D[0:3] | SDIO bus signals | Direct interface to SD memory cards or eMMC - supports 4-bit wide mode at up to 50 MHz |
| FLEXCOMM0–7_TXD/RXD/SCK/SS | Configurable serial I/O | Each FlexComm block can be independently set as UART, SPI, I²C, or I²S - reduces need for external protocol bridges |
| PIN_INT[0:3] | Programmable interrupt inputs | Dedicated GPIO pins with glitch filtering and wake-up capability from deep-sleep - used for tamper detection or sensor event triggering |
Key Features
| Feature | Design Value |
|---|---|
| SRAM PUF | Hardware-generated unique device key derived from SRAM startup state - eliminates need for external secure element or fuse programming |
| PRINCE encryption | Real-time AES-128 decryption of flash contents during execution - enables IP protection without performance penalty in boot or runtime |
| FlexComm interface | Eight independent serial peripherals, each software-configurable as UART/SPI/I²C/I²S - cuts BOM cost and board space vs. discrete bridge ICs |
| Integrated DC-DC converter | On-die buck regulator supporting 1.1 V core voltage from 1.8–3.6 V input - reduces external power components and improves efficiency in battery-powered nodes |
| Secure debug lockdown | One-time programmable debug disable after production - prevents unauthorized firmware extraction or JTAG access in field-deployed devices |
Applications
| Industrial Gateway | Building Automation Controller |
|---|---|
Use Scenario: Aggregating Modbus RTU, BACnet MS/TP, and BLE sensor data into a unified MQTT stream for cloud telemetry. IC Role / Device Role / Timing Role: Central protocol translator and secure edge node - manages concurrent serial protocols via FlexComm blocks and enforces TLS handshake using hardware crypto acceleration. Use Value: Reduces latency and firmware complexity by offloading SHA-256 and AES-256 operations from software, while SRAM PUF ensures unique device identity per gateway unit. | Use Scenario: HVAC zone controller with local PID loop execution, occupancy sensing, and remote firmware update over HTTPS. IC Role / Device Role / Timing Role: Real-time embedded controller - runs deterministic control loops at 10 ms intervals using SCTimer/PWM and reads 16-bit ADC data from temperature/humidity sensors. Use Value: Integrated 16-bit ADC and micro-timer eliminate external signal conditioning and timing ICs, shrinking bill-of-materials and PCB area. |
| Secure Diagnostic Tool | Edge Data Logger |
Use Scenario: Portable medical diagnostic equipment performing encrypted ECG waveform capture and HIPAA-compliant local storage. IC Role / Device Role / Timing Role: Secure acquisition and storage controller - uses PRINCE to decrypt firmware on boot and encrypt raw sensor data before writing to SDIO-connected eMMC. Use Value: Hardware-accelerated AES-256 and on-the-fly flash decryption prevent side-channel attacks and ensure regulatory compliance without CPU overhead. | Use Scenario: Remote environmental monitor logging soil moisture, air quality, and solar irradiance every 15 minutes to SD card. IC Role / Device Role / Timing Role: Low-power data concentrator - enters deep-sleep between samples, wakes via RTC alarm, and initializes SDIO interface only during write cycles. Use Value: Single Vdd operation with integrated DC-DC converter extends battery life beyond 2 years on two AA cells, validated under IEC 60730 Class B requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC55S26JBD100K | Includes SRAM PUF, PRINCE, and full crypto engine (AES-256/SHA-2); same flash/SRAM/package | Required where secure boot, encrypted firmware execution, or device provisioning is mandatory | Select LPC55S26JBD100K when cryptographic root-of-trust and on-the-fly decryption are non-negotiable for compliance or certification |
| LPC5526JET100K | Same silicon die but in VFBGA98 package (9 × 9 mm, 0.8 mm pitch); no thermal pad; different pinout | Suitable for space-constrained designs where thermal dissipation is less critical than footprint | Choose LPC5526JET100K only if PCB layout prioritizes compactness over thermal performance and reworkability |
Compared with LPC5526JBD100K, the LPC55S26JBD100K adds hardware security features essential for certified secure boot, while the LPC5526JET100K trades thermal performance and repairability for smaller footprint - making the LPC5526JBD100K optimal for thermally demanding industrial gateways needing reliable long-term operation.
Availability
LPC5526JBD100K is available at Aetrix Electronics and suitable for industrial IoT gateways, building automation controllers, and secure diagnostic tools requiring stable component supply across multi-year production cycles.
Supply support for LPC5526JBD100K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC552x family targets cost-sensitive industrial and consumer edge devices requiring robust security, real-time responsiveness, and high integration - delivering Arm Cortex-M33 performance without TrustZone, optimized for 40-nm flash process and broad enablement via MCUXpresso.
FAQ
What is the maximum operating frequency of the LPC5526JBD100K?
The LPC5526JBD100K operates at a maximum CPU frequency of 150 MHz using the Arm Cortex-M33 core with FPU and SIMD support. This clock speed is achievable under specified voltage and temperature conditions per the official NXP datasheet, and it enables real-time processing for industrial control and sensor fusion tasks without requiring external clock sources or overclocking.
Does the LPC5526JBD100K support secure boot and hardware-based encryption?
No, the LPC5526JBD100K does not include SRAM PUF, PRINCE, or the full crypto engine - unlike the LPC55S2x series. While it retains AES-256/SHA-2 acceleration, it lacks on-the-fly encrypted execution and hardware-rooted provisioning. For full secure boot capability, the LPC55S26JBD100K is the functionally aligned alternative within the same package.
Which development boards are compatible with the LPC5526JBD100K?
The LPCXpresso55S28 Development Board (LPC55S28-EVK) is officially supported for the LPC5526JBD100K due to pin, peripheral, and software compatibility across the LPC552x/S2x families. It provides onboard Link2 debug probe, high-speed USB, Arduino®/PMod expansion headers, and MCUXpresso SDK integration - enabling rapid evaluation of FlexComm, USB, and SDIO functionality specific to the LPC5526JBD100K.
What package type is used for the LPC5526JBD100K?
The LPC5526JBD100K uses the HLQFP100 package: a 100-pin heat-sinked low-profile quad flat pack measuring 14 × 14 mm with 0.5 mm pitch and an exposed thermal pad. This package supports high-density routing and efficient thermal dissipation in industrial-grade PCBs, and is distinct from the VFBGA98 variant (LPC5526JET100K) used in space-constrained applications.
Can the LPC5526JBD100K execute code directly from encrypted flash?
No, the LPC5526JBD100K cannot execute code directly from encrypted flash because it omits the PRINCE real-time decryption engine. That feature is exclusive to the LPC55S2x series. The LPC5526JBD100K supports hardware-accelerated AES-256 and SHA-2 for secure communications and firmware validation, but decrypted image loading must occur in RAM - limiting its use in applications requiring strict IP protection during runtime.
LPC5526JBD100K Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP Exposed Pad
- Series:
- LPC552x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O:
- 64
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 144K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x16b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC5526JBD100K FAQ
1.How can I place an order for LPC5526JBD100K through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC5526JBD100K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC5526JBD100K reliable?
The price and inventory of LPC5526JBD100K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC5526JBD100K is usually 5 days.
3.What payment methods are accepted for LPC5526JBD100K?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC5526JBD100K transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC5526JBD100K?
LPC5526JBD100K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC5526JBD100K order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC5526JBD100K?
For technical support, including LPC5526JBD100K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC5526JBD100K requirements.
6.How does Aetrix verify that LPC5526JBD100K is sourced from the original manufacturer or authorized distributors?
All LPC5526JBD100K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC5526JBD100K meets industry standards.
7.What is the process for return or replacement of LPC5526JBD100K?
All LPC5526JBD100K units undergo pre-shipment inspection (PSI). If there is an issue with LPC5526JBD100K, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC5526JBD100K part is unused and in its original packaging.
Return procedure for LPC5526JBD100K:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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