NXP Semiconductors LPC5526JBD100Y

Overview

LPC5526JBD100Y from NXP Semiconductors is a 32-bit Arm Cortex-M33 microcontroller operating at up to 150 MHz, featuring 256 KB on-chip flash, 144 KB SRAM, full-speed and high-speed USB interfaces, and 64 GPIO pins. It integrates a 16-bit 1.0 Msamples/sec ADC, SCTimer/PWM, PRINCE flash encryption, and supports secure boot for industrial edge sensor nodes requiring deterministic real-time control and firmware integrity.

For engineers reviewing the LPC5526JBD100Y datasheet, LPC5526JBD100Y pinout, LPC5526JBD100Y application, or LPC5526JBD100Y equivalent, key selection criteria include its HLQFP100 package with 100 leads, absence of CASPER crypto co-processor and PUF controller (vs. LPC55S26), SDIO support, and compatibility with NXP's MCUXpresso SDK and LPCXpresso55S26 development board for rapid prototyping.

Technical Context

The LPC5526JBD100Y implements an Arm Cortex-M33 core with Memory Protection Unit (MPU), FPU, and DSP extensions, running at up to 150 MHz using PLL0/PLL1 clock sources derived from internal FRO or external crystal oscillators. Its memory subsystem includes 256 KB flash (512-byte page erase) and 144 KB SRAM-comprising 32 KB Code Bus SRAM, 96 KB System Bus SRAM, and 16 KB USB SRAM.

Peripheral architecture centers on nine Flexcomm interfaces (FC0–FC8), each configurable as USART/SPI/I2C/I2S, plus dedicated SDIO, USB FS/HS controllers, SCTimer/PWM with 10 outputs, five general-purpose timers, RTC, MRT, WWDT, and a 16-bit ADC with simultaneous dual-channel sampling. Security relies on PRINCE-based flash encryption and RSA-2048/4096 secure boot-but excludes CASPER, PUF, and HASH-AES hardware accelerators present in S-series variants.

Key Specifications

Pinout & Package

Package: HLQFP100 - plastic low-profile quad flat package, 100 leads, 14 × 14 × 0.5 mm body, 0.5 mm pitch (SOT1570-3).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC5526JBD100Y, the LPC55S26JBD100 adds hardware crypto acceleration critical for TLS handshake offload and secure key management, while the LPC5526JBD64 trades pin count and package size for PCB area savings-both maintain identical CPU performance, flash/SRAM sizing, and peripheral feature set except GPIO count and security IP.

Availability

LPC5526JBD100Y is available at Aetrix Electronics and suitable for industrial edge sensor nodes, smart home hubs, medical wearables, and PLC I/O modules requiring stable component supply, long-term lifecycle assurance, and NXP-qualified production-grade silicon.

Supply support for LPC5526JBD100Y includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with headquarters in Eindhoven, Netherlands.

The LPC552x series targets cost-sensitive, security-aware embedded applications where cryptographic acceleration is optional-delivering Arm Cortex-M33 performance, PRINCE-based firmware protection, and rich peripheral integration without CASPER/PUF overhead.

FAQ

What is the maximum operating frequency of the LPC5526JBD100Y?

The LPC5526JBD100Y operates at a maximum CPU frequency of 150 MHz, achieved using PLL0 or PLL1 clock sources derived from internal FRO (12 MHz or 96 MHz), external crystal (16–32 MHz), or RTC oscillator (32.768 kHz). This frequency is fully supported across the -40 °C to +105 °C industrial temperature range and confirmed in the Rev. 2.3 datasheet.

Does the LPC5526JBD100Y include the CASPER crypto co-processor?

No, the LPC5526JBD100Y does not include the CASPER crypto co-processor. As specified in Table 2 of the datasheet, CASPER, PUF, HASH-AES, and secure boot hardware acceleration are exclusive to the LPC55S2x variants. The LPC5526JBD100Y supports software-based cryptography and PRINCE flash encryption but lacks dedicated asymmetric crypto hardware.

What package type and pin count does the LPC5526JBD100Y use?

The LPC5526JBD100Y uses the HLQFP100 package: a plastic low-profile quad flat package with 100 leads, 14 × 14 × 0.5 mm body dimensions, and 0.5 mm pitch (SOT1570-3). This matches the pinout and footprint of other LPC55S2x/LPC552x devices in the same package variant, enabling hardware reuse across S- and non-S series.

Which development tools support the LPC5526JBD100Y?

The LPC5526JBD100Y is fully supported by NXP's MCUXpresso SDK, IDE, and Config Tools. It is compatible with the LPCXpresso55S26 development board (OM13085), which provides debug, power, and peripheral headers matching the HLQFP100 pinout. Flash programming is enabled via USB HID, UART, SPI, or I2C using the on-chip ROM bootloader.

What security features are implemented in the LPC5526JBD100Y?

The LPC5526JBD100Y implements PRINCE-based real-time flash encryption/decryption, RSA-2048/4096 secure boot with x.509 certificate validation, anti-rollback via image key revocation, and protected flash regions for Root of Trust storage. It lacks CASPER, PUF, and HASH-AES hardware blocks-security relies on software libraries and PRINCE for confidentiality, with RSA for authenticity.