NXP Semiconductors LPC5526JBD64E
- Part No.:
- LPC5526JBD64E
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
LPC5526JBD64E.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 64TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:156
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Product details
Overview
LPC5526JBD64E from NXP Semiconductors is a 32-bit Arm Cortex-M33 microcontroller operating at up to 150 MHz, featuring 256 KB on-chip flash, 144 KB SRAM, full-speed and high-speed USB interfaces, and integrated SDIO support - deployed in secure industrial edge nodes requiring real-time control and firmware integrity verification.
For engineers reviewing the LPC5526JBD64E datasheet, LPC5526JBD64E pinout, LPC5526JBD64E application, or LPC5526JBD64E equivalent, key selection considerations include its HTQFP64 package with 36 GPIOs, absence of CASPER crypto co-processor and PRINCE/PUF/Secure Boot modules (distinguishing it from LPC55S2x variants), and verified compatibility with LPC5528JBD64 and LPC5526JBD100 in shared peripheral routing and power domain architecture.
Technical Context
The LPC5526JBD64E implements a dual-bus AHB matrix architecture supporting concurrent access to flash, SRAM, and peripherals, with five 32-bit general-purpose timers, one SCTimer/PWM (8 inputs / 10 outputs), and a 24-bit Multi-Rate Timer for deterministic interrupt scheduling. Its Flexcomm interface subsystem provides nine configurable serial peripherals - each selectable as USART, SPI, I2C, or I2S - with dedicated FIFOs and fractional baud-rate generators.
Analog capability centers on a 16-bit, 1.0 Msamples/sec ADC with five differential channel pairs (10 single-ended), internal temperature sensor, and dual comparators; clocking includes dual FROs (96 MHz ±1% and 32 kHz ±2%), crystal oscillators (16–32 MHz and 32.768 kHz), and two PLLs enabling CPU operation at maximum frequency without external high-frequency crystals.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ up to 150 MHz - delivers deterministic real-time execution with TrustZone-enabled memory isolation. |
| Flash Memory | 256 KB on-chip flash with 512-byte page erase - enables field firmware updates with minimal wear and fast sector reprogramming. |
| SRAM | 144 KB total (32 KB Code Bus + 96 KB System Bus + 16 KB USB SRAM) - supports simultaneous USB DMA and application code execution. |
| USB Interface | Full-speed and high-speed USB host/device with on-chip PHY - eliminates need for external transceivers and supports crystal-less FS device operation. |
| ADC | 16-bit, 1.0 Msamples/sec with simultaneous dual-channel conversion - captures synchronized analog signals for motor current sensing or audio preprocessing. |
| GPIO Count | 36 user-accessible GPIO pins in HTQFP64 package - sufficient for mixed-signal I/O expansion while maintaining compact PCB footprint. |
| Operating Voltage | 1.8 V to 3.6 V single supply - compatible with Li-ion battery systems and industrial 3.3 V rails without level-shifting. |
| Temperature Range | −40 °C to +105 °C - qualified for under-hood automotive ECUs and industrial PLC modules. |
Pinout & Package
Package: HTQFP64 (10 × 10 × 0.5 mm, pitch 0.5 mm, SOT855-5). Pinout validated per NXP datasheet Rev. 2.3 Table 3 (HTQFP64 column) and Figure 2 marking diagram.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0 | General-purpose I/O / ACMP0_A input | Configurable digital I/O or analog comparator input A - enables zero-crossing detection without external components. |
| FC3_SCK | Flexcomm 3 clock | Shared clock source for SPI/I2C/USART - simplifies multi-protocol sensor hub design with single peripheral instance. |
| CTIMER0_MAT0 | Timer match output 0 | Hardware-generated PWM signal - drives LED dimming or gate driver timing without CPU intervention. |
| SCT0_GPI0 | SCTimer input 0 | Event-triggered state machine input - synchronizes logic transitions to external encoder pulses or safety signals. |
| SD1_CARD_INT_N | SD/MMC card interrupt | Active-low interrupt signaling card insertion/removal - enables hot-plug storage management in data loggers. |
| SWCLK | Serial Wire Debug clock | Standard JTAG/SWD debug interface - supports production programming and field firmware recovery via CMSIS-DAP. |
Key Features
| Feature | Design Value |
|---|---|
| Flexible Serial Peripherals | Nine software-configurable Flexcomm interfaces (USART/SPI/I2C/I2S) with FIFOs - reduces BOM count by eliminating dedicated protocol ICs. |
| High-Resolution Analog | 16-bit ADC with simultaneous dual-channel sampling and internal temperature sensor - enables closed-loop thermal compensation in power converters. |
| Dual-Clock Domain Timers | Five independent 32-bit timers + SCTimer/PWM + MRT + RTC - supports multi-rate scheduling for motor control, communication stacks, and low-power wake-up. |
| Power Management | Integrated PMU with Sleep/Deep-sleep/Power-down modes and RTC/Micro-Tick wake-up sources - achieves sub-10 µA retention current in battery-backed applications. |
| Robust Clocking | Dual FROs (96 MHz ±1%, 32 kHz ±2%) + crystal oscillators + PLLs - eliminates external crystal dependency while meeting ±50 ppm timing requirements for USB and SDIO. |
| Secure I/O | Secure GPIO and pin interrupt controllers - isolates critical I/O paths from non-secure firmware domains in TrustZone-based system designs. |
Applications
| Industrial Motor Control | Smart Energy Metering |
|---|---|
Use Scenario: Field-oriented control of BLDC motors in HVAC compressors with real-time current feedback and thermal monitoring. IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, ADC sampling motor phase currents at 1 MS/s, and generating PWM via SCTimer with <100 ns jitter. Use Value: 36 GPIOs route Hall sensors, enable signals, and status LEDs; 144 KB SRAM buffers three-phase current waveforms for harmonic analysis. |
Use Scenario: DIN-rail mounted electricity meter performing Class 0.5S metrology with tamper detection and remote firmware updates. IC Role / Device Role / Timing Role: Metrology processor interfacing isolated sigma-delta ADCs, managing secure OTA updates over cellular modem via USB HS interface. Use Value: Dual USB (FS + HS) enables local configuration and high-throughput firmware download; SDIO supports encrypted event logging to removable media. |
| Medical Point-of-Care Device | Automotive Body Controller |
Use Scenario: Portable ultrasound probe with analog front-end synchronization, touch UI, and battery telemetry. IC Role / Device Role / Timing Role: System-on-chip managing time-of-flight calculations, capacitive touch decoding, and Li-ion fuel gauging via ADC and comparator. Use Value: 16-bit ADC resolves microvolt-level echo signals; 105°C rating ensures reliability inside sealed handheld enclosures. |
Use Scenario: Door module controlling window lift, mirror fold, and interior lighting with LIN bus diagnostics. IC Role / Device Role / Timing Role: Central body controller running AUTOSAR-compliant MCAL drivers, using Flexcomm 0 as LIN transceiver and CTIMER for PWM window motor control. Use Value: HTQFP64 package fits constrained door module PCB; −40°C to +105°C range meets automotive ambient requirements without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC5528JBD64 | 512 KB flash, 256 KB SRAM, identical package and peripheral set - no crypto/security modules. | Supports larger firmware images and extended data buffering for protocol stacks or OTA update staging. | Select when application requires >256 KB flash but does not need CASPER/PRINCE/PUF features. |
| LPC5526JBD100 | Same core, memory, and feature set - packaged in HLQFP100 with 64 GPIOs and full peripheral pinout availability. | Enables higher I/O density for complex sensor fusion or multi-interface gateway designs. | Select when board layout requires more GPIOs or additional Flexcomm/ADC channels routed to pins. |
Compared with LPC5526JBD64E, LPC5528JBD64 offers double flash capacity for complex connectivity stacks, while LPC5526JBD100 provides 28 additional GPIOs and full peripheral accessibility - both retain identical security-disabled architecture and HTQFP64/HLQFP100 thermal profiles.
Availability
LPC5526JBD64E is available at Aetrix Electronics and suitable for industrial motor control, smart energy metering, medical point-of-care devices, and automotive body controllers requiring stable component supply across extended product lifecycles.
Supply support for LPC5526JBD64E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 40 years of microcontroller innovation.
The LPC552x series targets cost-sensitive, high-reliability embedded applications where cryptographic acceleration is unnecessary - delivering Arm Cortex-M33 performance with simplified security architecture and broad peripheral integration.
FAQ
Does LPC5526JBD64E support Secure Boot or hardware encryption engines?
No. The LPC5526JBD64E excludes CASPER crypto co-processor, PRINCE flash encryption, PUF, and Secure Boot functionality - confirmed in Table 2 "Ordering Options" of the datasheet. It shares the same Arm Cortex-M33 core and peripheral set as the LPC55S2x family but omits all security modules. Designers requiring those features must select an LPC55S2x variant such as LPC55S26JBD64E.
What is the maximum ADC sampling rate achievable on LPC5526JBD64E?
The LPC5526JBD64E integrates a 16-bit ADC capable of 1.0 Msamples/sec with simultaneous conversions on two channels within a differential pair. This rate is sustained using internal clocking and supports triggered sampling via timer match events or external signals - verified in Section 2 "Features and benefits" and Figure 5 block diagram.
Which debug interface does LPC5526JBD64E use, and is SWD supported?
LPC5526JBD64E supports Serial Wire Debug (SWD) via dedicated SWCLK and SWO pins (PIO0_11 and PIO0_8 respectively), with Serial Wire Output trace capability. JTAG boundary scan is also supported using TRST/TCK/TMS/TDI/TDO pins (PIO0_2 to PIO0_6), as documented in Section 6.1 "Pin description" and Section 2 "Features and benefits".
Can LPC5526JBD64E operate without an external crystal?
Yes. The LPC5526JBD64E includes an internal 96 MHz Free Running Oscillator (FRO) trimmed to ±1% accuracy (0°C to 85°C), enabling full operation including USB full-speed device mode without external crystals. Crystal-less USB FS is explicitly supported per Section 2 "Features and benefits", and the FRO serves as primary system clock source.
What are the power supply requirements for LPC5526JBD64E?
LPC5526JBD64E operates from a single 1.8 V to 3.6 V supply, with internal DC-DC converter support for efficient voltage regulation. Brown-out detection (BOD) monitors VBAT_DCDC and triggers reset or interrupt at ~0.8 V, ensuring reliable startup and shutdown behavior - specified in Section 2 "Features and benefits" and Section 3 "Ordering information".
LPC5526JBD64E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- LPC552x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 144K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x16b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC5526JBD64E FAQ
1.How can I place an order for LPC5526JBD64E through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC5526JBD64E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC5526JBD64E reliable?
The price and inventory of LPC5526JBD64E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC5526JBD64E is usually 5 days.
3.What payment methods are accepted for LPC5526JBD64E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC5526JBD64E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC5526JBD64E?
LPC5526JBD64E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC5526JBD64E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC5526JBD64E?
For technical support, including LPC5526JBD64E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC5526JBD64E requirements.
6.How does Aetrix verify that LPC5526JBD64E is sourced from the original manufacturer or authorized distributors?
All LPC5526JBD64E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC5526JBD64E meets industry standards.
7.What is the process for return or replacement of LPC5526JBD64E?
All LPC5526JBD64E units undergo pre-shipment inspection (PSI). If there is an issue with LPC5526JBD64E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC5526JBD64E part is unused and in its original packaging.
Return procedure for LPC5526JBD64E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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