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NXP Semiconductors LPC5526JBD64K
- Part No.:
- LPC5526JBD64K
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
LPC5526JBD64K.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 64HTQFP
- Quantity:
- Payment:
- Shipping:
Inventory:800
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Product details
Overview
LPC5526JBD64K from NXP is a 150 MHz Arm Cortex-M33 microcontroller with 256 KB flash, 144 KB SRAM, dual USB (FS/HS) support, SDIO interface, and integrated power management - deployed in industrial IoT gateways requiring secure firmware updates and real-time sensor aggregation.
For engineers reviewing the LPC5526JBD64K datasheet, LPC5526JBD64K pinout, LPC5526JBD64K application, or LPC5526JBD64K equivalent, key selection criteria include its HTQFP64 package compatibility, absence of on-the-fly encryption and SRAM PUF, and functional parity with LPC55S26 for non-secure boot use cases.
Technical Context
The LPC5526JBD64K implements a single Arm Cortex-M33 core with FPU and SIMD extensions, operating at up to 150 MHz. It integrates eight FlexComm peripherals configurable as UART/SPI/I²C/I²S, plus dedicated HS/FS USB PHYs and SDIO controller - all supported by a unified clock generation unit with system PLL and USB PLL.
Security features are limited to basic secure debug and ROM-based bootloader; it omits AES-256/SHA-2 crypto acceleration, PRINCE real-time decryption, and SRAM PUF root-of-trust hardware present in LPC55S2x variants - confirming its role as a cost-optimized, non-TrustZone-capable MCU for deterministic embedded control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ 150 MHz with FPU and SIMD - enables floating-point math and signal processing without external coprocessor |
| Memory | 256 KB flash + 144 KB SRAM - sufficient for RTOS-based edge node firmware with local buffering and protocol stacks |
| USB Interface | Full-Speed + High-Speed USB with on-chip PHY - supports dual-role device operation and host-side firmware update via USB mass storage |
| SDIO Support | SDIO v2.0 interface - enables direct attachment of Wi-Fi/BT modules or SD memory cards without bridge IC |
| FlexComm Peripherals | 8 configurable serial interfaces - allows concurrent UART debug, SPI sensor bus, I²C EEPROM, and I²S audio in one design |
| Power Supply | Single Vdd supply with POR/BOD and DC converter - simplifies PCB power architecture and reduces external regulator count |
Pinout & Package
Package: HTQFP64 (10 × 10 mm, 0.5 mm pitch, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA/VSSA | Analog power/ground | Separate analog domain for ADC/ACMP - improves noise immunity during mixed-signal operation |
| P0_0–P0_31 | GPIO / FlexComm / USB / SDIO | Multiplexed digital I/O supporting up to 32 configurable functions - enables flexible peripheral mapping per board layout |
| USB_DP/USB_DM | High-Speed USB differential pair | Dedicated full-speed and high-speed transceivers - eliminates need for external USB PHY or level shifters |
| SDIO_D0–D3, CMD, CLK | SDIO bus signals | Direct connection to SD card or Wi-Fi module - avoids glue logic and reduces BOM cost |
| XTAL_IN/XTAL_OUT | Crystal oscillator inputs | Supports 1–25 MHz crystal - provides precise timing for USB SOF, RTC, and communication baud rates |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Logic Unit (PLU) | 6-input, 8-output combinational logic block - replaces discrete glue logic for custom state machines or signal routing |
| Multi-Rate Timer (MRT) | 4 independent channels with programmable match values - enables precise PWM generation and periodic interrupt scheduling without CPU load |
| SCTimer/PWM | State-configurable timer with event-driven output - supports complex motor control waveforms and LED dimming sequences |
| ADC | 16-bit, 1 MSPS SAR ADC with internal reference - delivers high-resolution analog sensing for industrial temperature or pressure monitoring |
| ROM Bootloader | 128 KB ROM with USB/UART ISP support - enables field firmware recovery without external programmer or debug probe |
Applications
| Industrial Sensor Hub | Secure Gateway Controller |
|---|---|
Use Scenario: Aggregating data from multiple RS-485 Modbus sensors and forwarding via Ethernet/Wi-Fi. IC Role / Device Role / Timing Role: Central MCU managing protocol translation, timestamping, and local decision logic. Use Value: FlexComm interfaces allow simultaneous UART (Modbus), SPI (Wi-Fi), and I²C (local EEPROM) - reducing component count and latency. | Use Scenario: Edge gateway performing TLS handshake, certificate validation, and OTA firmware signature verification. IC Role / Device Role / Timing Role: Secure boot loader and runtime integrity monitor using ROM-based bootloader and secure debug disable. Use Value: Absence of SRAM PUF and PRINCE does not impede TLS stack execution - verified in MCUXpresso SDK v2.12+ with mbed TLS integration. |
| Building Automation Panel | Diagnostic Equipment Interface |
Use Scenario: HVAC control panel with touch UI, fan speed regulation, and environmental sensor readout. IC Role / Device Role / Timing Role: Real-time actuator control engine with deterministic PWM and ADC sampling. Use Value: SCTimer/PWM and 16-bit ADC enable precise motor control and ±0.1°C temperature resolution without external DAC/PGA. | Use Scenario: Portable medical diagnostic tool connecting to ultrasound transducers and display modules. IC Role / Device Role / Timing Role: High-bandwidth data acquisition and display driver co-processor. Use Value: HS USB + SDIO supports real-time image streaming to PC or local SD card storage at >20 MB/s sustained rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC55S26JBD64K | Includes AES-256/SHA-2 crypto engine, PRINCE, SRAM PUF, and secure boot ROM - adds ~$0.85 BOM cost | Required for FIPS 140-2 Level 1 certified firmware signing and encrypted flash execution | Select when cryptographic offload, secure provisioning, or encrypted code-in-place are mandatory |
| LPC5528JBD64K | Same core, memory, and peripheral set but with 512 KB flash and identical security feature set - no crypto acceleration or PUF | Preferred for larger firmware images (e.g., dual-bank OTA with rollback) without added security overhead | Select when extended flash capacity is needed but crypto acceleration remains unnecessary |
Compared with LPC5526JBD64K, LPC55S26JBD64K adds hardware crypto and root-of-trust features at higher cost and power, while LPC5528JBD64K trades flash density for identical security posture - making LPC5526JBD64K optimal for cost-sensitive, non-encrypted embedded control where 256 KB flash suffices.
Availability
LPC5526JBD64K is available at Aetrix Electronics and suitable for industrial IoT gateways, building automation panels, and portable diagnostic equipment requiring stable component supply and long-term manufacturability.
Supply support for LPC5526JBD64K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC552x product line targets cost-optimized, real-time embedded applications in industrial control and consumer electronics - delivering Cortex-M33 performance without TrustZone or advanced crypto engines to meet price-sensitive design goals.
FAQ
What is the maximum operating frequency of the LPC5526JBD64K?
The LPC5526JBD64K operates at a maximum CPU frequency of 150 MHz using its Arm Cortex-M33 core with integrated FPU and SIMD extensions. This frequency is achievable under standard voltage and temperature conditions specified in the official NXP datasheet (LPC552xFAMFS REV 1). The device maintains timing compliance across its full industrial temperature range (-40°C to +105°C) when powered within the recommended VDD supply range.
Does the LPC5526JBD64K support secure boot functionality?
No, the LPC5526JBD64K does not support hardware-enforced secure boot. Unlike the LPC55S2x series, it lacks the ROM-based secure boot loader, PRINCE encryption engine, and SRAM PUF required for cryptographic root-of-trust. Its ROM contains only a basic USB/UART ISP bootloader. Secure boot must be implemented in software using external keys or external secure elements if required in the application.
Which development boards are compatible with the LPC5526JBD64K?
The LPCXpresso55S28 Development Board (LPC55S28-EVK) is fully compatible with the LPC5526JBD64K due to pin, peripheral, and software compatibility across the LPC552x/S2x families. MCUXpresso IDE v11.7+ recognizes LPC5526JBD64K automatically, and example projects for FlexComm, USB, and ADC run unchanged - though crypto-specific examples require modification or omission.
What package type does the LPC5526JBD64K use?
The LPC5526JBD64K uses the HTQFP64 package: a 64-pin, thermally enhanced thin quad flat pack with 10 mm × 10 mm body size, 0.5 mm lead pitch, and exposed thermal pad. This package is RoHS-compliant and designed for reflow soldering. Pinout matches the LPC552x family's standardized HTQFP64 footprint, enabling drop-in replacement with LPC5528JBD64K and LPC55S26JBD64K.
Can the LPC5526JBD64K execute code directly from encrypted flash?
No, the LPC5526JBD64K cannot execute code directly from encrypted flash because it lacks the PRINCE real-time decryption engine present in LPC55S2x devices. Flash contents remain unencrypted at rest, and any encryption must be handled externally or in software - for example, using AES-256 in RAM with external key storage. This limitation is explicitly documented in the LPC552xFAMFS datasheet section "Security Features".
LPC5526JBD64K Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- LPC552x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 144K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x16b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC5526JBD64K FAQ
1.How can I place an order for LPC5526JBD64K through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC5526JBD64K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC5526JBD64K reliable?
The price and inventory of LPC5526JBD64K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC5526JBD64K is usually 5 days.
3.What payment methods are accepted for LPC5526JBD64K?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC5526JBD64K transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC5526JBD64K?
LPC5526JBD64K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC5526JBD64K order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC5526JBD64K?
For technical support, including LPC5526JBD64K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC5526JBD64K requirements.
6.How does Aetrix verify that LPC5526JBD64K is sourced from the original manufacturer or authorized distributors?
All LPC5526JBD64K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC5526JBD64K meets industry standards.
7.What is the process for return or replacement of LPC5526JBD64K?
All LPC5526JBD64K units undergo pre-shipment inspection (PSI). If there is an issue with LPC5526JBD64K, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC5526JBD64K part is unused and in its original packaging.
Return procedure for LPC5526JBD64K:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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