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NXP Semiconductors LPC5526JBD64Y

Part No.:
LPC5526JBD64Y
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-TQFP Exposed Pad
Datasheet:
AetrixLPC5526JBD64Y.pdf
Description:
IC MCU 32BIT 256KB FLASH 64TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,500

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Product details

Overview

LPC5526JBD64Y from NXP Semiconductors is a 32-bit Arm Cortex-M33 microcontroller operating at up to 150 MHz, featuring 256 KB on-chip flash, 144 KB SRAM, full-speed and high-speed USB interfaces, and integrated SDIO support - deployed in secure industrial edge nodes requiring real-time control and firmware integrity.

For engineers reviewing the LPC5526JBD64Y datasheet, LPC5526JBD64Y pinout, LPC5526JBD64Y application, or LPC5526JBD64Y equivalent, this page delivers verified specifications, HTQFP64 package mapping, security feature implementation details, and validated alternative MCUs for industrial IoT and embedded control designs.

Technical Context

The LPC5526JBD64Y implements a dual-bus AHB matrix architecture with separate code and system buses, enabling concurrent flash access and peripheral operation. Its memory subsystem includes 32 KB SRAM on the code bus and 112 KB contiguous SRAM on the system bus, plus 16 KB dedicated USB SRAM.

Security is enforced via hardware-accelerated SHA-2/AES modules, PRINCE flash encryption (though not enabled in LPC552x series), and boot authentication using RSA-2048/4096 signatures - all managed through ROM-based secure bootloader supporting SB2 image format and debug authentication protocol v1.0/v1.1.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreArm Cortex-M33 @ 150 MHz with FPU, DSP, MPU, and ETM trace
Flash Memory256 KB on-chip flash with 512-byte page erase/write and accelerator
SRAM144 KB total: 32 KB code bus + 96 KB system bus + 16 KB USB SRAM
USB InterfaceFull-speed (FS) and high-speed (HS) USB host/device with on-chip PHY and crystal-less FS operation
ADC16-bit, 1.0 Msamples/sec, 5 differential/10 single-ended channels with simultaneous conversion capability
GPIO36 general-purpose I/O pins with configurable functions, secure GPIO support, and pin-interrupt capability
Operating VoltageSingle 1.8 V to 3.6 V supply with internal DC-DC converter
Temperature Range–40 °C to +105 °C industrial grade operation

Pinout & Package

Package: HTQFP64 (plastic low-profile quad flat package, 64 leads, 10 × 10 × 0.5 mm pitch, SOT855-5).

Pin/Terminal Circuit Role Design Meaning
PIO0_0General-purpose I/O / ACMP0_A inputDigital I/O or analog comparator input A when analog mode enabled
PIO0_1General-purpose I/O / FC3_CTS_SDA_SSEL0Flexcomm 3 I2C data, SPI slave select, or USART CTS function
PIO0_2/TRSTJTAG Test Reset / FC3_MISOBoundary scan reset input; defaults to Flexcomm 3 SPI MISO in ISP mode
PIO0_3/TCKJTAG Test Clock / FC3_MOSIJTAG clock input; defaults to Flexcomm 3 SPI MOSI in ISP mode
PIO0_4/TMSJTAG Test Mode Select / FC3_SSEL0JTAG state machine control; defaults to Flexcomm 3 SPI slave select 0
PIO0_5/TDIJTAG Test Data In / Boot Source SelectorBoot source determined by logic level at reset; enables ISP handler if low
PIO0_6/TDOJTAG Test Data Out / FC3_SCKJTAG output; defaults to Flexcomm 3 SPI clock in ISP mode
SWCLKSerial Wire Debug ClockPrimary debug clock input; active after boot, supports SWD programming
SWOSerial Wire Output TraceAsynchronous trace output for instruction and data flow visibility
VDDMain Power Supply1.8–3.6 V core supply; powers CPU, memories, and most peripherals

Key Features

Feature Design Value
Secure Boot ArchitectureRSASSA-PKCS1-v1_5 signature verification of SHA256 digest using RSA-2048/4096 keys and x.509 certificate validation
Flexible Serial InterfacesNine Flexcomm peripherals (FC0–FC8) configurable as USART, SPI, I2C, or I2S with FIFOs and fractional baud-rate generators
Programmable Logic Unit (PLU)On-chip combinational/sequential logic engine enabling custom state machines without CPU intervention
Power ManagementFive low-power modes (Sleep, Deep-sleep, Power-down, Deep power-down, and CPU retention) with RTC and Micro-Tick Timer wake-up sources
Analog Subsystem16-bit ADC with simultaneous dual-channel sampling, integrated temperature sensor, and five-input comparator with internal/external reference
Clock SystemMultiple oscillators: 96 MHz/12 MHz FRO, 32 kHz FRO, 1 MHz low-power FRO, 16–32 MHz crystal oscillator, and dual PLLs for flexible CPU/peripheral clocking

Applications

Industrial Edge Gateway Secure Smart Metering

Use Scenario: Local aggregation and preprocessing of sensor data before cloud upload in factory automation systems.

IC Role / Device Role / Timing Role: Main controller executing real-time control loops, managing USB/SDIO-connected peripherals, and enforcing secure OTA updates.

Use Value: 150 MHz Cortex-M33 performance enables concurrent protocol stack execution (Modbus TCP, MQTT), while hardware AES accelerates encrypted telemetry transmission.

Use Scenario: Tamper-resistant electricity/water meter with firmware integrity enforcement and secure key storage.

IC Role / Device Role / Timing Role: Root-of-trust MCU validating signed firmware images and protecting cryptographic keys via PUF-derived entropy.

Use Value: RSA-4096 boot authentication and SHA-256 hash engine ensure only authorized firmware executes, meeting IEC 62056 and DLMS/COSEM security requirements.

Medical Diagnostic Handheld Automotive Body Control Module

Use Scenario: Portable ultrasound or ECG device requiring high-resolution analog acquisition and responsive UI rendering.

IC Role / Device Role / Timing Role: Central processor handling 1.0 Msamples/sec ADC sampling, FFT-based signal processing, and USB HID interface to PC.

Use Value: Simultaneous dual-channel ADC conversion and dedicated USB SRAM reduce latency in waveform capture and transfer.

Use Scenario: Low-voltage vehicle subsystem controlling lighting, door locks, and HVAC with functional safety awareness.

IC Role / Device Role / Timing Role: Safety-aware controller monitoring watchdog timers, executing ASIL-B diagnostics, and managing CAN-FD communication via external transceiver.

Use Value: Windowed Watchdog Timer (WWDT) and CRC engine enable runtime self-checks compliant with ISO 26262 ASIL-B decomposition requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
LPC55S26JBD64Includes CASPER crypto co-processor, PRINCE flash encryption, PUF, and full secure boot support - absent in LPC5526JBD64YSuitable for applications requiring hardware-accelerated ECC, dynamic key generation, and encrypted firmware storageSelect when cryptographic offload, secure key lifecycle management, or PRINCE-protected assets are required
LPC5528JBD64Same LPC552x family, but with 512 KB flash and 256 KB SRAM vs. 256 KB flash and 144 KB SRAM in LPC5526JBD64YBetter suited for complex firmware stacks, larger OTA images, or extended data logging buffersChoose when additional non-volatile program storage or RAM headroom is needed without upgrading to S-series security features

Compared with LPC5526JBD64Y, LPC55S26JBD64 adds hardware crypto acceleration and secure key provisioning, while LPC5528JBD64 trades security depth for increased memory capacity - enabling selection based on whether firmware integrity or code footprint is the dominant constraint.

Availability

LPC5526JBD64Y is available at Aetrix Electronics and suitable for industrial edge gateways, secure smart metering, and medical diagnostic handhelds requiring stable component supply across multi-year production cycles.

Supply support for LPC5526JBD64Y includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 40 years of microcontroller innovation.

The LPC552x product line targets cost-optimized, secure embedded applications where full cryptographic acceleration is unnecessary but robust boot integrity, USB/SDIO connectivity, and industrial temperature operation remain essential.

FAQ

What is the maximum operating frequency of the LPC5526JBD64Y?

The LPC5526JBD64Y operates at a maximum CPU frequency of 150 MHz, achieved using its Arm Cortex-M33 core with integrated FPU and DSP extensions. This frequency is sustained across the full industrial temperature range (–40 °C to +105 °C) under 1.8–3.6 V supply conditions. The chip uses PLL0 or PLL1 clock sources derived from internal FRO or external crystals to reach this rate without requiring high-frequency external oscillators.

Does the LPC5526JBD64Y support secure boot, and what cryptographic algorithms does it use?

Yes, the LPC5526JBD64Y supports secure boot using RSASSA-PKCS1-v1_5 signatures of SHA256 digests, validated against RSA-2048 or RSA-4096 public keys stored in x.509 certificates. It enforces anti-rollback via image key revocation and supports up to four root-of-trust keys. However, unlike the LPC55S2x series, it lacks PRINCE flash encryption and CASPER crypto co-processor acceleration.

How many GPIO pins does the LPC5526JBD64Y provide in the HTQFP64 package?

The LPC5526JBD64Y in HTQFP64 package provides 36 usable GPIO pins. These include standard digital I/O, analog inputs (ADC/ACMP), secure GPIO functionality, and configurable peripheral multiplexing via IOCON registers. Pins such as PIO0_2 through PIO0_6 default to JTAG functions but can be reassigned to GPIO or Flexcomm roles after reset configuration.

What USB capabilities does the LPC5526JBD64Y offer?

The LPC5526JBD64Y integrates both full-speed (12 Mbps) and high-speed (480 Mbps) USB 2.0 host/device controllers with on-chip PHYs. Full-speed mode supports crystal-less operation using internal FRO trimming, eliminating the need for an external 12 MHz crystal. Dedicated USB SRAM (16 KB) and DMA channels optimize bandwidth for HID, CDC, or mass-storage class implementations.

Is the LPC5526JBD64Y pin-compatible with other members of the LPC55S2x/LPC552x family?

The LPC5526JBD64Y shares identical HTQFP64 pinout and footprint with LPC55S26JBD64 and LPC5528JBD64, enabling PCB reuse across variants. All three support the same peripheral mappings, voltage ranges, and thermal specifications. However, differences in flash size, SRAM allocation, and security features require firmware and BOM adjustments despite mechanical compatibility.

LPC5526JBD64Y Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-TQFP Exposed Pad
Series:
LPC552x
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
144K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC5526JBD64Y FAQ

1.How can I place an order for LPC5526JBD64Y through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC5526JBD64Y on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC5526JBD64Y reliable?

The price and inventory of LPC5526JBD64Y are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC5526JBD64Y is usually 5 days.

3.What payment methods are accepted for LPC5526JBD64Y?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC5526JBD64Y transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC5526JBD64Y?

LPC5526JBD64Y orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC5526JBD64Y order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC5526JBD64Y?

For technical support, including LPC5526JBD64Y datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC5526JBD64Y requirements.

6.How does Aetrix verify that LPC5526JBD64Y is sourced from the original manufacturer or authorized distributors?

All LPC5526JBD64Y products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC5526JBD64Y meets industry standards.

7.What is the process for return or replacement of LPC5526JBD64Y?

All LPC5526JBD64Y units undergo pre-shipment inspection (PSI). If there is an issue with LPC5526JBD64Y, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC5526JBD64Y part is unused and in its original packaging.

Return procedure for LPC5526JBD64Y:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LPC5526JBD64Y Tags

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