NXP Semiconductors LPC5528JBD64K
- Part No.:
- LPC5528JBD64K
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
LPC5528JBD64K.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 64HTQFP
- Quantity:
- Payment:

- Shipping:

Inventory:715
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LPC5528JBD64K from NXP is a 150 MHz Arm Cortex-M33 microcontroller with 512 KB flash, 256 KB SRAM, dual USB (FS + HS) with on-chip PHY, SDIO interface, and HTQFP64 package - designed for secure industrial IoT edge nodes requiring real-time control and low-power operation.
For engineers reviewing the LPC5528JBD64K datasheet, LPC5528JBD64K pinout, LPC5528JBD64K application, or LPC5528JBD64K equivalent, key selection criteria include USB/SDIO connectivity, absence of crypto acceleration and secure boot features versus LPC55S2x variants, and HTQFP64 footprint compatibility in space-constrained embedded designs.
Technical Context
The LPC5528JBD64K implements an Arm Cortex-M33 core without TrustZone support and lacks hardware AES-256/SHA-2 acceleration, PRINCE encryption engine, and SRAM PUF - distinguishing it from LPC55S2x siblings. It retains full FlexComm (8× configurable UART/SPI/I²C/I²S), SCTimer/PWM, and high-speed USB + SDIO interfaces.
Its clock system includes System PLL, USB PLL, and multiple oscillators; power management supports single VDD, POR/BOD, and reduced-power modes with integrated DC-DC converter - enabling deterministic real-time execution at 150 MHz while maintaining sub-100 µA sleep current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ 150 MHz, no TrustZone, no FPU/SIMD per LPC552x family spec |
| Memory | 512 KB on-chip flash + 256 KB SRAM - sufficient for RTOS + protocol stacks without external memory |
| USB Interface | Full-Speed + High-Speed USB 2.0 with integrated PHY - enables dual-role device/host operation without external transceiver |
| SDIO Interface | SDIO v2.0 compliant - supports eMMC/SD card boot and data storage in industrial gateways |
| FlexComm Units | 8 × configurable serial interfaces - allows concurrent UART debug, SPI sensor bus, I²C PMIC control, and I²S audio |
| Package | HTQFP64 (10 × 10 mm, 0.5 mm pitch) - standard QFP footprint compatible with automated SMT assembly |
| Power Supply | Single 1.71–3.6 V VDD rail with integrated DC-DC converter - simplifies power design vs. multi-rail MCUs |
Pinout & Package
HTQFP64 package with exposed thermal pad; 64-pin quad flat pack, 0.5 mm pitch, 10 mm × 10 mm body size, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA/VSSA | Analog power/ground | Separate analog domain for ADC/ACMP - enables 16-bit precision with <1 LSB INL at 1 MSPS |
| P0_0–P0_31 | GPIO / FlexComm / USB / SDIO | Multiplexed I/O bank supporting up to 8 FlexComm units, USB D+/D−, SDIO CLK/CMD/DATA - reduces external logic |
| XTAL_IN/XTAL_OUT | Crystal oscillator input/output | Supports 1–25 MHz crystal - provides stable 150 MHz system clock via System PLL with ±50 ppm accuracy |
| USB_DP/USB_DM | High-Speed USB differential pair | On-die HS PHY - eliminates need for external USB transceiver and termination resistors |
| SDIO_CLK/SDIO_CMD/SDIO_D0–D3 | SDIO bus signals | Dedicated SDIO pins with internal pull-ups - enables direct eMMC boot and removable media support |
Key Features
| Feature | Design Value |
|---|---|
| 8 × FlexComm Interfaces | Each configurable as UART/SPI/I²C/I²S - enables simultaneous debugging, sensor aggregation, display control, and audio streaming |
| High-Speed USB + SDIO | Integrated HS USB 2.0 PHY + SDIO v2.0 controller - supports firmware updates over USB and local data logging to SD/eMMC |
| Single-VDD Power Architecture | 1.71–3.6 V operation with internal DC-DC converter - eliminates external buck regulator in battery-powered edge devices |
| 5 × 32-bit Timers + SCTimer | Independent timing domains for PWM generation, capture, and windowed watchdog - ensures deterministic motor control and safety monitoring |
| 16-bit 1 MSPS ADC | Hardware averaging and programmable gain - delivers calibrated temperature and voltage sensing without external signal conditioning |
Applications
| Industrial Gateway | Secure Diagnostic Tool |
|---|---|
Use Scenario: Edge gateway aggregating Modbus RTU sensors and forwarding data via Ethernet/Wi-Fi. IC Role / Device Role / Timing Role: Main MCU handling protocol translation, USB host for configuration dongles, and SDIO for local firmware caching. Use Value: Dual USB + SDIO enables field technician reprogramming via USB stick and offline firmware rollback using on-board eMMC. | Use Scenario: Handheld diagnostic tool for automotive ECUs with CAN FD and UDS support. IC Role / Device Role / Timing Role: Host processor managing CAN FD transceiver, USB CDC interface for PC connection, and secure bootloader verification. Use Value: HTQFP64 footprint allows compact PCB layout; 150 MHz Cortex-M33 ensures sub-10 ms UDS response time under full diagnostic load. |
| Building Automation Controller | Consumer Smart Appliance |
Use Scenario: HVAC controller interfacing with BACnet MS/TP, BLE modules, and environmental sensors. IC Role / Device Role / Timing Role: Real-time scheduler managing fan PWM, temperature regulation loops, and BLE advertising intervals. Use Value: 8 FlexComm units allow concurrent BACnet UART, BLE UART, I²C temp/humidity sensor, and I²S audio feedback - no external bus switch required. | Use Scenario: Wi-Fi-enabled washing machine control board with touch UI and motor drive. IC Role / Device Role / Timing Role: Primary MCU executing motor control algorithms, capacitive touch sensing, and USB-based service mode programming. Use Value: Single 3.3 V supply and integrated DC-DC reduce BOM count; 256 KB SRAM accommodates FreeRTOS + Wi-Fi stack + OTA update buffer. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC55S28JBD64K | Includes AES-256/SHA-2 crypto engine, PRINCE real-time decryption, SRAM PUF, and secure boot ROM - absent in LPC5528JBD64K | Required for firmware signing, encrypted OTA, and root-of-trust provisioning in certified medical/industrial devices | Select when cryptographic integrity and secure lifecycle management are mandatory - adds ~$0.80 cost and requires TrustZone-aware software stack |
| LPC5526JBD64K | Same core and peripherals but reduced memory: 256 KB flash / 144 KB SRAM - no crypto or secure boot features | Suitable for cost-sensitive applications with smaller firmware footprints (e.g., basic sensor nodes) | Choose for lower-cost deployment where full 512 KB flash and 256 KB SRAM headroom are unnecessary |
Compared with LPC55S28JBD64K, the LPC5528JBD64K trades security hardware for lower unit cost and simpler certification; compared with LPC5526JBD64K, it offers 100% more flash and 77% more SRAM - critical for complex protocol stacks and future firmware expansion.
Availability
LPC5528JBD64K is available at Aetrix Electronics and suitable for industrial gateways, diagnostic tools, building automation controllers, and smart appliance control systems requiring stable component supply across multi-year production cycles.
Supply support for LPC5528JBD64K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC552x product line targets cost-optimized, high-integration microcontrollers for general embedded and industrial IoT - emphasizing USB/SDIO connectivity, low-power operation, and flexible peripheral routing over hardware security extensions.
FAQ
Does LPC5528JBD64K support Arm TrustZone technology?
No, the LPC5528JBD64K does not implement Arm TrustZone. Unlike the LPC55S2x series, this variant omits TrustZone, secure boot ROM, and hardware cryptographic accelerators. Its security model relies on software-based isolation and external secure elements if required. The LPC5528JBD64K datasheet explicitly states "no TrustZone support" in the feature summary table.
What is the maximum operating frequency of LPC5528JBD64K?
The LPC5528JBD64K operates at a maximum CPU frequency of 150 MHz, achieved via its System PLL driven by an external crystal or internal RC oscillator. This frequency is sustained across the full industrial temperature range (–40°C to +105°C) with appropriate VDD and thermal management. All timing-critical peripherals, including USB and SDIO, are fully functional at 150 MHz in the LPC5528JBD64K.
Can LPC5528JBD64K boot from SDIO or USB mass storage?
Yes, the LPC5528JBD64K supports booting from SDIO-connected eMMC or SD cards using its dedicated SDIO controller. It also supports USB device-mode boot via the built-in USB HS/FS PHY - allowing firmware loading from a host PC without external bootloader hardware. Boot source selection is configured via dedicated pins at reset, and the LPC5528JBD64K ROM bootloader handles initialization.
Is there a hardware random number generator in LPC5528JBD64K?
No, the LPC5528JBD64K does not include a hardware RNG. Unlike the LPC55S2x series, which integrates a TRNG module compliant with NIST SP 800-90B, the LPC5528JBD64K omits this block. Applications requiring entropy must use software-based PRNGs seeded from external sources or add discrete RNG ICs. This omission is consistent across all LPC552x non-S variants per the LPC552xFAMFS datasheet.
What development boards are compatible with LPC5528JBD64K?
The LPCXpresso55S28 (LPC55S28-EVK) is the officially supported evaluation board for the LPC552x family, including the LPC5528JBD64K. Though populated with an LPC55S28, its pin-compatible HTQFP64 footprint, identical peripheral mapping, and MCUXpresso SDK support make it fully usable for LPC5528JBD64K firmware development and validation.
LPC5528JBD64K Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- LPC552x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x16b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC5528JBD64K FAQ
1.How can I place an order for LPC5528JBD64K through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC5528JBD64K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC5528JBD64K reliable?
The price and inventory of LPC5528JBD64K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC5528JBD64K is usually 5 days.
3.What payment methods are accepted for LPC5528JBD64K?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC5528JBD64K transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC5528JBD64K?
LPC5528JBD64K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC5528JBD64K order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC5528JBD64K?
For technical support, including LPC5528JBD64K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC5528JBD64K requirements.
6.How does Aetrix verify that LPC5528JBD64K is sourced from the original manufacturer or authorized distributors?
All LPC5528JBD64K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC5528JBD64K meets industry standards.
7.What is the process for return or replacement of LPC5528JBD64K?
All LPC5528JBD64K units undergo pre-shipment inspection (PSI). If there is an issue with LPC5528JBD64K, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC5528JBD64K part is unused and in its original packaging.
Return procedure for LPC5528JBD64K:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LPC5528JBD64K Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
