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NXP Semiconductors LPC5534JBD64E
- Part No.:
- LPC5534JBD64E
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
LPC5534JBD64E.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 64HTQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,296
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Product details
Overview
LPC5534JBD64E from NXP Semiconductors is a 32-bit ARM Cortex-M33 microcontroller designed for secure, low-power embedded applications. It operates at up to 150 MHz, integrates 128 KB on-chip flash and 96 KB SRAM, features CAN FD, FlexSPI with 8 KB cache, and supports crystal-less USB Full-Speed device operation. It targets industrial control, sensor fusion, and edge AI inference where deterministic real-time response and power efficiency are critical.
For engineers reviewing the LPC5534JBD64E datasheet, LPC5534JBD64E pinout, LPC5534JBD64E application, or LPC5534JBD64E equivalent, key selection considerations include its HTQFP64 package (64-pin, 10 × 10 mm), 39 GPIOs, dual FlexPWM subsystem (24 outputs), 13-channel ADC, and absence of integrated USB host - distinguishing it from LPC5536 variants.
Technical Context
The LPC5534JBD64E implements an ARM Cortex-M33 core with TrustZone security, FPU, MPU, and NVIC, enabling secure firmware partitioning and deterministic interrupt handling. Its PowerQuad DSP accelerator offloads fixed/floating-point math using four dedicated 4 KB SRAM banks, accelerating FFT, filtering, and ML inference kernels without CPU intervention.
Peripherals are tightly coupled via multilayer AHB matrix and dual DMA controllers (52 + 16 channels), supporting concurrent high-bandwidth operations: FlexSPI XIP from external flash, simultaneous 4-channel ADC sampling at 2.0 Msps, and real-time motor control via two FlexPWM modules with 24 PWM outputs and dual QEI interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M33 @ 150 MHz with FPU, MPU, TrustZone, and NVIC - enables secure real-time execution with hardware-enforced memory isolation. |
| Memory | 128 KB flash (246 KB usable) + 96 KB SRAM (16 KB Code Bus + 80 KB System Bus) - sufficient for RTOS, crypto stacks, and sensor fusion buffers. |
| Analog I/O | 4× 16-bit ADC (2.0 Msps, 4 simultaneous channels), 3× 12-bit DAC (1 Msps), 4 comparators, 3 OpAmps - supports closed-loop analog control and audio preprocessing. |
| Serial Interfaces | 8× Flexcomm (configurable USART/SPI/I2C/I2S), 1× I3C, 1× CAN FD, 1× DMIC - enables multi-protocol connectivity including automotive-grade CAN FD and digital microphone arrays. |
| Timers & Control | 5× 32-bit CTimers, SCTimer/PWM (16 match/capture registers), 2× FlexPWM (24 outputs), 2× QEI, RTC with calendar - suitable for motor control, encoder feedback, and time-stamped event logging. |
| Package & Environment | HTQFP64 (10 × 10 × 0.5 mm, 64 leads), −40 °C to +105 °C operating range - compatible with industrial PCB layouts requiring thermal reliability and moderate pin count. |
| Power Management | Integrated DC-DC converter + LDO, Sleep/Deep-sleep/Power-down modes, RTC and Micro-tick Timer wake-up sources - achieves sub-μA deep-sleep current for battery-powered edge nodes. |
Pinout & Package
Package: HTQFP64 - plastic low-profile quad flat package, 64 leads, 10 × 10 × 0.5 mm body, pitch 0.5 mm (SOT855-6).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0 / ACMP0_A | GPIO / Comparator Input A | Configurable digital I/O or analog comparator input; default reset state is high-impedance (Z) - enables flexible signal routing without pull conflicts. |
| PIO0_5 / CAN0_TD | GPIO / CAN Transmitter Output | Primary CAN FD transmit pin; boot source selection depends on its state at reset - requires external pull-up for reliable ISP entry. |
| PIO0_7 / HSCMP1_IN0 | GPIO / High-Speed Comparator Input 0 | Second boot configuration pin; paired with PIO0_5 to select flash, ROM, or ISP mode - critical for field firmware recovery. |
| FLEXSPI0_DATA0–3 | FlexSPI Data Lines | Quad/octal SPI data bus for external flash XIP; supports DMA-driven execute-in-place - eliminates code copy overhead for large firmware images. |
| FC3_TXD_SCL_MISO_WS | Flexcomm 3 Multiplexed I/O | Shared USART TX / I2C clock / SPI MISO / I2S word select - software-selectable per application need, reducing pin count pressure. |
Key Features
| Feature | Design Value |
|---|---|
| Crystal-less USB FS Device | Eliminates 12 MHz crystal and associated load capacitors, reducing BOM cost and board area while maintaining ±0.25% timing accuracy via internal FRO calibration. |
| PowerQuad DSP Accelerator | Offloads FFT, FIR/IIR filtering, and CMSIS-NN kernels using dedicated SRAM banks - frees Cortex-M33 for application logic and reduces total system power by >30% vs. pure-CPU execution. |
| FlexSPI with 8 KB Cache | Enables zero-wait-state XIP from Octal/QuadSPI flash; cache coherency maintained automatically - delivers flash performance approaching internal RAM for code execution. |
| Dual FlexPWM + QEI | Two independent FlexPWM modules (24 PWM outputs) plus two quadrature encoder interfaces - supports dual 3-phase motor control with synchronized current sensing and position feedback. |
| Secure Boot & CRP | ROM bootloader validates CRC32 image integrity and enforces Code Read Protection (CRP) on non-secure builds - prevents unauthorized firmware extraction or tampering in deployed devices. |
Applications
| Industrial Motor Control | Smart Sensor Hub |
|---|---|
|
Use Scenario: Closed-loop control of BLDC motors in HVAC actuators and pump drives with real-time current sensing and position feedback. IC Role / Device Role / Timing Role: Main controller executing FOC algorithms, managing dual 3-phase PWM generation, and decoding quadrature encoder signals with sub-microsecond latency. Use Value: Dual FlexPWM (24 outputs) and QEI peripherals eliminate external gate drivers and encoder ICs, reducing system component count and jitter-sensitive timing dependencies. |
Use Scenario: Aggregating and preprocessing data from multiple analog sensors (temperature, pressure, vibration) before wireless transmission. IC Role / Device Role / Timing Role: Signal acquisition hub performing simultaneous 4-channel ADC sampling, digital filtering via PowerQuad, and timestamped event logging using RTC and OS Timer. Use Value: On-chip 2.0 Msps ADC with 4 simultaneous conversions and hardware-accelerated filtering enable local feature extraction, minimizing raw data bandwidth to cloud endpoints. |
| Automotive Body Electronics | USB-C Accessory Controller |
|
Use Scenario: Gateway node managing LIN/CAN FD communication between door modules, lighting, and climate systems in 12 V vehicle architectures. IC Role / Device Role / Timing Role: CAN FD interface controller with dedicated DMA, supporting ISO 11898-1:2015 data rates up to 5 Mbps and payload lengths up to 64 bytes. Use Value: Integrated CAN FD PHY and DMA reduce external component count and CPU loading, enabling deterministic message scheduling under heavy bus load. |
Use Scenario: USB Full-Speed peripheral in smart docks, charging adapters, and HID accessories requiring plug-and-play enumeration without external crystal. IC Role / Device Role / Timing Role: USB FS device controller with crystal-less operation, leveraging internal FRO and software library AN13527 for ±0.25% SOF timing compliance. Use Value: Eliminates 12 MHz crystal and matching capacitors, simplifying layout, lowering BOM cost, and improving mechanical robustness in compact consumer enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC5536JBD64E | 256 KB flash, 128 KB SRAM, includes USB FS host capability - no crystal-less USB device support required. | Required when USB host functionality (e.g., HID keyboard/mouse support) or larger firmware footprint is needed. | Select LPC5536JBD64E only if USB host or >128 KB flash is mandatory; otherwise LPC5534JBD64E offers lower cost and identical peripheral set for device-only roles. |
| LPC55S36JHI48 | HVQFN48 package (48-pin), no USB FS device, no CAN FD, 256 KB flash, 128 KB SRAM, includes Secure Enclave (SECO) for advanced cryptography. | Suitable for space-constrained, security-critical applications like payment terminals where CAN FD and USB are unnecessary. | Choose LPC55S36JHI48 only when physical size and hardware security outweigh need for CAN FD or USB device - not a functional substitute for LPC5534JBD64E in connected industrial designs. |
Compared with LPC5536JBD64E, the LPC5534JBD64E reduces flash/SRAM capacity and omits USB host but retains identical CAN FD, FlexPWM, and ADC capabilities - making it optimal for cost-sensitive, USB-device-only edge nodes. Versus LPC55S36JHI48, it trades package size and SECO for essential industrial interfaces and broader temperature support.
Availability
LPC5534JBD64E is available at Aetrix Electronics and suitable for industrial motor control, smart sensor hubs, automotive body electronics, and USB-C accessory designs requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for LPC5534JBD64E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 50 years of embedded systems expertise.
The LPC553x series is part of NXP's secure, low-power MCU portfolio targeting resource-constrained edge devices requiring real-time performance, cryptographic acceleration, and industrial-grade reliability - designed specifically for deterministic control and sensor processing at the edge.
FAQ
What is the maximum operating frequency of the LPC5534JBD64E?
The LPC5534JBD64E operates at a maximum CPU frequency of 150 MHz, achieved via PLL0 or PLL1 driven by internal FRO (12 MHz), external crystal (16–32 MHz), or RTC oscillator (32.768 kHz). This frequency is sustained across the full −40 °C to +105 °C temperature range with voltage scaling managed by the integrated DC-DC converter or LDO.
Does the LPC5534JBD64E support USB host functionality?
No, the LPC5534JBD64E does not support USB host mode. According to Table 2 in the datasheet, its USB column is marked "−", confirming USB Full-Speed device-only capability. For USB host support, engineers must select the LPC5536JBD64E variant, which explicitly lists "FS" under USB in the ordering table.
How many ADC channels does the LPC5534JBD64E support, and what is the maximum sample rate?
The LPC5534JBD64E integrates four 16-bit ADCs capable of 2.0 Msamples/sec in 16-bit mode (or 3.2 Msamples/sec in 12-bit mode), with support for four simultaneous conversions across two independent sequences. It provides 13 physical ADC input channels in the HTQFP64 package, as confirmed in Table 2 of the datasheet.
What is the purpose of pins PIO0_5 and PIO0_7 on the LPC5534JBD64E?
PIO0_5 and PIO0_7 serve dual roles: general-purpose GPIOs and boot configuration pins. Their logic states at reset determine the boot source - e.g., internal flash, ROM ISP handler, or external SPI flash. This enables field firmware recovery and flexible production programming without JTAG, as documented in the Boot Process chapter of the Reference Manual.
Is the LPC5534JBD64E pin-compatible with other LPC553x variants in the HTQFP64 package?
Yes, all LPC553x devices in the HTQFP64 package (e.g., LPC5534JBD64E, LPC5536JBD64E) share identical pinouts and mechanical dimensions (SOT855-6). Peripheral allocation is consistent across variants; functional differences (e.g., USB host presence) are implemented via internal configuration, not pin mapping - enabling drop-in replacement where firmware and BOM support the target feature set.
LPC5534JBD64E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 13x16b; D/A 1x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC5534JBD64E FAQ
1.How can I place an order for LPC5534JBD64E through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC5534JBD64E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC5534JBD64E reliable?
The price and inventory of LPC5534JBD64E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC5534JBD64E is usually 5 days.
3.What payment methods are accepted for LPC5534JBD64E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC5534JBD64E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC5534JBD64E?
LPC5534JBD64E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC5534JBD64E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC5534JBD64E?
For technical support, including LPC5534JBD64E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC5534JBD64E requirements.
6.How does Aetrix verify that LPC5534JBD64E is sourced from the original manufacturer or authorized distributors?
All LPC5534JBD64E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC5534JBD64E meets industry standards.
7.What is the process for return or replacement of LPC5534JBD64E?
All LPC5534JBD64E units undergo pre-shipment inspection (PSI). If there is an issue with LPC5534JBD64E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC5534JBD64E part is unused and in its original packaging.
Return procedure for LPC5534JBD64E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LPC5534JBD64E Tags
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ATTINY4-TSHR
Microchip Technology
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ATTINY10-TSHR
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ATTINY10-TS8R
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PIC16F15213T-I/MF
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PIC16F15213-E/MF
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PIC10F200T-I/OT
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ATTINY412-SSNR
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PIC10F202T-I/OT
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