My Inquiry
My Account
NXP Semiconductors LPC5534JBD64K
- Part No.:
- LPC5534JBD64K
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
LPC5534JBD64K.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 64HTQFP
- Quantity:
- Payment:
- Shipping:
Inventory:800
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LPC5534JBD64K from NXP Semiconductors is a 32-bit ARM Cortex-M33 microcontroller designed for secure, low-power embedded control with integrated analog and communication peripherals. It operates at up to 150 MHz, includes 128 KB on-chip flash, 96 KB SRAM, CAN FD, FlexSPI with cache, and supports crystal-less USB Full-Speed device operation. It targets industrial motor control, smart sensor hubs, and connected edge devices requiring real-time responsiveness and power efficiency.
For engineers reviewing the LPC5534JBD64K datasheet, LPC5534JBD64K pinout, LPC5534JBD64K application, or LPC5534JBD64K equivalent, key selection criteria include its HTQFP64 package (64-pin, 10 × 10 mm), 39 GPIOs, dual FlexPWM subsystem (24 outputs), 13-channel ADC, single DAC output, and absence of USB host functionality - distinguishing it from higher-pin-count LPC5536 variants.
Technical Context
The LPC5534JBD64K implements an ARM Cortex-M33 core with TrustZone security, FPU, MPU, and PowerQuad DSP accelerator. Its memory subsystem comprises 128 KB flash (with 8 KB low-power cache) and 96 KB SRAM split across code/system buses, with parity on most banks and ECC only on RAM1.
Peripherals are highly configurable: eight Flexcomm interfaces support USART/SPI/I²C/I²S dynamically; FlexSPI enables XIP from external octal/quad SPI flash; CAN FD includes dedicated DMA; and the SCTimer/PWM provides advanced state-machine-based timing with dithering for high-resolution PWM generation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M33 @ 150 MHz with FPU, MPU, and TrustZone security |
| Memory | 128 KB flash (246 KB usable), 96 KB SRAM (16 KB code bus + 80 KB system bus) |
| Analog | 4×16-bit ADC (2.0 Msps), 1×12-bit DAC (1 Msps), 3×OpAmps, 4×comparators |
| Communication | CAN FD, USB FS device (crystal-less), 8×Flexcomm (USART/SPI/I²C/I²S), I³C, DMIC, FlexSPI |
| Timers & PWM | 5×32-bit CTimers, SCTimer/PWM (16 match/capture), 2×FlexPWM (24 outputs), RTC, WWDT |
| Package & I/O | HTQFP64 (10 × 10 mm, 0.5 mm pitch), 39 GPIOs, 2×QEI, 4×tamper pins |
| Power | 1.8–3.6 V supply, DC-DC/LDO selectable, -40°C to +105°C operating range |
Pinout & Package
HTQFP64 plastic low-profile quad flat package (10 × 10 × 0.5 mm, 64 leads), thermally enhanced with exposed thermal pad. Pinout validated per NXP SOT855-6 specification and datasheet Table 3 (64-pin column).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0 | GPIO / ACMP0_A | Digital I/O or comparator input A; default reset state = high-impedance |
| PIO0_5 | GPIO / CAN0_TD | Default pull-up enabled; boot source selector with PIO0_7; CAN FD transmit output |
| PIO0_6 | GPIO / FLEXSPI0_DATA0 | FlexSPI data line 0; also supports SCTimer/PWM output 6 and debug trace (SWO) |
| PIO0_7 | GPIO / HSCMP1_IN0 | Boot source selector with PIO0_5; high-speed comparator input 0 |
| PIO0_8 | GPIO / OPAMP0_INP | OpAmp 0 positive input; also supports SWO trace output and PDM data input |
| VDDA | Analog Supply | 1.8–3.6 V analog domain supply; decoupling required for ADC/DAC accuracy |
| VSSA | Analog Ground | Separate analog ground plane required to minimize noise coupling into ADC/DAC paths |
Key Features
| Feature | Design Value |
|---|---|
| Crystal-less USB FS Device | Eliminates external 12 MHz crystal in USB device mode using internal FRO trimming, reducing BOM cost and board space |
| FlexSPI with 8 KB Cache | Enables Execute-in-Place (XIP) from external octal/quad SPI flash with deterministic latency and DMA support |
| PowerQuad DSP Accelerator | Offloads fixed/floating-point math (FFT, FIR, matrix ops) from CPU using four 4 KB SRAM banks for real-time signal processing |
| Secure Boot & CRP | ROM bootloader validates CRC32 image integrity and enforces Code Read Protection (CRP) on non-secure builds |
| Configurable Flexcomm Interfaces | Eight software-selectable serial peripherals (0–7) each supporting USART/SPI/I²C/I²S with independent FIFOs and clocking |
Applications
| Industrial Motor Control | Smart Sensor Hub |
|---|---|
Use Scenario: Closed-loop control of two 3-phase BLDC motors with position feedback via quadrature encoders. IC Role / Device Role / Timing Role: Main controller executing FOC algorithms, managing FlexPWM outputs (24 channels), QEI inputs, and real-time current sensing via 16-bit ADC. Use Value: Dual FlexPWM modules deliver precise phase timing with dithering; 2.0 Msps ADC captures current waveforms without aliasing at 20 kHz PWM carrier frequency. | Use Scenario: Multi-sensor aggregation node (temperature, vibration, acoustic) with local preprocessing and wireless uplink. IC Role / Device Role / Timing Role: Edge AI inference accelerator using PowerQuad for FFT-based spectral analysis on DMIC audio streams and ADC vibration data. Use Value: Integrated DMIC interface with decimation and Voice Activation Detect reduces MCU load; 128 KB SRAM buffers time-series data for batch processing. |
| Secure IoT Gateway | USB-C Connected Test Equipment |
Use Scenario: Field-deployable gateway authenticating sensor nodes via TLS and relaying data over CAN FD to PLC backbones. IC Role / Device Role / Timing Role: Secure root-of-trust anchor running TrustZone-protected firmware, managing CAN FD DMA transfers and encrypted TLS stack. Use Value: Hardware-accelerated crypto not required - TrustZone isolates secure keys and CRP prevents firmware extraction; CAN FD achieves 5 Mbps payload throughput. | Use Scenario: Portable oscilloscope front-end with analog signal conditioning, digitization, and USB FS streaming to PC host. IC Role / Device Role / Timing Role: Real-time acquisition controller synchronizing 16-bit ADC sampling, DMA buffering, and crystal-less USB FS bulk transfers. Use Value: USB FS device mode eliminates crystal requirement; 2.0 Msps ADC supports 100 kHz effective bandwidth with oversampling; 96 KB SRAM holds 48 kSamples before USB transmission. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC5536JBD64K | 256 KB flash, 128 KB SRAM, USB FS host/device, 66 GPIOs, 23 ADC channels | Supports USB host peripherals (e.g., HID keyboards) and larger firmware images; higher I/O count for complex I/O mapping | Select when USB host capability, >128 KB flash, or >39 GPIOs are required - no PCB change needed due to identical HTQFP64 package and pin compatibility |
| LPC55S36JHI48 | HVQFN48 (48-pin), 256 KB flash, 128 KB SRAM, no USB, 32 GPIOs, 10 ADC channels | Smaller footprint for space-constrained designs; lacks USB but adds secure boot enhancements (AES-256, SHA-256) | Choose for ultra-compact layouts where USB is unnecessary and cryptographic acceleration is critical - requires PCB redesign due to different package and pin count |
Compared with LPC5534JBD64K, LPC5536JBD64K offers expanded memory and USB host support in the same package, while LPC55S36JHI48 trades I/O and USB for security features and smaller size - making LPC5534JBD64K optimal for balanced cost, performance, and feature set in mid-tier industrial edge nodes.
Availability
LPC5534JBD64K is available at Aetrix Electronics and suitable for industrial motor control, smart sensor hubs, secure IoT gateways, and USB-connected test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for LPC5534JBD64K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge AI acceleration.
The LPC553x product line delivers scalable, secure, low-power MCUs targeting industrial automation, smart sensing, and connected edge devices - emphasizing real-time determinism, analog integration, and hardware-enforced security from boot to runtime.
FAQ
What is the maximum operating frequency of the LPC5534JBD64K?
The LPC5534JBD64K features an ARM Cortex-M33 core rated for operation up to 150 MHz. This maximum frequency is achievable under specified voltage (1.8–3.6 V) and temperature (-40°C to +105°C) conditions, with appropriate clock configuration using PLL0 or PLL1 sourced from the internal 12 MHz FRO or external oscillators.
Does the LPC5534JBD64K support USB host functionality?
No, the LPC5534JBD64K does not support USB host functionality. Per NXP's ordering table (Table 2), this variant is designated with "-" under the USB column, confirming USB Full-Speed device-only capability. In contrast, the LPC5536JBD64K variant explicitly lists "FS" indicating both host and device support.
How many ADC channels does the LPC5534JBD64K support?
The LPC5534JBD64K supports 13 ADC channels, as confirmed in Table 2 of the datasheet under "ADC Channels" for the LPC5534JBD64 part number. These consist of four 16-bit single-ended or two differential inputs, with simultaneous conversion capability across two independent sequences.
What is the SRAM configuration of the LPC5534JBD64K?
The LPC5534JBD64K integrates 96 KB of on-chip SRAM, structured as 16 KB on the code bus and 80 KB contiguous SRAM on the system bus. Parity protection applies to all SRAM banks except RAM1, which instead supports ECC - a distinction critical for safety-critical firmware partitioning.
Is the LPC5534JBD64K pin-compatible with other LPC553x variants in HTQFP64?
Yes, the LPC5534JBD64K is pin-compatible with the LPC5536JBD64K in the HTQFP64 package (SOT855-6). Both share identical pin counts, mechanical dimensions, and functional pin assignments - enabling drop-in replacement where USB host or additional flash/SRAM are not required.
LPC5534JBD64K Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 13x16b; D/A 1x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC5534JBD64K FAQ
1.How can I place an order for LPC5534JBD64K through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC5534JBD64K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC5534JBD64K reliable?
The price and inventory of LPC5534JBD64K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC5534JBD64K is usually 5 days.
3.What payment methods are accepted for LPC5534JBD64K?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC5534JBD64K transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC5534JBD64K?
LPC5534JBD64K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC5534JBD64K order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC5534JBD64K?
For technical support, including LPC5534JBD64K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC5534JBD64K requirements.
6.How does Aetrix verify that LPC5534JBD64K is sourced from the original manufacturer or authorized distributors?
All LPC5534JBD64K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC5534JBD64K meets industry standards.
7.What is the process for return or replacement of LPC5534JBD64K?
All LPC5534JBD64K units undergo pre-shipment inspection (PSI). If there is an issue with LPC5534JBD64K, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC5534JBD64K part is unused and in its original packaging.
Return procedure for LPC5534JBD64K:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LPC5534JBD64K Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
