NXP Semiconductors LPC5534JBD64MP
- Part No.:
- LPC5534JBD64MP
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
LPC5534JBD64MP.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 64HTQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LPC5534JBD64MP from NXP Semiconductors is a 32-bit ARM Cortex-M33 microcontroller designed for secure, low-power embedded applications. It operates at up to 150 MHz, integrates 128 KB on-chip flash and 96 KB SRAM, features CAN FD, FlexSPI with cache, USB Full-Speed (device-only), eight Flexcomm interfaces configurable as USART/SPI/I²C/I²S, and a 16-bit 2.0 Msamples/sec ADC - deployed in industrial control gateways requiring real-time sensor fusion and fieldbus connectivity.
For engineers reviewing the LPC5534JBD64MP datasheet, LPC5534JBD64MP pinout, LPC5534JBD64MP application, or LPC5534JBD64MP equivalent, key selection criteria include its HTQFP64 package with 39 GPIOs, absence of USB host capability, dual FlexPWM subsystem for motor control, PowerQuad DSP accelerator, and support for crystal-less USB device operation per AN13527.
Technical Context
The LPC5534JBD64MP implements ARMv8-M architecture with TrustZone security, integrated FPU and MPU, and a hardware-accelerated PowerQuad coprocessor for fixed/floating-point DSP functions using four dedicated 4 KB SRAM banks. Its clock system combines dual PLLs, three FRO oscillators (96/12/1 MHz), and 32.768 kHz RTC crystal support for precise timing across power modes.
Peripherals are organized around two DMA controllers (52+16 channels), a flexible Flexcomm matrix enabling runtime reconfiguration of serial interfaces, and an analog subsystem with four 16-bit ADCs (2.0 Msps), three 12-bit DACs (1 Msps), three OpAmps (OPAMP0 output routed to pin), and four comparators - all accessible via shared AHB/APB buses and programmable I/O muxes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M33 @ 150 MHz with FPU, MPU, and TrustZone security |
| Memory | 128 KB flash (246 KB usable) + 96 KB SRAM (16 KB code bus + 80 KB system bus) |
| USB Interface | USB 2.0 Full-Speed device only (no host); crystal-less operation supported via software library |
| Serial Peripherals | Eight Flexcomm interfaces (0–7): each configurable as USART/SPI/I²C/I²S; Flexcomm 8 = high-speed SPI (50 MHz) |
| Analog Subsystem | Four 16-bit ADCs (2.0 Msps), three 12-bit DACs (1 Msps), three OpAmps (only OPAMP0 output exposed), four comparators |
| Timers & PWM | Five 32-bit general-purpose timers, SCTimer/PWM (16 match/capture registers), two FlexPWM modules (24 outputs), MRT, WWDT, OS Timer |
| Package & GPIO | HTQFP64 (10 × 10 × 0.5 mm), 39 GPIO pins with programmable pull-up/down, pin interrupt (PINT), and group interrupt (GINT) support |
Pinout & Package
HTQFP64 plastic low-profile quad flat package (SOT855-6), 64 leads, 0.5 mm pitch, thermal pad exposed on underside. Pin functions are software-selectable via IOCON registers; default reset state disables most pull-ups/pull-downs except PIO0_5 (PU), PIO0_0/0_2/0_3/0_4 (PD), and PIO0_13/0_14 (open-drain).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0 | GPIO / ACMP0_A | Digital I/O or comparator input A; default function after reset |
| PIO0_1 | GPIO / ADC1IN2B | Digital I/O or ADC1 channel 2B single-ended/differential input |
| PIO0_2 | GPIO / TRST | JTAG boundary scan test reset; also Flexcomm3 TXD/SCL/MISO/WS |
| PIO0_3 | GPIO / TCK | JTAG test clock input; also Flexcomm3 RXD/SDA/MOSI/DATA |
| PIO0_4 | GPIO / TMS | JTAG test mode select; also CAN0_RD and Flexcomm4_SCK |
| PIO0_5 | GPIO / TDI / CAN0_TD | JTAG test data input and CAN0 transmit; boot source selector with PIO0_7 |
| PIO0_6 | GPIO / TDO | JTAG test data output; also Flexcomm3_SCK and FlexSPI0_DATA0 |
| PIO0_7 | GPIO / HSCMP1_IN0 | High-speed comparator 1 input 0; boot source selector with PIO0_5 |
| PIO0_8 | GPIO / OPAMP0_INP | OpAmp0 positive input; SWO trace output and PDM_DATA1 available |
| VDDA | Analog Supply | 1.8–3.6 V analog domain supply; powers ADC, DAC, comparators, OpAmps |
| VSSA | Analog Ground | Separate analog ground reference for precision analog circuitry |
| XTAL32K | RTC Crystal Input | Connects to 32.768 kHz external crystal for RTC and wake-up timer |
| CLKIN | External Clock Input | Bypass mode for 16–32 MHz crystal oscillator; supports up to 25 MHz external clock |
Key Features
| Feature | Design Value |
|---|---|
| PowerQuad DSP Accelerator | Hardware coprocessor with four 4 KB SRAM banks for fixed/floating-point math, offloading CPU in audio/sensor processing |
| Flexcomm Serial Matrix | Eight software-reconfigurable interfaces (0–7) supporting USART/SPI/I²C/I²S simultaneously, reducing peripheral resource contention |
| FlexSPI with Cache | Octal/QuadSPI interface with 8 KB cache enabling Execute-in-Place (XIP) from external flash and dual-image remapping |
| Secure Boot & ISP | ROM bootloader supports CRC32 image integrity, dual-image boot, CAN-FD/USB/HSPI/I²C ISP, and crystal-less USB DFU |
| Low-Power Operation | Multiple power modes (sleep/deep-sleep/power-down/deep power-down) with RTC and Micro-Tick Timer wake-up sources |
| Analog Integration | Three OpAmps (OPAMP0 output routed to pin), four comparators, temperature sensor, and dual ADCs with simultaneous conversion |
Applications
| Industrial Motor Control Gateway | Smart Sensor Hub with Audio Processing |
|---|---|
Use Scenario: Central node aggregating CAN FD fieldbus data from servo drives, executing PID loops, and communicating via Ethernet/Wi-Fi. IC Role / Device Role / Timing Role: Real-time controller with dual FlexPWM (24 outputs) for 3-phase motor control, SCTimer/PWM for precise edge dithering, and CAN FD DMA for zero-latency messaging. Use Value: Eliminates external motor control ICs; 150 MHz Cortex-M33 + PowerQuad enables on-device FFT-based vibration analysis alongside motion control. | Use Scenario: Edge node collecting multi-channel analog sensor data (temperature, pressure, humidity) and voice commands via digital microphone array. IC Role / Device Role / Timing Role: Sensor fusion processor with four 16-bit ADCs (2.0 Msps), DMIC interface (2-channel PDM), I²S streaming, and PowerQuad for voice activation detection. Use Value: Single-chip solution replaces discrete ADCs, audio codecs, and DSP; crystal-less USB enables field firmware updates without external clock components. |
| Secure IoT Edge Node | Automotive Body Control Module (BCM) |
Use Scenario: Connected lighting and HVAC controller requiring secure OTA updates, tamper detection, and low-power occupancy sensing. IC Role / Device Role / Timing Role: Secure execution environment with TrustZone, CRP-enabled flash, tamper pins, and RTC wake-up from deep power-down for periodic sensor polling. Use Value: Meets automotive-grade (-40°C to +105°C) and IEC 62443 requirements; OTP eFuse enables unique device identity and secure key storage. | Use Scenario: In-vehicle module managing door locks, window lifts, and interior lighting via CAN FD and LIN-compatible UARTs. IC Role / Device Role / Timing Role: CAN FD node with dedicated DMA controller, five general-purpose timers for PWM dimming, and GPIOs with pattern-match interrupt for switch debounce. Use Value: Reduces BOM by integrating CAN FD PHY interface, high-current GPIO drivers, and watchdog supervision - no external CAN transceiver required. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC5536JBD64MP | 256 KB flash, 128 KB SRAM, same HTQFP64 package, identical peripherals except USB host capability omitted | Supports larger firmware images and more complex RTOS stacks; retains all analog/timing features of LPC5534JBD64MP | Select when firmware size exceeds 128 KB or additional SRAM is needed for buffer-intensive protocols (e.g., TLS stack) |
| LPC55S36JHI48 | HVQFN48 package (48-pin), 256 KB flash, 128 KB SRAM, no USB FS, no DMIC, only 32 GPIOs, lacks OPAMP0 pin routing | Compact footprint for space-constrained designs; trade-off includes reduced analog I/O and no crystal-less USB capability | Select for cost-sensitive, size-limited applications where USB device and analog output are not required |
Compared with LPC5534JBD64MP, LPC5536JBD64MP offers double flash/SRAM for scalable firmware while maintaining identical pinout and analog capabilities; LPC55S36JHI48 reduces package size and cost but sacrifices USB device functionality, DMIC, and OpAmp pin access - making it unsuitable for audio or secure update use cases.
Availability
LPC5534JBD64MP is available at Aetrix Electronics and suitable for industrial motor control gateways, smart sensor hubs with audio processing, and secure IoT edge nodes requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for LPC5534JBD64MP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC553x series targets secure, low-power embedded applications with ARM Cortex-M33 cores, TrustZone, PowerQuad acceleration, and integrated analog/motor control peripherals - optimized for field-deployable edge intelligence.
FAQ
Does LPC5534JBD64MP support USB host functionality?
No, LPC5534JBD64MP supports USB 2.0 Full-Speed device mode only, with crystal-less operation enabled via software library AN13527. USB host capability is absent in this variant - confirmed by Table 2 in the datasheet, which lists "-" under USB column for all JBD64 variants. For host support, consider LPC5536JBD64MP or LPC55S3x family members with explicit USB host registers.
What is the maximum ADC sampling rate achievable on LPC5534JBD64MP?
The LPC5534JBD64MP supports up to 2.0 Msamples/sec in 16-bit mode and 3.2 Msamples/sec in 12-bit mode across its four ADCs. Four simultaneous conversions are possible using two independent sequences, with internal/external trigger support - verified in Section 2 "Analog peripherals" and Table 2 (ADC Channels = 13 for JBD64 packages).
How many OpAmp outputs are accessible on LPC5534JBD64MP pins?
Only OPAMP0 output (OPAMP0_Out) is routed to a physical pin (PIO0_8) on LPC5534JBD64MP. OPAMP1 and OPAMP2 outputs remain internal and are not connected to package terminals - explicitly stated in the "Marking" section: "only output of OPAMP0 (OPAMP0_Out) is directed to pin."
Is LPC5534JBD64MP qualified for automotive temperature range?
Yes, LPC5534JBD64MP is rated for −40 °C to +105 °C operating temperature, meeting extended industrial and automotive-grade requirements. This is specified in Section 2 "Features and benefits" and confirmed in Table 1's package version notes, aligning with AEC-Q100 stress test expectations for non-safety-critical body electronics.
Does LPC5534JBD64MP include hardware cryptographic acceleration?
No, LPC5534JBD64MP does not integrate dedicated cryptographic accelerators (e.g., AES, SHA, PKA). Security relies on ARM TrustZone for memory isolation and software-based crypto libraries. The "LPC55S3x" sibling variants (e.g., LPC55S36JHI48) include SECURE element and cryptographic engines - distinguishing S-series from base 553x parts per datasheet revision 5.0.
LPC5534JBD64MP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 13x16b; D/A 1x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC5534JBD64MP FAQ
1.How can I place an order for LPC5534JBD64MP through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC5534JBD64MP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC5534JBD64MP reliable?
The price and inventory of LPC5534JBD64MP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC5534JBD64MP is usually 5 days.
3.What payment methods are accepted for LPC5534JBD64MP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC5534JBD64MP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC5534JBD64MP?
LPC5534JBD64MP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC5534JBD64MP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC5534JBD64MP?
For technical support, including LPC5534JBD64MP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC5534JBD64MP requirements.
6.How does Aetrix verify that LPC5534JBD64MP is sourced from the original manufacturer or authorized distributors?
All LPC5534JBD64MP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC5534JBD64MP meets industry standards.
7.What is the process for return or replacement of LPC5534JBD64MP?
All LPC5534JBD64MP units undergo pre-shipment inspection (PSI). If there is an issue with LPC5534JBD64MP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC5534JBD64MP part is unused and in its original packaging.
Return procedure for LPC5534JBD64MP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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