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NXP Semiconductors LPC5536JBD100K

Part No.:
LPC5536JBD100K
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixLPC5536JBD100K.pdf
Description:
IC MCU 32BIT 256KB FLSH 100HLQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:400

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Product details

Overview

LPC5536JBD100K from NXP Semiconductors is a 32-bit ARM Cortex-M33 microcontroller for secure, low-power embedded control applications. It operates at up to 150 MHz, integrates 256 KB flash and 128 KB SRAM, supports CAN FD and USB Full-Speed device/host with crystal-less operation, and targets industrial automation, motor control, and sensor fusion systems.

For engineers reviewing the LPC5536JBD100K datasheet, LPC5536JBD100K pinout, LPC5536JBD100K application, or LPC5536JBD100K equivalent, key selection factors include its HLQFP100 package with 66 GPIOs, dual FlexPWM subsystem (24 outputs), four simultaneous 16-bit ADC conversions, PowerQuad DSP accelerator, and support for secure boot via ROM bootloader with CRP and dual-image XIP from FlexSPI.

Technical Context

The LPC5536JBD100K implements an ARM Cortex-M33 core with TrustZone security, FPU, MPU, and NVIC, paired with a dedicated PowerQuad coprocessor for fixed/floating-point DSP acceleration using four 4 KB SRAM banks. Its memory subsystem includes 256 KB flash with 512-byte page erase, 128 KB SRAM (16 KB on Code Bus + 112 KB contiguous on System Bus), and parity/ECC support differentiated per bank.

Peripherals are organized around two DMA controllers (52+16 channels), eight Flexcomm interfaces configurable as USART/SPI/I²C/I²S, FlexSPI with 8 KB cache for XIP, CAN FD with dedicated DMA, and analog resources including four 16-bit/2.0 Msps ADCs, three 12-bit DACs, three OpAmps (only OPAMP0 output routed to pin), and four comparators - all operating across −40 °C to +105 °C.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M33 @ up to 150 MHz with FPU, MPU, TrustZone, and NVIC
Memory256 KB flash (246 KB usable), 128 KB SRAM (16 KB Code Bus + 112 KB System Bus)
AnalogFour 16-bit 2.0 Msps ADCs (four simultaneous conversions), three 12-bit 1 Msps DACs, three OpAmps (OPAMP0 output exposed)
ConnectivityCAN FD with dedicated DMA, USB FS host/device (crystal-less in device mode), I³C, DMIC (2-channel PDM), eight Flexcomm interfaces
Timers & PWMFive 32-bit CTimers, SCTimer/PWM (16 match/capture, 10 outputs), two FlexPWM modules (24 outputs total), MRT, RTC, WWDT
Package & TempHLQFP100 (14 × 14 × 0.5 mm), −40 °C to +105 °C operating range
SecurityROM bootloader with dual-image XIP, CRP, OTP eFuse, CRC32 image integrity, CAN-FD/USB/HSSPI ISP

Pinout & Package

Package: HLQFP100 (plastic low-profile quad flat package, 100 leads, 0.5 mm pitch, body 14 × 14 × 0.5 mm).

Pin/TerminalCircuit RoleDesign Meaning
PIO0_0 / ACMP0_ADigital I/O / Comparator input ADefault GPIO; enables ACMP0 input A when ANAMODE=1 and DIGIMODE=0
PIO0_5 / TDIJTAG test data input / CAN0_TDBoot source selector (with PIO0_7); drives CAN0 transmit output
PIO0_7 / HSCMP1_IN0High-speed comparator input 0 / Boot selectPaired with PIO0_5 to determine boot mode or ISP handler invocation
FLEXSPI0_DATA0–3FlexSPI data linesSupport octal/quad SPI interface to external flash; enable execute-in-place (XIP) with 8 KB cache
FC3_TXD_SCL_MISO_WSFlexcomm 3 multiplexed functionConfigurable as USART TX, I²C clock, SPI MISO, or I²S word select

Key Features

FeatureDesign Value
PowerQuad DSP AcceleratorDedicated hardware block with four 4 KB SRAM banks for real-time fixed/floating-point math offloading from CPU
Crystal-less USB Device ModeEliminates external 12 MHz crystal requirement for USB FS device operation using internal FRO calibration
Dual-Image XIP SupportExecute-in-place from external Octal/QuadSPI flash with address remapping for seamless firmware updates
Secure Boot & CRPROM bootloader validates CRC32, enforces code read protection (CRP), and supports dual-image rollback on failure
Flexible Analog SubsystemFour simultaneous 16-bit ADC conversions, three DACs, four comparators, and three OpAmps (OPAMP0 output accessible externally)

Applications

Industrial Motor ControlSmart Sensor Hub

Use Scenario: Closed-loop control of dual 3-phase BLDC motors with position feedback via QEI and current sensing.

IC Role / Device Role / Timing Role: Main controller executing FOC algorithms via PowerQuad, managing 24 PWM outputs, synchronizing ADC sampling with PWM triggers.

Use Value: Enables precise torque/speed regulation with <1 µs PWM edge dithering and simultaneous multi-channel ADC capture for current reconstruction.

Use Scenario: Aggregation and preprocessing of temperature, pressure, and vibration data from multiple analog/digital sensors.

IC Role / Device Role / Timing Role: Central sensor fusion node with integrated ADCs, comparators, and temperature sensors; runs real-time anomaly detection using PowerQuad FFT.

Use Value: Reduces BOM count by integrating 4× 16-bit ADCs, 3× DACs, and 4× comparators - supporting four simultaneous analog inputs with 2.0 Msps throughput.

Automotive Body ControlUSB-C Connected IoT Gateway

Use Scenario: Secure gateway for LIN/CAN FD communication between body ECUs and infotainment system.

IC Role / Device Role / Timing Role: CAN FD controller with dedicated DMA, secure boot enforcement, and tamper-detection GPIOs for intrusion monitoring.

Use Value: Meets automotive ASIL-B requirements via TrustZone isolation, CRC32-validated firmware, and brown-out detection with forced reset thresholds.

Use Scenario: Firmware-upgradable USB device acting as HID-compliant configuration interface for field-deployed equipment.

IC Role / Device Role / Timing Role: USB FS device with crystal-less operation, ROM-based DFU stack, and ISP over UART/Flexcomm 0 with auto-baud detection.

Use Value: Eliminates external crystal and simplifies layout while enabling field firmware updates via standard USB HID class without host driver installation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LPC5534JBD100K128 KB flash, 96 KB SRAM, same HLQFP100 package and peripheral set except reduced ADC/DAC countSuitable for cost-sensitive designs where full 256 KB flash and 128 KB SRAM headroom are unnecessarySelect when firmware size and RAM usage remain below 128 KB/96 KB and dual-image XIP is not required
LPC55S36JHI48KHVQFN48 package (48-pin), no USB FS device/host, same 256 KB flash/128 KB SRAM but only 32 GPIOs and no crystal-less USBBetter thermal performance in space-constrained designs; lacks USB connectivity for direct PC interfaceChoose for compact, thermally demanding applications where USB is handled externally or via bridge IC

Compared with LPC5534JBD100K, the LPC5536JBD100K provides double flash/SRAM and enhanced analog resources; versus LPC55S36JHI48K, it adds USB FS device/host with crystal-less operation and 34 more GPIOs in HLQFP100 - critical for complex I/O routing and USB-integrated edge nodes.

Availability

LPC5536JBD100K is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart sensor hubs, and USB-connected IoT gateways requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for LPC5536JBD100K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC553x series is designed for high-integrity embedded applications demanding security, real-time performance, and analog integration - targeting motor control, sensor fusion, and secure edge nodes with minimal external components.

FAQ

What is the maximum operating frequency of the LPC5536JBD100K?

The LPC5536JBD100K features an ARM Cortex-M33 core rated for operation up to 150 MHz. This maximum frequency is achievable using internal PLLs driven by the 12 MHz FRO or external oscillators, with voltage and temperature conditions meeting the −40 °C to +105 °C specification. The LPC5536JBD100K maintains timing compliance across its full industrial temperature range when supplied within the 1.8 V to 3.6 V VDDIO and VDDCORE specifications.

Does the LPC5536JBD100K support crystal-less USB Full-Speed device operation?

Yes, the LPC5536JBD100K supports crystal-less USB Full-Speed device mode using its internal 96 MHz FRO trimmed to ±1% accuracy, combined with software calibration per AN13527. This eliminates the need for an external 12 MHz crystal in USB device applications, reducing BOM cost and PCB area. The LPC5536JBD100K retains full USB FS host capability with external crystal or clock source.

How many ADC channels and what resolution does the LPC5536JBD100K support?

The LPC5536JBD100K integrates four 16-bit analog-to-digital converters capable of 2.0 Msamples/sec in 16-bit mode (or 3.2 Msamples/sec in 12-bit mode), supporting up to four simultaneous conversions. It provides 23 ADC input channels - including eight differential pairs - with internal temperature sensor routing to both ADC instances. The LPC5536JBD100K's ADC subsystem supports programmable triggers, DMA transfers, and hardware averaging for noise reduction.

What is the purpose of the PowerQuad coprocessor in the LPC5536JBD100K?

The PowerQuad coprocessor in the LPC5536JBD100K accelerates fixed- and floating-point DSP operations - including FFT, FIR/IIR filtering, matrix math, and trigonometric functions - using dedicated hardware and four 4 KB SRAM banks. It operates independently of the Cortex-M33 core, enabling real-time signal processing without CPU load. The LPC5536JBD100K leverages PowerQuad for sensor fusion, motor control algorithms, and audio preprocessing while maintaining deterministic latency.

Which package type is used for the LPC5536JBD100K and how many pins does it have?

The LPC5536JBD100K uses the HLQFP100 package: a plastic low-profile quad flat package with 100 leads, 0.5 mm pitch, and 14 mm × 14 mm body size (SOT1570-5). This package provides 66 GPIOs, full peripheral pinout accessibility, and thermal performance suited for industrial environments. The LPC5536JBD100K's HLQFP100 footprint is compatible with standard reflow profiles and supports automated optical inspection (AOI) during manufacturing.

LPC5536JBD100K Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-LQFP
Series:
-
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
66
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 23x16b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC5536JBD100K FAQ

1.How can I place an order for LPC5536JBD100K through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC5536JBD100K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC5536JBD100K reliable?

The price and inventory of LPC5536JBD100K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC5536JBD100K is usually 5 days.

3.What payment methods are accepted for LPC5536JBD100K?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC5536JBD100K transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC5536JBD100K?

LPC5536JBD100K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC5536JBD100K order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC5536JBD100K?

For technical support, including LPC5536JBD100K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC5536JBD100K requirements.

6.How does Aetrix verify that LPC5536JBD100K is sourced from the original manufacturer or authorized distributors?

All LPC5536JBD100K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC5536JBD100K meets industry standards.

7.What is the process for return or replacement of LPC5536JBD100K?

All LPC5536JBD100K units undergo pre-shipment inspection (PSI). If there is an issue with LPC5536JBD100K, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC5536JBD100K part is unused and in its original packaging.

Return procedure for LPC5536JBD100K:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LPC5536JBD100K Tags

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