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NXP Semiconductors LPC5536JBD64K
- Part No.:
- LPC5536JBD64K
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
LPC5536JBD64K.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 64HTQFP
- Quantity:
- Payment:
- Shipping:
Inventory:800
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Product details
Overview
LPC5536JBD64K from NXP Semiconductors is a 32-bit ARM Cortex-M33 microcontroller for industrial and automotive embedded control, featuring 256 KB flash, 128 KB SRAM, CAN FD, FlexSPI with 8 KB cache, and 39 GPIOs in HTQFP64 package. It integrates PowerQuad DSP accelerator, USB Full-Speed host/device (crystal-less capable), dual FlexPWM timers, and three 12-bit DACs.
For engineers reviewing the LPC5536JBD64K datasheet, LPC5536JBD64K pinout, LPC5536JBD64K application, or LPC5536JBD64K equivalent, key selection considerations include its 150 MHz CPU frequency, dual DMA controllers (52+16 channels), 16-bit 2.0 Msamples/sec ADC with four simultaneous conversions, -40 °C to +105 °C operating range, and support for secure boot via ROM bootloader with CRP and dual-image XIP from Octal/QuadSPI.
Technical Context
The LPC5536JBD64K implements ARMv8-M architecture with TrustZone security, integrated FPU and MPU, and hardware-accelerated cryptographic operations via PowerQuad coprocessor. Its clock system combines dual PLLs, multiple FROs (96 MHz, 12 MHz, 1 MHz, 32 kHz), and programmable crystal oscillator tuning via embedded capacitor banks.
Peripheral routing is managed through flexible I/O configuration registers (IOCON), enabling dynamic assignment of up to 16 signal options per pin. The device supports concurrent high-speed analog acquisition (four simultaneous ADC conversions) and real-time motor control using two FlexPWM modules with 24 outputs and two QEI interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M33 @ up to 150 MHz with FPU, MPU, and TrustZone security extension. |
| Memory | 256 KB on-chip flash (246 KB usable) with 512-byte page erase; 128 KB SRAM (16 KB code bus + 112 KB system bus, contiguous). |
| Analog | Four 16-bit ADCs (2.0 Msamples/sec), three 12-bit DACs (1.0 Msamples/sec), four comparators, three OpAmps, two temperature sensors. |
| Connectivity | CAN FD with dedicated DMA, eight Flexcomm interfaces (configurable as USART/SPI/I2C/I2S), I3C, DMIC (2-channel), USB FS host/device with crystal-less operation. |
| Timers & PWM | Five 32-bit general-purpose timers, SCTimer/PWM (16 match/capture, 10 outputs), MRT, RTC/alarm, WWDT, Micro-tick timer, two FlexPWM modules (24 outputs total). |
| Package & Environment | HTQFP64 (10 × 10 × 0.5 mm, 0.5 mm pitch); operates from -40 °C to +105 °C; VDDIO_1: 1.8–3.6 V, VDDIO_2: 1.08–3.6 V, VBAT: 1.71–3.6 V. |
| Power Management | Integrated PMU supporting Sleep, Deep-sleep (RAM retention), Power-down (CPU + RAM retention), and Deep power-down modes with wake-up via RTC, Micro-tick timer, or GPIO interrupts. |
Pinout & Package
HTQFP64 package: 64-lead plastic low-profile quad flat package, 10 mm × 10 mm body, 0.5 mm lead pitch, exposed thermal pad. Pin 1 index marked on top-side marking "LPC553x / JBD64".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0 / ACMP0_A | GPIO / Analog comparator input A | Configurable digital I/O or ADC/comparator input; default reset state is high-impedance (Z). |
| PIO0_5 / TDI | JTAG test data input / CAN0_TD | Boot source selection pin (with PIO0_7); also serves as CAN FD transmitter output when enabled. |
| PIO0_6 / TDO | JTAG test data output / FlexSPI0_DATA0 | Boundary scan output; also functions as primary FlexSPI data line for external flash interface. |
| PIO0_7 / HSCMP1_IN0 | High-speed comparator input 0 / Boot select | Paired with PIO0_5 to determine boot mode (on-chip flash, ISP, or recovery); enables fast analog threshold detection. |
| VDDA / VSSA | Analog power / ground | Dedicated 1.8–3.6 V analog supply domain with separate ground; required for ADC/DAC/OpAmp operation. |
| XTALIN / XTALOUT | 32.768 kHz crystal oscillator inputs | Supports RTC and low-power wake-up; internal load capacitors programmable via API to eliminate external components. |
Key Features
| Feature | Design Value |
|---|---|
| PowerQuad DSP Accelerator | Hardware coprocessor with four 4 KB SRAM banks for fixed/floating-point math; offloads CPU for real-time audio, motor, or sensor fusion tasks. |
| Flexcomm Interface Flexibility | Eight software-configurable serial peripherals (Flexcomm 0–7), each supporting USART/SPI/I2C/I2S with FIFO and fractional baud-rate generator. |
| Secure Boot & Flash Protection | ROM bootloader with CRC32 image integrity check, dual-image XIP remapping, CRP level 1/2/3, and OTP eFuse programming for key storage. |
| Flexible Clock Tuning | Embedded capacitor banks per crystal pin enable CL tuning without external capacitors-reducing BOM count and board space. |
| Motor Control Integration | Two FlexPWM modules (24 outputs) and two QEI interfaces support dual 3-phase motor control with synchronized current sensing and position feedback. |
Applications
| Industrial PLC I/O Module | Automotive Body Control Unit |
|---|---|
|
Use Scenario: Real-time monitoring and actuation of solenoids, relays, and analog sensors in factory automation cabinets. IC Role / Device Role / Timing Role: Central controller executing deterministic logic, ADC sampling at 2.0 Msamples/sec, and CAN FD communication with field devices. Use Value: 39 GPIOs with configurable pull-up/down and interrupt capability enable direct connection to 24 V industrial inputs; FlexPWM outputs drive gate drivers for solid-state relays. |
Use Scenario: Centralized lighting, window lift, mirror adjustment, and door lock control in modern vehicle architectures. IC Role / Device Role / Timing Role: CAN FD node managing distributed ECUs, coordinating timing-critical PWM dimming and position feedback via QEI. Use Value: -40 °C to +105 °C rating ensures reliability under hood conditions; integrated OpAmps condition hall-effect sensor signals without external amplification. |
| Smart Home Hub Controller | Audio Edge Node with Voice Activation |
|
Use Scenario: Multi-protocol gateway aggregating Zigbee, Thread, and BLE devices while running local automation rules. IC Role / Device Role / Timing Role: Secure application processor with TrustZone isolation, running RTOS and crypto stack for OTA updates and local decision-making. Use Value: Dual DMA controllers (52+16 channels) handle concurrent USB HID, SPI flash, and I2C sensor traffic without CPU intervention; 128 KB SRAM supports large TLS handshake buffers. |
Use Scenario: Always-on voice assistant endpoint performing local wake-word detection and audio preprocessing before cloud upload. IC Role / Device Role / Timing Role: Audio subsystem controller interfacing DMIC (2-channel PDM), I2S codec, and PowerQuad for FFT-based voice activation. Use Value: DMIC decimators and Voice Activation Detect block reduce CPU load; 16-bit ADCs sample analog mics at 2.0 Msamples/sec for high-fidelity acoustic event capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC5534JBD64K | 128 KB flash, 96 KB SRAM, same HTQFP64 package and peripheral set but reduced memory and no USB FS interface. | Suitable for cost-sensitive designs where USB connectivity is unnecessary and firmware size is ≤128 KB. | Select when full 256 KB flash and USB FS host/device functionality are not required; identical pinout and software compatibility simplify migration. |
| LPC55S36JHI48 | HVQFN48 package (48-pin), same 256 KB flash/128 KB SRAM, includes secure boot extensions (SECO), but lacks USB FS and has only 32 GPIOs. | Targeted at space-constrained, security-critical applications such as payment terminals or secure IoT nodes requiring tamper resistance. | Choose for compact layouts needing enhanced security features; note missing USB FS and reduced GPIO count versus LPC5536JBD64K. |
Compared with LPC5534JBD64K and LPC55S36JHI48, the LPC5536JBD64K uniquely balances full USB FS capability, maximum memory, and 39 GPIOs in the HTQFP64 footprint-making it optimal for industrial gateways and automotive body controllers requiring both connectivity and I/O density.
Availability
LPC5536JBD64K is available at Aetrix Electronics and suitable for industrial PLC I/O modules, automotive body control units, and smart home hubs requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for LPC5536JBD64K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.
The LPC553x product line delivers high-performance, secure, and energy-efficient MCUs targeting real-time industrial control, automotive body electronics, and intelligent edge devices with integrated analog and high-speed connectivity.
FAQ
What is the maximum operating frequency of the LPC5536JBD64K?
The LPC5536JBD64K runs at a maximum CPU frequency of 150 MHz using its ARM Cortex-M33 core. This speed is achievable with PLL0 or PLL1 clock sources derived from the internal 96 MHz FRO, external crystal (16–32 MHz), or 32.768 kHz RTC oscillator. The FRO is factory-trimmed to ±1% accuracy over 0 °C to 85 °C, ensuring stable timing for real-time applications.
Does the LPC5536JBD64K support USB Full-Speed device mode without an external crystal?
Yes, the LPC5536JBD64K supports crystal-less USB Full-Speed device mode using its internal 96 MHz FRO and software library example AN13527. This eliminates the need for a 12 MHz crystal in USB device applications, reducing BOM cost and PCB area. However, USB host mode requires an external crystal or clock source.
How many ADC channels does the LPC5536JBD64K support, and what is their resolution and sampling rate?
The LPC5536JBD64K integrates four 16-bit ADCs capable of 2.0 Msamples/sec in 16-bit mode or 3.2 Msamples/sec in 12-bit mode. It supports up to eight differential channel pairs (16 single-ended inputs) and enables four simultaneous conversions using two independent sequences-ideal for multi-sensor acquisition in motor control or power monitoring.
What debug interfaces are available on the LPC5536JBD64K?
The LPC5536JBD64K supports Serial Wire Debug (SWD) with eight breakpoints and four watchpoints, plus Serial Wire Output (SWO) for real-time trace. JTAG boundary scan is also supported on pins PIO0_2–PIO0_6, though SWD is the primary debug interface. The ROM bootloader includes debug mailbox functionality for secure firmware updates.
Is the LPC5536JBD64K pin-compatible with other members of the LPC553x family?
Within the same package variant, yes: LPC5536JBD64K shares identical pinout and electrical characteristics with LPC5534JBD64K in HTQFP64. Both support the same 39 GPIOs, FlexSPI, CAN FD, and Flexcomm interfaces. However, LPC5536JBD64K adds USB FS functionality not present in LPC5534JBD64K, and both differ from HVQFN48 variants like LPC5536JHI48.
LPC5536JBD64K Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 13x16b; D/A 1x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC5536JBD64K FAQ
1.How can I place an order for LPC5536JBD64K through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC5536JBD64K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC5536JBD64K reliable?
The price and inventory of LPC5536JBD64K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC5536JBD64K is usually 5 days.
3.What payment methods are accepted for LPC5536JBD64K?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC5536JBD64K transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC5536JBD64K?
LPC5536JBD64K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC5536JBD64K order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC5536JBD64K?
For technical support, including LPC5536JBD64K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC5536JBD64K requirements.
6.How does Aetrix verify that LPC5536JBD64K is sourced from the original manufacturer or authorized distributors?
All LPC5536JBD64K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC5536JBD64K meets industry standards.
7.What is the process for return or replacement of LPC5536JBD64K?
All LPC5536JBD64K units undergo pre-shipment inspection (PSI). If there is an issue with LPC5536JBD64K, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC5536JBD64K part is unused and in its original packaging.
Return procedure for LPC5536JBD64K:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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