Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors LPC55S04JBD64Y

Part No.:
LPC55S04JBD64Y
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-TQFP Exposed Pad
Datasheet:
AetrixLPC55S04JBD64Y.pdf
Description:
IC MCU 32BIT 128KB FLASH 64HTQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,750

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

LPC55S04JBD64Y from NXP Semiconductors is a 32-bit ARM Cortex-M33 microcontroller with TrustZone security, PRINCE flash encryption, CASPER crypto co-processor, 128 KB on-chip flash, 80 KB SRAM, and CAN FD interface-designed for secure industrial control, IoT edge nodes, and automotive body electronics requiring real-time operation and cryptographic integrity.

For engineers reviewing the LPC55S04JBD64Y datasheet, LPC55S04JBD64Y pinout, LPC55S04JBD64Y application, or LPC55S04JBD64Y equivalent, this page delivers verified specifications, HTQFP64 package mapping, functional pin roles, security architecture context, and validated alternative options for secure embedded design.

Technical Context

The LPC55S04JBD64Y implements ARMv8-M architecture with TrustZone-enabled memory isolation, integrated FPU and MPU, and hardware-accelerated cryptography via CASPER (ECC) and PRINCE (real-time flash encryption/decryption). Its dual DMA controllers (23+10 channels) support concurrent peripheral data movement including CAN FD, Flexcomm interfaces, and ADC.

Security execution relies on ROM-based secure boot with RSA-2048/4096 signature verification, SHA256 hash engine, PUF-derived key generation (64–4096 bits), AES-256, TRNG, and Code Watchdog for runtime flow integrity-enabling DICE-compliant device identity and anti-rollback firmware updates.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M33 @ up to 96 MHz with TrustZone, FPU, and MPU-enables secure RTOS partitioning and DSP-intensive signal processing.
Memory128 KB flash + 80 KB SRAM (16 KB code bus + 64 KB system bus)-supports dual-bank firmware updates and real-time data buffering.
Security EnginePRINCE (on-the-fly flash encryption), CASPER (ECC acceleration), PUF (silicon fingerprint key generation), AES-256, SHA2, TRNG-meets TBSA and DICE v2.0 Level 00 requirements.
Analog Peripherals16-bit 2.0 Msamples/sec ADC (9 differential channels), comparator, temperature sensor-enables high-resolution sensor fusion without external converters.
Serial Interfaces9 Flexcomm peripherals (configurable as USART/I²C/SPI/I²S), CAN FD with dedicated DMA, HS SPI-provides flexible multi-protocol connectivity in space-constrained designs.
Timers & Logic5x 32-bit general-purpose timers, SCTimer/PWM (10 outputs, 8 inputs), PLU (programmable logic unit), MRT, WWDT-supports motor control, PWM generation, and state-machine offload.
Package & EnvironmentHTQFP64 (10 × 10 × 0.5 mm), −40 °C to +105 °C operating range, single 1.8–3.6 V supply-suitable for industrial and automotive under-hood applications.

Pinout & Package

HTQFP64 package: plastic low-profile quad flat package with 64 leads, 0.5 mm pitch, 10 × 10 × 0.5 mm body, exposed thermal pad connected to VSS.

Pin/TerminalCircuit RoleDesign Meaning
PIO0_0/ACMP0_AAnalog comparator input A / GPIOEnables precision voltage monitoring when analog mode enabled; default GPIO otherwise.
PIO0_2/TRSTJTAG test reset / GPIOHardware-controlled boundary scan entry; internal pull-down at reset ensures safe debug initialization.
PIO0_3/TCKJTAG clock input / GPIOProvides synchronous timing for boundary scan operations; multiplexed with Flexcomm 3 data I/O.
PIO0_4/TMSJTAG mode select / CAN0_RDSelects JTAG state machine transitions; alternatively routes CAN FD receive signal for compact bus integration.
PIO0_5/TDIJTAG data input / CAN0_TDLoads test data during scan; also serves as CAN FD transmit output-enables shared debug/CAN routing.
PIO0_6/TDOJTAG data output / GPIOOutputs scanned test data; supports trace output (SWO) and timer match functions for debugging.
XTAL32K_P / XTAL32K_N32.768 kHz crystal oscillator inputsDrive RTC and low-power wake-up timer with ±2% accuracy across full temperature range.
VDD / VSSPower supply / groundMultiple VDD pins ensure stable core/peripheral rail distribution; VSS pads provide low-inductance return paths.

Key Features

FeatureDesign Value
TrustZone-enabled memory isolationHardware-enforced separation of secure/non-secure code and data-prevents unauthorized access to cryptographic keys and firmware assets.
PRINCE real-time flash encryptionTransparent AES-128 encryption/decryption of flash reads/writes-secures firmware IP without software overhead or latency penalty.
CASPER crypto co-processorHardware acceleration for ECC scalar multiplication (NIST P-256/P-384)-reduces TLS handshake time by >10× vs. software-only implementation.
Secure boot with DICE v2.0Immutable root-of-trust establishment using PUF-generated keys and x.509 certificate chain validation-ensures firmware authenticity and anti-rollback protection.
Flexcomm configurable serial interfacesUp to 9 independent UART/I²C/SPI/I²S instances with shared fractional baud-rate generator-eliminates need for external protocol translators.

Applications

Industrial PLC Edge NodeSecure IoT Gateway

Use Scenario: Localized control of sensors, actuators, and HMI in factory automation systems with over-the-air firmware updates.

IC Role / Device Role / Timing Role: Main controller executing real-time deterministic tasks, managing CAN FD fieldbus communication, and enforcing secure boot before loading application firmware.

Use Value: PRINCE encryption protects proprietary control algorithms; CASPER accelerates TLS 1.3 handshakes for encrypted cloud telemetry; 96 MHz Cortex-M33 ensures sub-millisecond I/O response.

Use Scenario: Aggregating and preprocessing data from BLE/Wi-Fi/Zigbee end devices before forwarding to cloud infrastructure.

IC Role / Device Role / Timing Role: Secure network concentrator with hardware-accelerated crypto, isolated secure storage, and multi-protocol bridging via Flexcomm interfaces.

Use Value: PUF-derived keys prevent cloning; SHA2/AES engines enable authenticated firmware signing; 80 KB SRAM buffers bursty sensor traffic without external memory.

Automotive Body Control ModuleMedical Sensor Hub

Use Scenario: Centralized management of lighting, door locks, and climate controls in passenger vehicles with ASIL-B compliance requirements.

IC Role / Device Role / Timing Role: Safety-aware MCU handling CAN FD diagnostics, watchdog supervision (WWDT + Code Watchdog), and secure key provisioning for vehicle personalization.

Use Value: TrustZone isolates safety-critical CAN stack from infotainment updates; CRC engine validates ECU configuration data; 105 °C rating supports under-dash mounting.

Use Scenario: Portable diagnostic device acquiring ECG, temperature, and SpO₂ signals with local anomaly detection and HIPAA-compliant data export.

IC Role / Device Role / Timing Role: High-fidelity analog front-end controller with simultaneous 16-bit ADC sampling, real-time digital filtering, and encrypted Bluetooth LE transmission.

Use Value: 2.0 Msamples/sec ADC resolves microvolt-level biopotentials; TRNG generates session keys for per-patient data encryption; secure GPIO prevents tampering with sensor inputs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar secure microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LPC55S06JBD64256 KB flash, 96 KB SRAM, identical security features and peripheralsSupports larger firmware images and complex RTOS workloads requiring extended memorySelect when firmware size exceeds 128 KB or additional RAM is needed for multi-threaded applications.
RA6M5GFPMXXFAArm Cortex-M33 @ 200 MHz, 1 MB flash, 512 KB SRAM, no PRINCE or CASPER; includes Ethernet MAC and USB HSBetter suited for high-bandwidth wired connectivity but lacks on-chip flash encryption and ECC accelerationChoose for applications prioritizing raw throughput and wired networking over hardware crypto acceleration and flash IP protection.

Compared with LPC55S06JBD64, the LPC55S04JBD64Y offers identical security architecture and peripheral set at reduced memory cost-ideal for cost-sensitive secure edge nodes. Versus RA6M5GFPMXXFA, it trades higher CPU speed and Ethernet for superior integrated crypto performance and smaller footprint.

Availability

LPC55S04JBD64Y is available at Aetrix Electronics and suitable for industrial PLC edge nodes, secure IoT gateways, automotive body control modules, and medical sensor hubs requiring stable component supply and long-term lifecycle assurance.

Supply support for LPC55S04JBD64Y includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and hardware security.

The LPC55S0x series targets resource-constrained embedded systems demanding certified security, real-time responsiveness, and cryptographic agility-designed specifically for applications where firmware integrity, device identity, and side-channel resistance are non-negotiable.

FAQ

What is the maximum operating frequency of the LPC55S04JBD64Y?

The LPC55S04JBD64Y operates at up to 96 MHz using its ARM Cortex-M33 core. This frequency is achievable with the internal 96 MHz Free Running Oscillator (FRO), PLL0, or PLL1 clock sources. The FRO is trimmed to ±1% accuracy across voltage and 0 °C to 85 °C, ensuring reliable timing without external crystals in many applications. All peripherals-including ADC, timers, and Flexcomm interfaces-are fully functional at this maximum rate.

Does the LPC55S04JBD64Y support secure boot with public-key cryptography?

Yes, the LPC55S04JBD64Y supports secure boot using RSASSA-PKCS1-v1_5 signatures of SHA256 digests, with RSA-2048 and RSA-4096 public keys. It validates images using x.509 certificates and stores up to four revocable Root of Trust keys in protected flash. The ROM bootloader enforces anti-rollback via image key revocation and supports NXP Secure Boot file format (SB2), making LPC55S04JBD64Y compliant with TBSA and DICE v2.0 standards.

How does the PRINCE module function in the LPC55S04JBD64Y?

The PRINCE module in the LPC55S04JBD64Y performs real-time AES-128 encryption and decryption of on-chip flash data during read/write operations. It uses keys derived from the PUF or software-supplied values, enabling transparent protection of firmware and assets without software intervention. This allows secure over-the-air updates and prevents reverse engineering of flash contents-even if the physical chip is extracted-while maintaining full compatibility with standard flash programming workflows.

What analog capabilities does the LPC55S04JBD64Y provide?

The LPC55S04JBD64Y integrates a 16-bit ADC with up to 9 differential input channels (18 single-ended), supporting simultaneous conversions at up to 2.0 Msamples/sec. It includes an on-chip temperature sensor and analog comparator with five input pins and selectable internal/external references. These analog resources are directly accessible via the AHB bus and support hardware triggers from timers or Flexcomm interfaces-enabling precise sensor acquisition without CPU intervention.

Is the LPC55S04JBD64Y pin-compatible with other members of the LPC55S0x family?

Yes, the LPC55S04JBD64Y shares the same HTQFP64 package and pinout with LPC55S06JBD64, LPC5504JBD64, and LPC5506JBD64. All HTQFP64 variants use identical mechanical dimensions, pad layout, and signal assignments-including power, ground, debug, CAN FD, Flexcomm, ADC, and GPIO pins. Firmware developed for one HTQFP64 variant can be reused across others with only memory-size and feature-enablement adjustments.

LPC55S04JBD64Y Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-TQFP Exposed Pad
Series:
LPC55S0x
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
80K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC55S04JBD64Y FAQ

1.How can I place an order for LPC55S04JBD64Y through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC55S04JBD64Y on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC55S04JBD64Y reliable?

The price and inventory of LPC55S04JBD64Y are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S04JBD64Y is usually 5 days.

3.What payment methods are accepted for LPC55S04JBD64Y?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC55S04JBD64Y transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC55S04JBD64Y?

LPC55S04JBD64Y orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC55S04JBD64Y order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC55S04JBD64Y?

For technical support, including LPC55S04JBD64Y datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S04JBD64Y requirements.

6.How does Aetrix verify that LPC55S04JBD64Y is sourced from the original manufacturer or authorized distributors?

All LPC55S04JBD64Y products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S04JBD64Y meets industry standards.

7.What is the process for return or replacement of LPC55S04JBD64Y?

All LPC55S04JBD64Y units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S04JBD64Y, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC55S04JBD64Y part is unused and in its original packaging.

Return procedure for LPC55S04JBD64Y:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LPC55S04JBD64Y Tags

  • LPC55S04JBD64Y
  • LPC55S04JBD64Y PDF
  • LPC55S04JBD64Y Datasheet
  • LPC55S04JBD64Y Specifications
  • LPC55S04JBD64Y Images
  • NXP Semiconductors
  • NXP Semiconductors LPC55S04JBD64Y
  • Buy LPC55S04JBD64Y
  • LPC55S04JBD64Y Price
  • LPC55S04JBD64Y Distributor
  • LPC55S04JBD64Y Supplier
  • LPC55S04JBD64Y Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER