NXP Semiconductors LPC55S04JBD64Y
- Part No.:
- LPC55S04JBD64Y
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
LPC55S04JBD64Y.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 64HTQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,750
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Product details
Overview
LPC55S04JBD64Y from NXP Semiconductors is a 32-bit ARM Cortex-M33 microcontroller with TrustZone security, PRINCE flash encryption, CASPER crypto co-processor, 128 KB on-chip flash, 80 KB SRAM, and CAN FD interface-designed for secure industrial control, IoT edge nodes, and automotive body electronics requiring real-time operation and cryptographic integrity.
For engineers reviewing the LPC55S04JBD64Y datasheet, LPC55S04JBD64Y pinout, LPC55S04JBD64Y application, or LPC55S04JBD64Y equivalent, this page delivers verified specifications, HTQFP64 package mapping, functional pin roles, security architecture context, and validated alternative options for secure embedded design.
Technical Context
The LPC55S04JBD64Y implements ARMv8-M architecture with TrustZone-enabled memory isolation, integrated FPU and MPU, and hardware-accelerated cryptography via CASPER (ECC) and PRINCE (real-time flash encryption/decryption). Its dual DMA controllers (23+10 channels) support concurrent peripheral data movement including CAN FD, Flexcomm interfaces, and ADC.
Security execution relies on ROM-based secure boot with RSA-2048/4096 signature verification, SHA256 hash engine, PUF-derived key generation (64–4096 bits), AES-256, TRNG, and Code Watchdog for runtime flow integrity-enabling DICE-compliant device identity and anti-rollback firmware updates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M33 @ up to 96 MHz with TrustZone, FPU, and MPU-enables secure RTOS partitioning and DSP-intensive signal processing. |
| Memory | 128 KB flash + 80 KB SRAM (16 KB code bus + 64 KB system bus)-supports dual-bank firmware updates and real-time data buffering. |
| Security Engine | PRINCE (on-the-fly flash encryption), CASPER (ECC acceleration), PUF (silicon fingerprint key generation), AES-256, SHA2, TRNG-meets TBSA and DICE v2.0 Level 00 requirements. |
| Analog Peripherals | 16-bit 2.0 Msamples/sec ADC (9 differential channels), comparator, temperature sensor-enables high-resolution sensor fusion without external converters. |
| Serial Interfaces | 9 Flexcomm peripherals (configurable as USART/I²C/SPI/I²S), CAN FD with dedicated DMA, HS SPI-provides flexible multi-protocol connectivity in space-constrained designs. |
| Timers & Logic | 5x 32-bit general-purpose timers, SCTimer/PWM (10 outputs, 8 inputs), PLU (programmable logic unit), MRT, WWDT-supports motor control, PWM generation, and state-machine offload. |
| Package & Environment | HTQFP64 (10 × 10 × 0.5 mm), −40 °C to +105 °C operating range, single 1.8–3.6 V supply-suitable for industrial and automotive under-hood applications. |
Pinout & Package
HTQFP64 package: plastic low-profile quad flat package with 64 leads, 0.5 mm pitch, 10 × 10 × 0.5 mm body, exposed thermal pad connected to VSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0/ACMP0_A | Analog comparator input A / GPIO | Enables precision voltage monitoring when analog mode enabled; default GPIO otherwise. |
| PIO0_2/TRST | JTAG test reset / GPIO | Hardware-controlled boundary scan entry; internal pull-down at reset ensures safe debug initialization. |
| PIO0_3/TCK | JTAG clock input / GPIO | Provides synchronous timing for boundary scan operations; multiplexed with Flexcomm 3 data I/O. |
| PIO0_4/TMS | JTAG mode select / CAN0_RD | Selects JTAG state machine transitions; alternatively routes CAN FD receive signal for compact bus integration. |
| PIO0_5/TDI | JTAG data input / CAN0_TD | Loads test data during scan; also serves as CAN FD transmit output-enables shared debug/CAN routing. |
| PIO0_6/TDO | JTAG data output / GPIO | Outputs scanned test data; supports trace output (SWO) and timer match functions for debugging. |
| XTAL32K_P / XTAL32K_N | 32.768 kHz crystal oscillator inputs | Drive RTC and low-power wake-up timer with ±2% accuracy across full temperature range. |
| VDD / VSS | Power supply / ground | Multiple VDD pins ensure stable core/peripheral rail distribution; VSS pads provide low-inductance return paths. |
Key Features
| Feature | Design Value |
|---|---|
| TrustZone-enabled memory isolation | Hardware-enforced separation of secure/non-secure code and data-prevents unauthorized access to cryptographic keys and firmware assets. |
| PRINCE real-time flash encryption | Transparent AES-128 encryption/decryption of flash reads/writes-secures firmware IP without software overhead or latency penalty. |
| CASPER crypto co-processor | Hardware acceleration for ECC scalar multiplication (NIST P-256/P-384)-reduces TLS handshake time by >10× vs. software-only implementation. |
| Secure boot with DICE v2.0 | Immutable root-of-trust establishment using PUF-generated keys and x.509 certificate chain validation-ensures firmware authenticity and anti-rollback protection. |
| Flexcomm configurable serial interfaces | Up to 9 independent UART/I²C/SPI/I²S instances with shared fractional baud-rate generator-eliminates need for external protocol translators. |
Applications
| Industrial PLC Edge Node | Secure IoT Gateway |
|---|---|
Use Scenario: Localized control of sensors, actuators, and HMI in factory automation systems with over-the-air firmware updates. IC Role / Device Role / Timing Role: Main controller executing real-time deterministic tasks, managing CAN FD fieldbus communication, and enforcing secure boot before loading application firmware. Use Value: PRINCE encryption protects proprietary control algorithms; CASPER accelerates TLS 1.3 handshakes for encrypted cloud telemetry; 96 MHz Cortex-M33 ensures sub-millisecond I/O response. | Use Scenario: Aggregating and preprocessing data from BLE/Wi-Fi/Zigbee end devices before forwarding to cloud infrastructure. IC Role / Device Role / Timing Role: Secure network concentrator with hardware-accelerated crypto, isolated secure storage, and multi-protocol bridging via Flexcomm interfaces. Use Value: PUF-derived keys prevent cloning; SHA2/AES engines enable authenticated firmware signing; 80 KB SRAM buffers bursty sensor traffic without external memory. |
| Automotive Body Control Module | Medical Sensor Hub |
Use Scenario: Centralized management of lighting, door locks, and climate controls in passenger vehicles with ASIL-B compliance requirements. IC Role / Device Role / Timing Role: Safety-aware MCU handling CAN FD diagnostics, watchdog supervision (WWDT + Code Watchdog), and secure key provisioning for vehicle personalization. Use Value: TrustZone isolates safety-critical CAN stack from infotainment updates; CRC engine validates ECU configuration data; 105 °C rating supports under-dash mounting. | Use Scenario: Portable diagnostic device acquiring ECG, temperature, and SpO₂ signals with local anomaly detection and HIPAA-compliant data export. IC Role / Device Role / Timing Role: High-fidelity analog front-end controller with simultaneous 16-bit ADC sampling, real-time digital filtering, and encrypted Bluetooth LE transmission. Use Value: 2.0 Msamples/sec ADC resolves microvolt-level biopotentials; TRNG generates session keys for per-patient data encryption; secure GPIO prevents tampering with sensor inputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar secure microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC55S06JBD64 | 256 KB flash, 96 KB SRAM, identical security features and peripherals | Supports larger firmware images and complex RTOS workloads requiring extended memory | Select when firmware size exceeds 128 KB or additional RAM is needed for multi-threaded applications. |
| RA6M5GFPMXXFA | Arm Cortex-M33 @ 200 MHz, 1 MB flash, 512 KB SRAM, no PRINCE or CASPER; includes Ethernet MAC and USB HS | Better suited for high-bandwidth wired connectivity but lacks on-chip flash encryption and ECC acceleration | Choose for applications prioritizing raw throughput and wired networking over hardware crypto acceleration and flash IP protection. |
Compared with LPC55S06JBD64, the LPC55S04JBD64Y offers identical security architecture and peripheral set at reduced memory cost-ideal for cost-sensitive secure edge nodes. Versus RA6M5GFPMXXFA, it trades higher CPU speed and Ethernet for superior integrated crypto performance and smaller footprint.
Availability
LPC55S04JBD64Y is available at Aetrix Electronics and suitable for industrial PLC edge nodes, secure IoT gateways, automotive body control modules, and medical sensor hubs requiring stable component supply and long-term lifecycle assurance.
Supply support for LPC55S04JBD64Y includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and hardware security.
The LPC55S0x series targets resource-constrained embedded systems demanding certified security, real-time responsiveness, and cryptographic agility-designed specifically for applications where firmware integrity, device identity, and side-channel resistance are non-negotiable.
FAQ
What is the maximum operating frequency of the LPC55S04JBD64Y?
The LPC55S04JBD64Y operates at up to 96 MHz using its ARM Cortex-M33 core. This frequency is achievable with the internal 96 MHz Free Running Oscillator (FRO), PLL0, or PLL1 clock sources. The FRO is trimmed to ±1% accuracy across voltage and 0 °C to 85 °C, ensuring reliable timing without external crystals in many applications. All peripherals-including ADC, timers, and Flexcomm interfaces-are fully functional at this maximum rate.
Does the LPC55S04JBD64Y support secure boot with public-key cryptography?
Yes, the LPC55S04JBD64Y supports secure boot using RSASSA-PKCS1-v1_5 signatures of SHA256 digests, with RSA-2048 and RSA-4096 public keys. It validates images using x.509 certificates and stores up to four revocable Root of Trust keys in protected flash. The ROM bootloader enforces anti-rollback via image key revocation and supports NXP Secure Boot file format (SB2), making LPC55S04JBD64Y compliant with TBSA and DICE v2.0 standards.
How does the PRINCE module function in the LPC55S04JBD64Y?
The PRINCE module in the LPC55S04JBD64Y performs real-time AES-128 encryption and decryption of on-chip flash data during read/write operations. It uses keys derived from the PUF or software-supplied values, enabling transparent protection of firmware and assets without software intervention. This allows secure over-the-air updates and prevents reverse engineering of flash contents-even if the physical chip is extracted-while maintaining full compatibility with standard flash programming workflows.
What analog capabilities does the LPC55S04JBD64Y provide?
The LPC55S04JBD64Y integrates a 16-bit ADC with up to 9 differential input channels (18 single-ended), supporting simultaneous conversions at up to 2.0 Msamples/sec. It includes an on-chip temperature sensor and analog comparator with five input pins and selectable internal/external references. These analog resources are directly accessible via the AHB bus and support hardware triggers from timers or Flexcomm interfaces-enabling precise sensor acquisition without CPU intervention.
Is the LPC55S04JBD64Y pin-compatible with other members of the LPC55S0x family?
Yes, the LPC55S04JBD64Y shares the same HTQFP64 package and pinout with LPC55S06JBD64, LPC5504JBD64, and LPC5506JBD64. All HTQFP64 variants use identical mechanical dimensions, pad layout, and signal assignments-including power, ground, debug, CAN FD, Flexcomm, ADC, and GPIO pins. Firmware developed for one HTQFP64 variant can be reused across others with only memory-size and feature-enablement adjustments.
LPC55S04JBD64Y Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- LPC55S0x
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 96MHz
- Connectivity:
- CAN FD, Flexcomm, I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 80K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 9x16b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC55S04JBD64Y FAQ
1.How can I place an order for LPC55S04JBD64Y through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC55S04JBD64Y on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC55S04JBD64Y reliable?
The price and inventory of LPC55S04JBD64Y are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S04JBD64Y is usually 5 days.
3.What payment methods are accepted for LPC55S04JBD64Y?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC55S04JBD64Y transactions.
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4.How is shipping managed for LPC55S04JBD64Y?
LPC55S04JBD64Y orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC55S04JBD64Y order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC55S04JBD64Y?
For technical support, including LPC55S04JBD64Y datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S04JBD64Y requirements.
6.How does Aetrix verify that LPC55S04JBD64Y is sourced from the original manufacturer or authorized distributors?
All LPC55S04JBD64Y products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S04JBD64Y meets industry standards.
7.What is the process for return or replacement of LPC55S04JBD64Y?
All LPC55S04JBD64Y units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S04JBD64Y, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC55S04JBD64Y part is unused and in its original packaging.
Return procedure for LPC55S04JBD64Y:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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