NXP Semiconductors LPC55S06JBD64E
- Part No.:
- LPC55S06JBD64E
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
LPC55S06JBD64E.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 64HTQFP
- Quantity:
- Payment:

- Shipping:

Inventory:384
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Product details
Overview
LPC55S06JBD64E from NXP Semiconductors is a 32-bit ARM Cortex-M33 microcontroller with TrustZone security, PRINCE flash encryption, CASPER crypto co-processor, 256 KB flash, 96 KB SRAM, CAN FD interface, and 16-bit 2.0 Msamples/sec ADC. It targets secure industrial control, automotive body electronics, and IoT edge nodes requiring certified boot and hardware-accelerated cryptography.
For engineers reviewing the LPC55S06JBD64E datasheet, LPC55S06JBD64E pinout, LPC55S06JBD64E application, or LPC55S06JBD64E equivalent, key selection criteria include TrustZone-enforced memory isolation, PRINCE real-time flash encryption/decryption, CASPER-accelerated ECC operations, 45 GPIOs with secure interrupt routing, and CAN FD compliance up to 5 Mbit/s in automotive-grade temperature range (−40 °C to +105 °C).
Technical Context
The LPC55S06JBD64E implements ARMv8-M architecture with TrustZone, enabling hardware-isolated secure and non-secure execution environments. Its CASPER co-processor offloads elliptic curve cryptography (ECC) operations including point multiplication, while PRINCE performs AES-128 on-the-fly encryption/decryption of flash reads and writes without software overhead.
Security is enforced via integrated PUF for key generation, SHA-256/HMAC-AES-256 engines with dedicated DMA, RSA-2048/4096 signature verification for secure boot, and DICE-compliant Device Identifier Composition Engine. The dual DMA controllers (23+10 channels) enable concurrent peripheral-to-memory transfers across secure/non-secure domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M33 @ 96 MHz with FPU, MPU, and TrustZone isolation |
| Memory | 256 KB on-chip flash (512-byte page erase), 96 KB SRAM (16 KB code bus + 64 KB system bus + 16 KB system bus) |
| Crypto Acceleration | CASPER co-processor for ECC point multiplication; PRINCE for AES-128 flash encryption/decryption |
| Analog Peripherals | 16-bit ADC with 9 channels, 2.0 Msamples/sec sampling rate, simultaneous differential conversions |
| Serial Interfaces | 9 Flexcomm interfaces (configurable as USART/I²C/SPI/I²S), CAN FD controller with dedicated DMA |
| Security Features | PUF-based key generation, SHA-256/HMAC-AES-256, RSA-2048/4096 secure boot, DICE v2.0 compliance |
| Package & Temp | HTQFP64 (10 × 10 × 0.5 mm), −40 °C to +105 °C operating range |
Pinout & Package
Package: HTQFP64 (plastic low profile quad flat package, 64 leads, 10 × 10 × 0.5 mm body, SOT 855-5). Exposed thermal pad must be connected to VSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0/ACMP0_A | Analog comparator input A / GPIO | Configurable as secure GPIO or comparator input when analog mode enabled; supports wake-up from deep power-down |
| PIO0_5/TDI | JTAG test data input / CAN0_TD | State at reset determines boot source (ISP handler or flash); also serves as CAN FD transmit output |
| PIO0_10/ADC0_1 | ADC channel 1 input / GPIO | Dedicated 16-bit ADC input with internal reference support; accessible only when digital functions disabled on pin |
| XTAL32K_P / XTAL32K_N | 32.768 kHz crystal oscillator inputs | Drive RTC and WWDT; support external crystal or bypass mode; trimmed FRO alternative available |
| VDD_PMU / VBAT_DCDC | Power management unit supply / DC-DC converter input | Enables internal DC-DC conversion from 1.8–3.6 V single supply; reduces system power consumption |
Key Features
| Feature | Design Value |
|---|---|
| TrustZone-enforced memory isolation | Hardware partitioning of flash/SRAM into secure/non-secure regions with configurable access permissions |
| PRINCE real-time flash encryption | AES-128 encryption/decryption applied automatically during flash read/write-no CPU overhead or latency penalty |
| CASPER crypto acceleration | Hardware execution of ECC scalar multiplication (NIST P-256/P-384) reducing firmware signing time by >10× vs. software-only |
| Secure boot with revocable RoT | Supports up to four root-of-trust public keys stored in protected flash; enables anti-rollback via x.509 serial number revocation |
| Flexible Flexcomm peripherals | Eight software-configurable serial interfaces (UART/I²C/SPI/I²S) plus dedicated high-speed SPI, all with FIFO and fractional baud-rate generators |
Applications
| Industrial PLC I/O Module | Automotive Body Control Unit |
|---|---|
Use Scenario: Real-time monitoring and actuation of sensors/valves in factory automation systems with firmware update integrity requirements. IC Role / Device Role / Timing Role: Main controller executing deterministic control loops, managing CAN FD communication with master PLC, and enforcing secure OTA updates. Use Value: PRINCE-encrypted flash prevents unauthorized firmware modification; CASPER accelerates certificate validation during signed image boot. | Use Scenario: Centralized control of lighting, door locks, and window motors in passenger vehicles with ASIL-B functional safety alignment. IC Role / Device Role / Timing Role: Safety-aware MCU handling CAN FD messaging, secure key provisioning via PUF, and low-power wake-on-event operation. Use Value: TrustZone isolates safety-critical CAN stack from infotainment subsystems; RTC + WWDT ensures deterministic watchdog supervision across sleep modes. |
| Secure IoT Gateway Node | Medical Sensor Hub |
Use Scenario: Edge gateway aggregating BLE/Wi-Fi sensor data, performing local analytics, and forwarding encrypted payloads to cloud infrastructure. IC Role / Device Role / Timing Role: Secure host processor managing TLS handshakes, DICE-compliant device identity, and hardware-accelerated AES-GCM encryption. Use Value: SHA-256/HMAC-AES-256 engine with DMA offloads crypto from Cortex-M33 core; PUF-derived keys eliminate key storage vulnerabilities. | Use Scenario: Portable diagnostic device acquiring ECG/temperature data with HIPAA-compliant local storage and encrypted transmission. IC Role / Device Role / Timing Role: Low-power acquisition controller interfacing 16-bit ADC, comparator, and temperature sensor while maintaining cryptographic audit trail. Use Value: 2.0 Msamples/sec ADC enables high-fidelity waveform capture; secure GPIO pins enforce tamper detection on critical sensor inputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar secure microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC55S16JBD64 | Higher flash (512 KB), additional 16 KB SRAM, enhanced CASPER with RSA acceleration | Better suited for complex OTA stacks with dual-bank firmware and larger crypto key stores | Select when >256 KB flash or RSA-4096 acceleration is required; same pinout and peripheral set |
| RA6M5GFP64A | ARM Cortex-M33 @ 200 MHz, 1 MB flash, 384 KB SRAM, no PRINCE/CASPER, Renesas Trusted Secure IP | Lacks hardware flash encryption but offers higher compute throughput and integrated Ethernet MAC | Prefer for high-throughput deterministic control where flash encryption is handled externally or via software |
Compared with LPC55S06JBD64E, LPC55S16JBD64 provides expanded memory and RSA acceleration while maintaining pin compatibility, whereas RA6M5GFP64A trades hardware crypto acceleration for higher clock speed and connectivity-requiring architectural evaluation for security-critical use cases.
Availability
LPC55S06JBD64E is available at Aetrix Electronics and suitable for industrial PLC I/O modules, automotive body control units, and secure IoT gateway nodes requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for LPC55S06JBD64E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with leadership in ARM-based microcontrollers and trusted execution technologies.
The LPC55S0x series is designed for embedded applications demanding hardware-enforced security, real-time performance, and low-power operation-targeting automotive body electronics, industrial control, and secure edge devices.
FAQ
What is the maximum operating frequency of the LPC55S06JBD64E CPU core?
The LPC55S06JBD64E features an ARM Cortex-M33 core rated for operation up to 96 MHz. This frequency is achievable using the internal 96 MHz Free Running Oscillator (FRO), PLL0, or PLL1 clock sources. The FRO is factory-trimmed to ±1% accuracy across voltage and 0 °C to 85 °C, and ±2% over −40 °C to 105 °C. All timing-critical peripherals-including the 16-bit ADC, SCTimer/PWM, and CAN FD module-are synchronized to this clock domain, ensuring deterministic real-time behavior in the LPC55S06JBD64E.
Does the LPC55S06JBD64E support secure boot with cryptographic signature verification?
Yes, the LPC55S06JBD64E supports secure boot using RSASSA-PKCS1-v1_5 signatures of SHA256 digests. It validates images using RSA-2048 or RSA-4096 public keys stored in x.509 certificates, with up to four revocable Root of Trust keys stored in protected flash. The ROM bootloader enforces anti-rollback via image key certificate revocation using the x.509 serial number field, and supports NXP Secure Boot file format version 2.0 (SB2). This capability is integral to the LPC55S06JBD64E's security architecture and requires no external components.
How many ADC channels does the LPC55S06JBD64E provide, and what is its sampling rate?
The LPC55S06JBD64E integrates a 16-bit ADC with nine single-ended input channels (or five differential pairs), supporting simultaneous conversions on two channels within a differential pair. Its maximum sampling rate is 2.0 Msamples/sec, enabled by dedicated hardware sequencers and multiple trigger sources-including timers, Flexcomm interfaces, and external pins. The ADC connects to an integrated temperature sensor and supports internal reference voltages, making it suitable for precision measurement in the LPC55S06JBD64E's target applications.
What package type and pin count does the LPC55S06JBD64E use?
The LPC55S06JBD64E uses the HTQFP64 package: a plastic low-profile quad flat package with 64 leads, 10 mm × 10 mm body size, 0.5 mm pitch, and SOT 855-5 footprint. The exposed thermal pad must be soldered to VSS for thermal management. This package supports all 45 GPIOs, nine Flexcomm interfaces, CAN FD, and full peripheral routing as specified in the LPC55S06JBD64E datasheet, distinguishing it from the HVQFN48 variant which has fewer I/Os and Flexcomm instances.
Does the LPC55S06JBD64E include hardware acceleration for cryptographic operations beyond AES?
Yes, the LPC55S06JBD64E includes two dedicated hardware accelerators: PRINCE for AES-128 on-the-fly flash encryption/decryption, and CASPER for elliptic curve cryptography (ECC) operations including point multiplication on NIST P-256 and P-384 curves. CASPER reduces ECC computation time by more than 10× compared to software-only implementations, directly accelerating secure boot certificate validation and TLS handshake operations. These accelerators operate independently of the Cortex-M33 core, preserving CPU bandwidth for application tasks in the LPC55S06JBD64E.
LPC55S06JBD64E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- LPC55S0x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 96MHz
- Connectivity:
- CAN FD, Flexcomm, I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 9x16b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC55S06JBD64E FAQ
1.How can I place an order for LPC55S06JBD64E through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC55S06JBD64E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC55S06JBD64E reliable?
The price and inventory of LPC55S06JBD64E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S06JBD64E is usually 5 days.
3.What payment methods are accepted for LPC55S06JBD64E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC55S06JBD64E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC55S06JBD64E?
LPC55S06JBD64E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC55S06JBD64E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC55S06JBD64E?
For technical support, including LPC55S06JBD64E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S06JBD64E requirements.
6.How does Aetrix verify that LPC55S06JBD64E is sourced from the original manufacturer or authorized distributors?
All LPC55S06JBD64E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S06JBD64E meets industry standards.
7.What is the process for return or replacement of LPC55S06JBD64E?
All LPC55S06JBD64E units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S06JBD64E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC55S06JBD64E part is unused and in its original packaging.
Return procedure for LPC55S06JBD64E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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