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NXP Semiconductors LPC55S06JBD64K

Part No.:
LPC55S06JBD64K
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-TQFP Exposed Pad
Datasheet:
AetrixLPC55S06JBD64K.pdf
Description:
IC MCU 32BIT 256KB FLASH 64TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:800

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Product details

Overview

LPC55S06JBD64K from NXP Semiconductors is a secure ARM Cortex-M33 microcontroller for embedded applications requiring hardware-enforced isolation, cryptographic acceleration, and real-time analog sensing. It integrates 256 KB flash, 96 KB SRAM, PRINCE flash encryption, CASPER crypto co-processor, CAN FD interface, and a 16-bit 2.0 Msamples/sec ADC - deployed in industrial gateways, secure IoT edge nodes, and automotive body control modules.

For engineers reviewing the LPC55S06JBD64K datasheet, LPC55S06JBD64K pinout, LPC55S06JBD64K application, or LPC55S06JBD64K equivalent, key selection criteria include TrustZone®-enabled secure boot with RSA-2048/4096 support, PUF-based key generation, PRINCE real-time flash encryption, and Flexcomm-configurable serial interfaces (UART/I2C/SPI/I2S) across 8 channels.

Technical Context

The LPC55S06JBD64K implements ARM TrustZone® at the silicon level to partition secure and non-secure execution environments, with dedicated memory protection (MPU), secure GPIO, and debug authentication via RSA-2048/4096. Its CASPER co-processor accelerates ECC operations, while PRINCE enables transparent on-the-fly AES-256 encryption/decryption of flash contents during read/write.

It features dual DMA controllers (23+10 channels), five 32-bit general-purpose timers, an 8-input/10-output SCTimer/PWM, and a programmable logic unit (PLU) for custom state-machine offload - all synchronized under a unified clocking architecture with FRO-based 96 MHz core operation and 32 kHz RTC domain.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M33 @ up to 96 MHz with FPU, MPU, and TrustZone® for hardware-isolated secure/non-secure worlds
Memory256 KB on-chip flash (512-byte page erase) + 96 KB SRAM (16 KB code bus + 64 KB contiguous system bus + 16 KB system bus)
Crypto AccelerationCASPER co-processor for ECC; PRINCE module for real-time AES-256 flash encryption/decryption; PUF for 64–4096-bit key generation
Analog Peripherals16-bit ADC with 2.0 Msamples/sec sample rate, simultaneous dual-channel conversion, 9 configurable input channels
Serial Interfaces8 Flexcomm interfaces (UART/SPI/I2C/I2S configurable per channel) + dedicated CAN FD controller with DMA
Security FeaturesSecure boot with x.509 certificate validation, anti-rollback, DICE v2.0 compliance, SHA256/AES-256/HMAC/RNG engines
Package & TempHTQFP64 (10 × 10 × 0.5 mm, 0.5 mm pitch); operating range −40 °C to +105 °C

Pinout & Package

Package: HTQFP64 - plastic low-profile quad flat package, 64 leads, exposed thermal pad connected to VSS.

Pin/TerminalCircuit RoleDesign Meaning
PIO0_0/ACMP0_AAnalog comparator input A / GPIOConfigurable as secure GPIO or comparator input when analog mode enabled; supports wake-up from deep power-down
PIO0_2/TRSTJTAG test reset / GPIOHardware TRST in boundary scan mode; default pull-down at reset to ensure debug stability
PIO0_3/TCKJTAG test clock / GPIOPrimary debug clock input; also serves as Flexcomm 3 RXD/SDA/MOSI/DATA for flexible peripheral reuse
PIO0_4/TMSJTAG test mode select / CAN0_RDEnables CAN FD receive path when JTAG disabled; critical for automotive diagnostics integration
PIO0_5/TDIJTAG test data in / CAN0_TDBoot source selector at reset - HIGH = flash boot, LOW = ISP handler invocation over UART/SPI/I2C
PIO0_6/TDOJTAG test data out / GPIOSerial Wire Output (SWO) trace capability available on alternate function; enables real-time firmware profiling
XTAL32K_P / XTAL32K_N32.768 kHz crystal inputsDrive RTC and WWDT in always-on domain; support crystal load capacitor tuning via embedded capacitor banks
VDD / VDDA / VREFPCore, analog, and reference voltage suppliesSeparate analog supply (VDDA) and reference (VREFP) enable high-accuracy ADC operation independent of digital noise

Key Features

FeatureDesign Value
TrustZone®-enabled secure worldHardware-enforced isolation between secure firmware (bootloader, crypto keys, PUF) and non-secure application code
PRINCE real-time flash encryptionTransparent AES-256 encryption/decryption during flash access - no software overhead, no latency penalty
CASPER crypto co-processorHardware acceleration for Elliptic Curve Cryptography (ECC) enabling fast TLS handshake and device attestation
Flexcomm serial interface flexibility8 software-configurable peripherals supporting UART, SPI, I2C, or I2S - eliminates need for external protocol translators
Secure boot with anti-rollbackRoot-of-trust validation using x.509 certificates and revocable image keys prevents downgrade attacks in field-deployed devices
PLU programmable logic unitOn-die combinational/sequential logic engine for custom signal routing, debounce, or state-machine offload without CPU intervention

Applications

Industrial GatewaySecure IoT Edge Node

Use Scenario: Protocol translation and secure data aggregation between Modbus RTU field devices and cloud MQTT brokers.

IC Role / Device Role / Timing Role: Main application processor with CAN FD for legacy bus interfacing, Flexcomm UARTs for RS-485, and PRINCE-encrypted OTA updates.

Use Value: Hardware root of trust ensures firmware integrity; CASPER accelerates TLS 1.3 handshakes for encrypted telemetry transmission.

Use Scenario: Tamper-resistant sensor node collecting temperature, vibration, and door status in smart building infrastructure.

IC Role / Device Role / Timing Role: Secure sensor hub with PUF-generated keys, ADC for analog sensor conditioning, and wake-up-capable GPIO for motion-triggered sampling.

Use Value: Deep power-down mode with RTC wake-up reduces average current to <2 µA; secure boot prevents malicious firmware injection.

Automotive Body Control ModuleMedical Diagnostic Interface

Use Scenario: Centralized lighting, window lift, and mirror control unit compliant with ISO 11898-1 CAN FD physical layer.

IC Role / Device Role / Timing Role: CAN FD master with DMA-accelerated message handling, SCTimer/PWM for LED dimming, and secure boot for ECU firmware updates.

Use Value: 5 Mbps CAN FD bandwidth enables faster calibration data transfer; TrustZone® isolates safety-critical functions from infotainment subsystems.

Use Scenario: Portable diagnostic adapter connecting ultrasound probes to tablet-based analysis software via USB-to-UART bridge.

IC Role / Device Role / Timing Role: High-fidelity analog front-end with 16-bit ADC and simultaneous sampling, Flexcomm I2S for audio streaming, and secure bootloader for HIPAA-compliant firmware updates.

Use Value: 2.0 Msamples/sec ADC resolution preserves signal fidelity for Doppler shift detection; SHA256+RSA-4096 ensures update authenticity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar secure microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LPC55S16JBD64Same package and core; adds 1 MB flash, dual-core M33 option, enhanced CAN FD filtering, and additional Flexcomm interfacesBetter suited for complex multi-threaded firmware with larger OTA images and advanced CAN message filtering requirementsSelect when >256 KB flash or dual-core deterministic scheduling is required - not a drop-in replacement due to memory map differences
RA6M5GFPM80AARM Cortex-M33 @ 200 MHz, 1 MB flash, 384 KB SRAM, but lacks PRINCE, CASPER, and PUF; uses Renesas Secure Crypto Engine insteadStronger raw performance and larger memory, but requires external secure element for equivalent key protection and flash encryptionChoose for higher compute throughput where hardware-accelerated ECC and on-the-fly flash encryption are secondary to processing headroom

Compared with LPC55S16JBD64 and RA6M5GFPM80A, the LPC55S06JBD64K delivers optimal balance of certified security primitives (PRINCE/CASPER/PUF), compact footprint, and cost efficiency for mid-tier secure edge applications - without over-provisioning flash or sacrificing TrustZone®-based isolation.

Availability

LPC55S06JBD64K is available at Aetrix Electronics and suitable for industrial gateways, secure IoT edge nodes, and automotive body control modules requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for LPC55S06JBD64K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and cryptographic IP.

The LPC55S0x series targets resource-constrained yet security-critical embedded systems, combining TrustZone®, PRINCE, CASPER, and PUF to deliver certified hardware root of trust in a single-chip solution.

FAQ

What is the maximum operating frequency of the LPC55S06JBD64K core?

The LPC55S06JBD64K features an ARM Cortex-M33 core rated for operation up to 96 MHz, driven by the internal Free Running Oscillator (FRO) or PLL-synthesized clocks. This frequency is sustained across the full −40 °C to +105 °C temperature range and 1.8 V to 3.6 V supply voltage, with FRO trimming ensuring ±1% accuracy at 96 MHz over 0 °C to 85 °C and ±2% over the extended range. The LPC55S06JBD64K achieves deterministic real-time performance without external crystal dependency for core timing.

Does the LPC55S06JBD64K support secure boot with public-key cryptography?

Yes, the LPC55S06JBD64K supports secure boot using RSASSA-PKCS1-v1_5 signatures of SHA256 digests, validated against RSA-2048 or RSA-4096 public keys stored in x.509 certificates. It enforces anti-rollback via image key revocation and supports up to four root-of-trust keys in protected flash. The LPC55S06JBD64K implements DICE v2.0 Level 00 for device identity composition and integrates debug authentication to prevent unauthorized firmware access - all verified in the ROM bootloader before application code execution.

How many ADC input channels does the LPC55S06JBD64K provide, and what is its sampling capability?

The LPC55S06JBD64K integrates a 16-bit successive-approximation ADC with nine configurable input channels (supporting up to five differential pairs), capable of simultaneous conversions on two channels within a pair. It achieves a maximum sample rate of 2.0 Msamples/sec with internal or external trigger sources, and includes integrated temperature sensing. The ADC operates independently of CPU load via DMA, and its dedicated VDDA/VREFP supplies ensure <±1 LSB INL across the operating temperature range - critical for precision sensor interfacing in the LPC55S06JBD64K.

What serial communication interfaces are available on the LPC55S06JBD64K?

The LPC55S06JBD64K provides eight Flexcomm interfaces (FC0–FC7), each software-configurable as USART, SPI, I2C, or I2S, plus one dedicated high-speed SPI (FC8). It also includes a CAN FD controller with integrated DMA. Each Flexcomm supports FIFO buffering, fractional baud-rate generation, and timeout detection. The LPC55S06JBD64K's Flexcomm architecture allows dynamic reassignment - for example, FC3 can serve as UART for debugging while FC4 handles I2C sensor polling and FC5 manages SPI flash programming - maximizing peripheral utilization without hardware redesign.

Is the LPC55S06JBD64K pin-compatible with other members of the LPC55S0x family?

Yes, the LPC55S06JBD64K in HTQFP64 packaging shares identical pinout and electrical characteristics with other HTQFP64 variants in the LPC55S0x/LPC550x family, including LPC55S04JBD64 and LPC5506JBD64. All share the same 64-pin mapping, power domains, reset behavior, and peripheral pin assignments - enabling hardware reuse across different flash/SRAM configurations and feature sets. However, functional differences (e.g., CAN FD vs. CAN 2.0, PRINCE presence, PUF availability) require firmware-level validation, as the LPC55S06JBD64K's security features are not mirrored in non-S-series variants.

LPC55S06JBD64K Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-TQFP Exposed Pad
Series:
LPC55S0x
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
96K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC55S06JBD64K FAQ

1.How can I place an order for LPC55S06JBD64K through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC55S06JBD64K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC55S06JBD64K reliable?

The price and inventory of LPC55S06JBD64K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S06JBD64K is usually 5 days.

3.What payment methods are accepted for LPC55S06JBD64K?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC55S06JBD64K transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC55S06JBD64K?

LPC55S06JBD64K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC55S06JBD64K order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC55S06JBD64K?

For technical support, including LPC55S06JBD64K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S06JBD64K requirements.

6.How does Aetrix verify that LPC55S06JBD64K is sourced from the original manufacturer or authorized distributors?

All LPC55S06JBD64K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S06JBD64K meets industry standards.

7.What is the process for return or replacement of LPC55S06JBD64K?

All LPC55S06JBD64K units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S06JBD64K, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC55S06JBD64K part is unused and in its original packaging.

Return procedure for LPC55S06JBD64K:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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