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NXP Semiconductors LPC55S14JBD64E

Part No.:
LPC55S14JBD64E
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-TQFP Exposed Pad
Datasheet:
AetrixLPC55S14JBD64E.pdf
Description:
IC MCU 32BIT 128KB FLASH 64HTQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,502

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Product details

Overview

LPC55S14JBD64E from NXP Semiconductors is an Arm Cortex-M33 microcontroller with TrustZone security, 128 KB flash, 80 KB SRAM, PRINCE flash encryption, CASPER crypto co-processor, and dual-mode USB (FS/HS) for secure embedded control in industrial gateways, automotive body electronics, and IoT edge nodes.

For engineers reviewing the LPC55S14JBD64E datasheet, LPC55S14JBD64E pinout, LPC55S14JBD64E application, or LPC55S14JBD64E equivalent, this page delivers verified specifications, HTQFP64 package mapping, security feature implementation details, and real-world use cases requiring secure boot, CAN FD communication, and high-speed analog acquisition at up to 2.0 Msamples/sec.

Technical Context

The LPC55S14JBD64E implements Arm TrustZone to isolate secure and non-secure execution environments, enabling hardware-enforced memory and peripheral protection. Its CASPER co-processor accelerates ECC operations, while PRINCE performs real-time AES-256 encryption/decryption of on-chip flash during read/write cycles.

It integrates two USB controllers (full-speed and high-speed) with crystal-less FS operation, a 16-bit ADC capable of simultaneous differential conversions, and nine Flexcomm interfaces configurable as USART/SPI/I2C/I2S-each with dedicated FIFO and fractional baud-rate generation.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M33 @ 150 MHz with FPU, MPU, and TrustZone isolation
Memory128 KB on-chip flash + 80 KB SRAM (16 KB code bus, 64 KB system bus)
SecurityPRINCE flash encryption, CASPER crypto engine, PUF-based key generation, SHA2/AES/RNG, secure boot with RSA-2048/4096
Analog16-bit 2.0 Msamples/sec ADC with 5 differential/10 single-ended channels and integrated temperature sensor
ConnectivityCAN FD, dual USB (FS + HS), nine Flexcomm interfaces (USART/SPI/I2C/I2S), I2C Fast-mode Plus (1 Mbit/s)
TimersFive 32-bit general-purpose timers, SCTimer/PWM (8 inputs/10 outputs), RTC with wake-up from deep power-down
PackageHTQFP64, 10 × 10 × 0.5 mm, 64-pin quad flat package with exposed thermal pad

Pinout & Package

HTQFP64 package with 0.5 mm pitch, 10 mm × 10 mm body, and exposed thermal pad for enhanced thermal performance in compact industrial and automotive PCB layouts.

Pin/TerminalCircuit RoleDesign Meaning
PIO0_0–PIO0_35General-purpose I/O / Secure GPIO / Analog input36 configurable pins supporting digital I/O, comparator inputs, ADC channels, and secure GPIO functionality
USB0_DP / USB0_DMUSB Full-Speed differential pairOn-chip PHY enables crystal-less FS device operation; supports HID-class ISP programming
USB1_DP / USB1_DMUSB High-Speed differential pairDedicated HS PHY with internal termination; requires external 5 V supply for HS host mode
CAN0_TD / CAN0_RDCAN FD transceiver interfaceDirect connection to external CAN transceiver; supports bit rates up to 5 Mbit/s in FD mode
XTAL_IN / XTAL_OUTExternal crystal oscillator input/outputSupports 12–32 MHz crystals for precise clocking; optional bypass mode for external clock input
VDDA / VSSAAnalog power supply and groundSeparate analog domain for ADC, comparator, and temperature sensor to minimize noise coupling

Key Features

FeatureDesign Value
TrustZone-enabled secure executionHardware-isolated secure world for cryptographic key management, secure firmware updates, and protected peripheral access
PRINCE real-time flash encryptionTransparent AES-256 encryption/decryption of flash reads/writes without software overhead or latency penalty
CASPER crypto accelerationHardware offload for ECC scalar multiplication, enabling fast TLS handshake and secure device onboarding
Flexcomm serial interface flexibilityNine independent peripherals each configurable as USART, SPI, I2C, or I2S-reducing BOM count and layout complexity
2.0 Msamples/sec simultaneous ADCTrue simultaneous sampling across two differential channels enables accurate motor phase current measurement

Applications

Industrial PLC I/O ModuleAutomotive Body Control Unit

Use Scenario: Real-time monitoring of 16-channel analog sensor inputs (temperature, pressure, current) in factory automation cabinets.

IC Role / Device Role / Timing Role: Main controller executing deterministic control loops, managing CAN FD bus communication with HMI, and performing secure OTA updates.

Use Value: 16-bit ADC with 2.0 Msamples/sec simultaneous sampling ensures synchronized capture of multi-phase motor currents; PRINCE protects firmware against unauthorized modification.

Use Scenario: Centralized control of door locks, lighting, window lift, and seat position in 12 V vehicle architectures.

IC Role / Device Role / Timing Role: Safety-critical node implementing secure boot, CAN FD messaging, and low-power wake-on-event via GPIO interrupts.

Use Value: TrustZone isolates secure key storage and authentication logic from application firmware; PUF generates unique device keys without external secure element.

Secure IoT Edge GatewayMedical Diagnostic Handheld

Use Scenario: Aggregating BLE/Wi-Fi sensor data, performing local AI inference, and forwarding encrypted payloads to cloud via TLS over CAN FD or USB.

IC Role / Device Role / Timing Role: Root-of-trust anchor with DICE-compliant device identity, SHA2/AES acceleration, and secure debug authentication.

Use Value: CASPER enables fast ECDSA signature verification for firmware image validation; RNG and PUF support FIPS 140-2 Level 3 cryptographic requirements.

Use Scenario: Portable ultrasound or ECG device requiring low-noise analog front-end, battery-efficient operation, and HIPAA-compliant data encryption.

IC Role / Device Role / Timing Role: Mixed-signal SoC handling ADC digitization, real-time signal processing, USB HID interface to PC, and encrypted storage.

Use Value: 16-bit ADC with integrated temperature sensor enables calibration compensation; deep-sleep modes with RTC wake-up extend battery life beyond 72 hours.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LPC55S16JBD64256 KB flash, 96 KB SRAM, identical security/peripheral setHigher firmware footprint capacity; suitable for complex RTOS-based applicationsSelect when >128 KB flash is required for application + bootloader + secure update partitioning
RA6M5GFP64FBArm Cortex-M33 @ 200 MHz, 1 MB flash, 448 KB SRAM, no PRINCE/CASPER, Renesas Secure Crypto EngineLarger memory, higher CPU throughput, but lacks hardware-accelerated ECC and real-time flash encryptionChoose for compute-intensive tasks where cryptographic acceleration is handled externally or via software libraries

Compared with LPC55S14JBD64E, LPC55S16JBD64 offers expanded memory for larger secure firmware images, while RA6M5GFP64FB trades NXP's integrated PRINCE/CASPER for greater raw processing headroom and different security architecture-requiring evaluation of key provisioning, update integrity, and side-channel resistance requirements.

Availability

LPC55S14JBD64E is available at Aetrix Electronics and suitable for industrial PLC I/O modules, automotive body control units, and secure IoT edge gateways requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for LPC55S14JBD64E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC55S1x series targets secure embedded applications demanding hardware-enforced isolation, cryptographic acceleration, and flexible mixed-signal integration-designed specifically for devices requiring certified secure boot, field-upgradable firmware, and robust peripheral interfacing in harsh environments.

FAQ

What is the maximum operating frequency of the LPC55S14JBD64E?

The LPC55S14JBD64E operates at a maximum CPU frequency of 150 MHz using its Arm Cortex-M33 core. This speed is achievable with PLL0 or PLL1 clock sources derived from the internal 12 MHz FRO, external crystal (12–32 MHz), or 32.768 kHz RTC oscillator. The FPU and DSP extensions remain fully functional at this rate, enabling efficient floating-point math and signal processing workloads within the LPC55S14JBD64E.

Does the LPC55S14JBD64E support crystal-less USB full-speed device operation?

Yes, the LPC55S14JBD64E supports crystal-less USB full-speed device operation using its internal 48 MHz clock derived from the FRO. This capability eliminates the need for an external 48 MHz crystal or oscillator in USB device implementations, reducing BOM cost and board space. The feature is enabled via software library example TN00065 and applies only to USB device mode-not host mode-which still requires an external clock source for the HS PHY.

How many GPIO pins are available on the LPC55S14JBD64E in the HTQFP64 package?

The LPC55S14JBD64E in HTQFP64 package provides 36 GPIO pins (PIO0_0 through PIO0_35). All support digital I/O, interrupt generation (rising/falling/both edges), and secure GPIO configuration. Up to eight can be configured as pin interrupts (PINT), and two support grouped logical (AND/OR) interrupt generation (GINT). These GPIOs are mapped to the AHB bus for low-latency access and DMA support.

What security features differentiate the LPC55S14JBD64E from standard Cortex-M33 MCUs?

The LPC55S14JBD64E integrates multiple hardware security blocks beyond baseline TrustZone: PRINCE for real-time flash encryption, CASPER for ECC acceleration, PUF for silicon-unique key generation, and DICE-compliant device identity. It also includes secure boot with RSA-2048/4096 verification, debug authentication, and Code Watchdog for runtime code flow integrity-features not present in generic Cortex-M33 implementations and validated per TBSA compliance.

Can the LPC55S14JBD64E's ADC perform simultaneous sampling on multiple channels?

Yes, the LPC55S14JBD64E's 16-bit ADC supports simultaneous conversions on two ADC input channels belonging to the same differential pair. This capability enables precise phase-current measurement in motor control applications where timing skew between channels must be eliminated. The ADC achieves up to 2.0 Msamples/sec aggregate rate with programmable sample-and-hold timing, internal/external triggering, and direct DMA transfer to SRAM-fully supported in the LPC55S14JBD64E.

LPC55S14JBD64E Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-TQFP Exposed Pad
Series:
LPC55S1x
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
80K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC55S14JBD64E FAQ

1.How can I place an order for LPC55S14JBD64E through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC55S14JBD64E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC55S14JBD64E reliable?

The price and inventory of LPC55S14JBD64E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S14JBD64E is usually 5 days.

3.What payment methods are accepted for LPC55S14JBD64E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC55S14JBD64E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC55S14JBD64E?

LPC55S14JBD64E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC55S14JBD64E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC55S14JBD64E?

For technical support, including LPC55S14JBD64E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S14JBD64E requirements.

6.How does Aetrix verify that LPC55S14JBD64E is sourced from the original manufacturer or authorized distributors?

All LPC55S14JBD64E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S14JBD64E meets industry standards.

7.What is the process for return or replacement of LPC55S14JBD64E?

All LPC55S14JBD64E units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S14JBD64E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC55S14JBD64E part is unused and in its original packaging.

Return procedure for LPC55S14JBD64E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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