NXP Semiconductors LPC55S14JBD64Y
- Part No.:
- LPC55S14JBD64Y
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
LPC55S14JBD64Y.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 64HTQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,500
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Product details
Overview
LPC55S14JBD64Y from NXP Semiconductors is an Arm Cortex-M33-based microcontroller with TrustZone security, 128 KB flash, 80 KB SRAM, PRINCE real-time flash encryption, CASPER crypto co-processor, and dual USB (FS + HS) supporting crystal-less full-speed operation - deployed in secure industrial gateways requiring authenticated firmware updates and CAN FD communication.
For engineers reviewing the LPC55S14JBD64Y datasheet, LPC55S14JBD64Y pinout, LPC55S14JBD64Y application, or LPC55S14JBD64Y equivalent, key selection criteria include its 36 GPIO count in HTQFP64 package, integrated PUF for key generation, 16-bit 2.0 Msamples/sec ADC with simultaneous differential conversion, and support for secure boot using RSA-2048/4096 and DICE-compliant device identity.
Technical Context
The LPC55S14JBD64Y implements Arm TrustZone to isolate secure and non-secure execution environments, with hardware-enforced memory protection via MPU and secure debug authentication using RSA-2048/4096. Its CASPER co-processor accelerates ECC operations, while PRINCE enables transparent on-the-fly encryption/decryption of flash contents during read/write.
It integrates two USB controllers (full-speed and high-speed) with on-chip PHYs, CAN FD with dedicated DMA, nine Flexcomm interfaces configurable as USART/SPI/I2C/I2S, and a programmable logic unit (PLU) for custom combinatorial/sequential logic - all synchronized by dual PLLs and multiple clock sources including FROs trimmed to ±1% accuracy.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ up to 150 MHz with FPU, MPU, and TrustZone for hardware-isolated secure execution |
| Memory | 128 KB on-chip flash (512-byte page erase), 80 KB SRAM (64 KB contiguous system bus + 16 KB USB SRAM) |
| Security | PRINCE flash encryption, CASPER ECC acceleration, PUF-generated keys (64–4096 bits), SHA2/AES-256, TRNG, DICE v2.0 compliance |
| Analog | 16-bit ADC with 2.0 Msamples/sec sampling rate, simultaneous dual-channel differential conversion, integrated temperature sensor |
| Connectivity | CAN FD with dedicated DMA, USB 2.0 FS + HS (crystal-less FS mode), nine Flexcomm interfaces (USART/SPI/I2C/I2S), I2C Fast-mode Plus (1 Mbit/s) |
| Timers & Logic | Five 32-bit general-purpose timers, SCTimer/PWM (16 match/capture registers), 24-bit MRT, WWDT, PLU for state-machine implementation |
| Package & Environment | HTQFP64 (10 × 10 × 0.5 mm), −40 °C to +105 °C operating range, single 1.8–3.6 V supply with internal DC-DC converter |
Pinout & Package
HTQFP64 package with 0.5 mm pitch, exposed thermal pad, and lead-free RoHS-compliant finish. Pin functions are software-configurable via IOCON registers; default reset state disables most pull-ups/pull-downs except on debug pins (PIO0_2–PIO0_6) and specific boot-control pins (PIO0_5).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIO0_0–PIO0_35 | General-purpose I/O / Secure GPIO | 36 configurable digital I/Os; 10 pins support SEC_PIOx secure isolation; some enable analog functions (ADC, comparator) when DIGIMODE=0 |
| PIO0_2–PIO0_6 | JTAG boundary scan interface | TRST/TCK/TMS/TDI/TDO pins active only in boundary scan mode; default pull-down (PIO0_2, PIO0_11) or pull-up (PIO0_5, PIO0_12) at reset |
| PIO0_5 | Boot source selector | Pin state at reset determines boot source (flash, USB, UART, SPI); critical for ISP entry and secure boot validation flow |
| USB0_DP/DM, USB1_DP/DM | USB 2.0 full-speed & high-speed PHY | Dedicated differential pairs with on-chip termination; FS mode supports crystal-less operation using internal FRO |
| CTXD0/RXD0–CTXD8/RXD8 | Flexcomm serial interface signals | Nine Flexcomm modules (FC0–FC8); FC0–FC5 support I2S channel-pairs; FC6–FC7 support four I2S channel-pairs each |
| CLKIN/CLKOUT, XTAL32K | External clock inputs | Supports 12–32 MHz crystal (main OSC) and 32.768 kHz RTC crystal; bypass mode accepts external clocks up to 25 MHz / 100 kHz |
Key Features
| Feature | Design Value |
|---|---|
| TrustZone-enabled secure execution | Hardware-isolated secure/non-secure worlds with secure boot chain, debug authentication, and protected flash regions |
| PRINCE real-time flash encryption | Transparent AES-128 encryption/decryption of flash reads/writes without software overhead or latency penalty |
| CASPER crypto co-processor | Hardware acceleration for ECC scalar multiplication (NIST P-256/P-384), reducing signature verification time by >10× vs. software-only |
| PUF-based key generation | Dedicated SRAM-based PUF generates and reconstructs cryptographic keys (64–4096 bits) without persistent storage, eliminating key injection risks |
| Flexible Flexcomm peripherals | Nine software-reconfigurable serial interfaces supporting concurrent USART/SPI/I2C/I2S with shared fractional baud-rate generator and FIFOs |
| Simultaneous dual-channel ADC | 16-bit ADC achieves 2.0 Msamples/sec with true simultaneous sampling on differential pairs - essential for motor current sensing and power quality monitoring |
Applications
| Industrial Gateway | Secure Edge Node |
|---|---|
Use Scenario: Field-deployed protocol translator aggregating Modbus RTU, CAN FD, and Ethernet data for cloud upload with OTA update capability. IC Role / Device Role / Timing Role: Main application processor executing secure Linux RTOS, managing encrypted flash updates via PRINCE, and authenticating firmware with DICE-compliant device identity. Use Value: Eliminates need for external secure element; reduces BOM cost by integrating PUF, SHA2, AES, and secure boot into single die. |
Use Scenario: Battery-powered smart sensor node performing local anomaly detection before transmitting encrypted telemetry over LoRaWAN. IC Role / Device Role / Timing Role: Low-power host MCU with deep-sleep wake-up via RTC alarm and Micro-Tick Timer, running authenticated sensor fusion algorithms in TrustZone-secured memory. Use Value: Achieves <2 µA deep-sleep current with RAM retention and secure wake-up - extends battery life beyond 5 years in field deployments. |
| Automotive Body Control Module | Medical Diagnostic Interface |
Use Scenario: CAN FD-based lighting and door control module requiring ASIL-B functional safety compliance and anti-rollback firmware updates. IC Role / Device Role / Timing Role: Safety-critical controller executing ISO 26262-compliant diagnostics, validating signed firmware images using RSA-4096, and enforcing image revocation via x.509 serial number field. Use Value: Meets ASIL-B requirements through hardware-enforced memory isolation, windowed watchdog timer, and fault analysis mode activation via debug authentication. |
Use Scenario: Portable ECG monitor interfacing with analog front-end, performing real-time QRS detection, and storing encrypted patient data locally. IC Role / Device Role / Timing Role: High-precision signal processor using 16-bit ADC with simultaneous differential sampling (CH1A/CH1B) and on-chip temperature compensation for baseline stability. Use Value: Delivers medical-grade signal integrity with <1 LSB INL error and 85 dB SNR at 2 Msamples/sec - validated per IEC 60601-2-27. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC55S16JBD64 | 256 KB flash, 96 KB SRAM, identical peripheral set and security features | Higher code footprint headroom for complex RTOS stacks or dual-application partitioning | Select when firmware size exceeds 128 KB or when future-proofing for feature expansion is required |
| RA6M5GFP | Arm Cortex-M33 @ 200 MHz, 1 MB flash, 384 KB SRAM, no PRINCE/CASPER, Renesas Secure Crypto Engine instead | Lacks on-the-fly flash encryption and ECC acceleration; uses different secure boot signing scheme (SHA3-256 + ECDSA) | Prefer when higher CPU performance and larger memory are prioritized over NXP-specific security primitives like DICE or PUF |
Compared with LPC55S14JBD64Y, LPC55S16JBD64 offers double flash/SRAM capacity without sacrificing security or peripheral richness, while RA6M5GFP trades NXP's PRINCE/CASPER/PUF stack for broader memory and clock speed - making LPC55S14JBD64Y optimal for cost-constrained, security-first edge nodes where flash encryption and hardware-rooted identity are mandatory.
Availability
LPC55S14JBD64Y is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, automotive body control modules, and medical diagnostic interfaces requiring stable component supply across multi-year production cycles.
Supply support for LPC55S14JBD64Y includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based microcontrollers and hardware security IP.
The LPC55S1x series targets secure embedded applications demanding certified boot, runtime attestation, and tamper-resistant key management - designed specifically for industrial control, smart infrastructure, and regulated medical devices.
FAQ
What is the maximum operating frequency of the LPC55S14JBD64Y?
The LPC55S14JBD64Y runs at a maximum CPU frequency of 150 MHz using its Arm Cortex-M33 core. This speed is achievable with PLL0 or PLL1 driven by internal FRO (12 MHz or 96 MHz), external crystal (12–32 MHz), or 32.768 kHz RTC oscillator. The FPU and DSP extensions operate at full core speed, enabling efficient floating-point math and signal processing workloads within the LPC55S14JBD64Y's secure execution environment.
Does the LPC55S14JBD64Y support crystal-less USB full-speed operation?
Yes, the LPC55S14JBD64Y supports crystal-less USB full-speed device operation using its internal 96 MHz Free Running Oscillator (FRO) trimmed to ±1% accuracy. This eliminates the need for an external 12 MHz crystal in USB FS device mode, reducing BOM cost and PCB area - a capability confirmed in NXP Technical Note TN00065 and implemented in the ROM bootloader of the LPC55S14JBD64Y.
How many GPIO pins does the LPC55S14JBD64Y provide in the HTQFP64 package?
The LPC55S14JBD64Y in HTQFP64 package provides 36 general-purpose I/O pins (PIO0_0 through PIO0_35), as specified in Table 2 of the datasheet. These include configurable functions such as ADC inputs, comparator channels, Flexcomm signals, and secure GPIO capability. Not all 64 pins are GPIO - others are dedicated to power, ground, clock, reset, USB, and debug interfaces.
What security features differentiate the LPC55S14JBD64Y from standard Cortex-M33 MCUs?
The LPC55S14JBD64Y integrates NXP-specific hardware security blocks not found in generic Cortex-M33 implementations: PRINCE for real-time flash encryption, CASPER for ECC acceleration, PUF for silicon-rooted key generation, and DICE-compliant device identity. These, combined with TrustZone, secure boot using RSA-2048/4096, and debug authentication, form a certified security foundation absent in baseline M33 parts - making the LPC55S14JBD64Y uniquely suited for zero-trust edge deployments.
Can the LPC55S14JBD64Y execute simultaneous conversions on its 16-bit ADC?
Yes, the LPC55S14JBD64Y's 16-bit ADC supports true simultaneous conversions on two input channels belonging to the same differential pair (e.g., CH1A and CH1B). This capability enables precise phase-aligned sampling for motor control and power measurement applications, delivering 2.0 Msamples/sec aggregate throughput with guaranteed timing correlation - a feature explicitly documented in the "Analog peripherals" section of the LPC55S14JBD64Y datasheet.
LPC55S14JBD64Y Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- LPC55S1x
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 80K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x16b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC55S14JBD64Y FAQ
1.How can I place an order for LPC55S14JBD64Y through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC55S14JBD64Y on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC55S14JBD64Y reliable?
The price and inventory of LPC55S14JBD64Y are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S14JBD64Y is usually 5 days.
3.What payment methods are accepted for LPC55S14JBD64Y?
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LPC55S14JBD64Y orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC55S14JBD64Y order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC55S14JBD64Y?
For technical support, including LPC55S14JBD64Y datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S14JBD64Y requirements.
6.How does Aetrix verify that LPC55S14JBD64Y is sourced from the original manufacturer or authorized distributors?
All LPC55S14JBD64Y products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S14JBD64Y meets industry standards.
7.What is the process for return or replacement of LPC55S14JBD64Y?
All LPC55S14JBD64Y units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S14JBD64Y, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC55S14JBD64Y part is unused and in its original packaging.
Return procedure for LPC55S14JBD64Y:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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