Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors LPC55S16JBD100E

Part No.:
LPC55S16JBD100E
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-LQFP Exposed Pad
Datasheet:
AetrixLPC55S16JBD100E.pdf
Description:
IC MCU 32BIT 256KB FLSH 100HLQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,319

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

LPC55S16JBD100E from NXP Semiconductors is a 32-bit Arm Cortex-M33 microcontroller with TrustZone security, PRINCE flash encryption, CASPER crypto acceleration, 256 KB on-chip flash, 96 KB SRAM, and dual USB (FS + HS) support. It integrates CAN FD, a 16-bit 2.0 Msamples/sec ADC, SCTimer/PWM, PLU, temperature sensor, and secure boot for industrial edge nodes requiring robust firmware integrity and real-time control.

For engineers reviewing the LPC55S16JBD100E datasheet, LPC55S16JBD100E pinout, LPC55S16JBD100E application, or LPC55S16JBD100E equivalent, this page delivers verified specifications, package mapping to HLQFP100, functional pin roles, security architecture details, and validated alternative parts for secure embedded design evaluation.

Technical Context

The LPC55S16JBD100E implements Arm TrustZone to isolate secure and non-secure execution environments, with hardware-enforced memory protection via MPU and secure debug authentication using RSA-2048/4096. Its CASPER co-processor accelerates ECC operations, while PRINCE enables real-time AES-256 encryption/decryption of flash contents during read/write.

It features two DMA controllers (23+10 channels), nine Flexcomm interfaces configurable as USART/SPI/I²C/I²S, dual USB PHYs (full-speed crystal-less and high-speed), and a programmable logic unit (PLU) for glue logic offload. The 150 MHz Cortex-M33 core includes FPU, DSP instructions, and NVIC with NMI support.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreArm Cortex-M33 @ up to 150 MHz with FPU, DSP, TrustZone, and MPU
Memory256 KB on-chip flash (512-byte page erase), 96 KB SRAM (16 KB code + 64 KB system + 16 KB USB)
SecurityPRINCE flash encryption, CASPER ECC accelerator, PUF-based key generation, SHA2/AES-256, secure boot with x509 RoT revocation
Analog16-bit ADC @ 2.0 Msamples/sec (5 differential/10 single-ended), integrated temp sensor, 5-input comparator
ConnectivityCAN FD, USB 2.0 full-speed (crystal-less) + high-speed host/device, 9 Flexcomm interfaces (USART/SPI/I²C/I²S)
Timers & Logic5× 32-bit CTimers, SCTimer/PWM (16 match/capture, 10 outputs), 24-bit MRT, RTC, WWDT, PLU
PackageHLQFP100 (14 × 14 × 0.5 mm, 0.5 mm pitch), 64 GPIO pins, −40 °C to +105 °C operating range

Pinout & Package

HLQFP100 package with 100 leads, body size 14 mm × 14 mm × 0.5 mm, 0.5 mm pitch, exposed thermal pad, RoHS-compliant. Pinout supports JTAG boundary scan, SWD debug (PIO0_11/PIO0_12), USB FS/HS PHY routing, CAN FD transceiver interface, and dual crystal oscillator inputs (12–32 MHz and 32.768 kHz).

Pin/Terminal Circuit Role Design Meaning
PIO0_11 / SWDIOSerial Wire Debug I/OPrimary debug interface; default pull-down enables SWD operation through reset
PIO0_12 / SWCLKSerial Wire Debug ClockDebug clock input; default pull-down ensures reliable debug initialization
PIO0_5Boot Mode Select / CAN0_TDState at reset determines boot source (flash/ISP); also serves as CAN FD transmit output
PIO0_4CAN0_RD / Flexcomm 4 SCKDedicated CAN FD receive input; alternatively used as SPI/I²C/USART clock for Flexcomm 4
USB_DP / USB_DMUSB Full-Speed Differential PairOn-chip PHY supports crystal-less operation in device mode; routed to dedicated USB pads
XTAL_IN / XTAL_OUTMain Crystal Oscillator InterfaceSupports 12–32 MHz crystals; internal capacitor banks tunable via API for CL optimization

Key Features

Feature Design Value
TrustZone-enabled Secure ExecutionHardware-isolated secure/non-secure worlds with configurable memory regions and peripheral access control
PRINCE Real-Time Flash EncryptionTransparent AES-256 encryption/decryption during flash read/write; enables secure OTA updates without software overhead
CASPER Crypto AccelerationHardware ECC engine supporting NIST P-256/P-384 curves; reduces signature verification time by >10× vs. software-only
Flexcomm Serial PeripheralsNine software-configurable interfaces (0–7, 8) supporting USART/SPI/I²C/I²S with FIFO and fractional baud-rate generators
SCTimer/PWM Advanced TimingState-machine-based timer with 16 capture/match registers, 10 outputs, and event-driven routing to peripherals or pins
Secure Boot with DICE ComplianceRoot-of-trust establishment via PFR-stored SHA-256 hashes; supports anti-rollback and TCG DICE v2.0 Level 00

Applications

Industrial PLC Edge Node Secure Automotive Gateway

Use Scenario: Localized logic execution and fieldbus bridging in compact PLC modules with remote firmware update capability.

IC Role / Device Role / Timing Role: Main controller executing ladder logic, managing CAN FD fieldbus, and enforcing secure boot before loading control firmware.

Use Value: PRINCE-encrypted flash prevents unauthorized firmware modification; CASPER accelerates certificate validation during OTA updates.

Use Scenario: In-vehicle network gateway aggregating CAN FD, USB diagnostics, and secure firmware provisioning across ECUs.

IC Role / Device Role / Timing Role: Central secure domain controller handling encrypted communication between domains, with TrustZone isolating safety-critical CAN FD traffic.

Use Value: Dual USB (FS + HS) enables high-bandwidth diagnostic logging; PUF-derived keys protect vehicle identity and session keys.

Smart Energy Metering Hub Medical IoT Sensor Aggregator

Use Scenario: Multi-sensor data acquisition and tamper-resistant energy reporting in utility-grade smart meters.

IC Role / Device Role / Timing Role: High-precision timing controller synchronizing ADC sampling (2.0 Msamples/sec) with RTC alarm events for scheduled meter reads.

Use Value: 16-bit ADC with simultaneous differential conversion ensures accurate current/voltage measurement; SHA2/AES engines sign and encrypt usage data.

Use Scenario: Wearable or bedside sensor hub collecting biometric signals, performing local anomaly detection, and transmitting encrypted health data.

IC Role / Device Role / Timing Role: Low-power secure MCU managing BLE connectivity, analog sensor interfaces, and cryptographic signing of ECG/PPG data streams.

Use Value: Deep-sleep modes with RTC wake-up minimize power; TRNG and PUF provide entropy and key material for HIPAA-compliant data encryption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
LPC55S06JBD100128 KB flash, 80 KB SRAM, no PUF, no CASPER, same PRINCE/TrustZone/USB/CAN FDLower-cost option for less complex secure firmware deployments without hardware ECC accelerationSelect when full 256 KB flash and CASPER are not required; retains identical HLQFP100 footprint and peripheral set
RA6M5GFP100AA00Arm Cortex-M33 @ 200 MHz, 1 MB flash, 384 KB SRAM, no PRINCE, no CASPER, different USB/CAN implementationHigher performance and memory for RTOS-heavy applications; lacks NXP's integrated flash encryption and crypto co-processorChoose for applications needing larger code space and higher CPU throughput where external secure element or software crypto is acceptable

Compared with LPC55S16JBD100E, LPC55S06JBD100 offers cost reduction without sacrificing package compatibility or core security features, while RA6M5GFP100AA00 trades NXP's hardware-accelerated security for greater raw compute and memory-requiring architectural trade-offs in secure boot and runtime encryption design.

Availability

LPC55S16JBD100E is available at Aetrix Electronics and suitable for industrial automation, automotive gateway systems, and medical IoT devices requiring stable component supply, long-term lifecycle support, and certified secure silicon.

Supply support for LPC55S16JBD100E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based microcontrollers and trusted execution environments.

The LPC55S1x series is designed for resource-constrained, security-critical embedded applications demanding hardware-enforced isolation, real-time performance, and seamless integration of cryptography, analog sensing, and multi-protocol connectivity.

FAQ

What is the maximum operating frequency of the LPC55S16JBD100E?

The LPC55S16JBD100E operates at up to 150 MHz using its Arm Cortex-M33 core. This frequency is achievable with PLL0 or PLL1 driven by internal FRO (12 MHz), external crystal (12–32 MHz), or RTC oscillator (32.768 kHz). The FRO is factory-trimmed to ±1% accuracy over 0 °C to 85 °C for date codes 2044 and later, ensuring stable clocking without external components in many designs. LPC55S16JBD100E maintains full peripheral functionality-including USB HS, CAN FD, and ADC sampling-at this maximum rate.

Does the LPC55S16JBD100E support crystal-less USB full-speed operation?

Yes, the LPC55S16JBD100E supports crystal-less USB full-speed device operation using its internal 48 MHz clock derived from the FRO. This eliminates the need for an external 48 MHz crystal or oscillator, reducing BOM cost and PCB area. The feature is implemented in hardware and enabled via ROM bootloader configuration; application firmware must initialize the USB controller with the appropriate clock source. LPC55S16JBD100E does not support crystal-less high-speed USB-HS operation requires the external 12 MHz crystal.

How does the PRINCE module function in the LPC55S16JBD100E?

The PRINCE module in the LPC55S16JBD100E performs real-time AES-256 encryption and decryption of on-chip flash memory. During write operations, plaintext data is encrypted before storage; during read operations, ciphertext is decrypted on-the-fly before being delivered to the core. This occurs transparently in hardware with no software intervention or performance penalty. PRINCE supports multiple encrypted regions, enabling secure firmware updates and asset protection. LPC55S16JBD100E uses PRINCE in conjunction with secure boot to ensure only authenticated, encrypted images execute.

What debug interfaces are available on the LPC55S16JBD100E?

The LPC55S16JBD100E provides Serial Wire Debug (SWD) via PIO0_11 (SWDIO) and PIO0_12 (SWCLK), supporting eight breakpoints and four watchpoints. It also includes Serial Wire Output (SWO) on PIO0_8 for real-time trace streaming. JTAG boundary scan is supported on PIO0_2–PIO0_6 but is disabled during normal debug operation. Debug authentication uses RSA-2048/4096 to prevent unauthorized access. LPC55S16JBD100E does not support SWD with JTAG combined mode-SWD is the primary debug interface for development and production programming.

Can the LPC55S16JBD100E operate in deep power-down mode with RTC wake-up?

Yes, the LPC55S16JBD100E supports deep power-down mode with RAM retention and RTC wake-up capability. The RTC runs in the always-on power domain using either the 32 kHz FRO or an external 32.768 kHz crystal, providing 1 s resolution and wake-up from all low-power states-including deep power-down-with 1 ms resolution. Wake-up events can be configured via alarm or periodic interrupt. LPC55S16JBD100E retains 96 KB SRAM content during deep power-down, enabling fast resume with full context preservation, critical for battery-powered edge sensors.

LPC55S16JBD100E Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-LQFP Exposed Pad
Series:
LPC55S1x
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
96K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC55S16JBD100E FAQ

1.How can I place an order for LPC55S16JBD100E through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC55S16JBD100E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC55S16JBD100E reliable?

The price and inventory of LPC55S16JBD100E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S16JBD100E is usually 5 days.

3.What payment methods are accepted for LPC55S16JBD100E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC55S16JBD100E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC55S16JBD100E?

LPC55S16JBD100E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC55S16JBD100E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC55S16JBD100E?

For technical support, including LPC55S16JBD100E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S16JBD100E requirements.

6.How does Aetrix verify that LPC55S16JBD100E is sourced from the original manufacturer or authorized distributors?

All LPC55S16JBD100E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S16JBD100E meets industry standards.

7.What is the process for return or replacement of LPC55S16JBD100E?

All LPC55S16JBD100E units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S16JBD100E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC55S16JBD100E part is unused and in its original packaging.

Return procedure for LPC55S16JBD100E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LPC55S16JBD100E Tags

  • LPC55S16JBD100E
  • LPC55S16JBD100E PDF
  • LPC55S16JBD100E Datasheet
  • LPC55S16JBD100E Specifications
  • LPC55S16JBD100E Images
  • NXP Semiconductors
  • NXP Semiconductors LPC55S16JBD100E
  • Buy LPC55S16JBD100E
  • LPC55S16JBD100E Price
  • LPC55S16JBD100E Distributor
  • LPC55S16JBD100E Supplier
  • LPC55S16JBD100E Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER