NXP Semiconductors LPC55S16JBD64E

Overview

LPC55S16JBD64E from NXP Semiconductors is an Arm Cortex-M33 microcontroller with TrustZone security, 256 KB flash, 96 KB SRAM, PRINCE real-time flash encryption, CASPER crypto co-processor, and dual USB (FS + HS) supporting crystal-less full-speed operation. It integrates CAN FD, a 16-bit 2.0 Msamples/sec ADC with simultaneous conversion, SCTimer/PWM, PLU, and operates across −40 °C to +105 °C for industrial edge-node control.

For engineers reviewing the LPC55S16JBD64E datasheet, LPC55S16JBD64E pinout, LPC55S16JBD64E application, or LPC55S16JBD64E equivalent, this page delivers verified specifications, HTQFP64 package mapping, secure boot architecture, Flexcomm peripheral configuration options, and validated alternative MCUs for IoT gateway, automotive body control, and secure firmware update designs.

Technical Context

The LPC55S16JBD64E implements Arm TrustZone to isolate secure and non-secure execution environments, enabling hardware-enforced memory and peripheral protection. Its CASPER co-processor accelerates ECC operations, while PRINCE performs on-the-fly AES-256 encryption/decryption of flash reads and writes.

It features nine Flexcomm interfaces-each configurable as USART, SPI, I2C, or I2S-with dedicated DMA support and fractional baud-rate generators. The SCTimer/PWM supports 16 capture/match registers, 10 outputs, and internal routing to peripherals and pins, enabling complex timing and motor control waveforms without CPU intervention.

Key Specifications

Pinout & Package

HTQFP64 package with exposed thermal pad; 64-pin quad flat profile (pitch 0.5 mm, body 10 × 10 mm). Pin functions are software-selectable via IOCON registers; default reset state disables pull-ups/pull-downs on most pins except PIO0_2/5/11/12/13/14.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.

Compared with LPC55S16JBD64E, LPC55S06JBD64 reduces security capability and memory to lower cost, while RA6M5GFPM64A trades NXP-specific IP (PRINCE, PLU, SCTimer) for broader memory and Renesas' SCE7-requiring redesign of crypto integration and timing-critical logic paths.

Availability

LPC55S16JBD64E is available at Aetrix Electronics and suitable for industrial edge node controllers, secure automotive body modules, and medical sensor interfaces requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for LPC55S16JBD64E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with headquarters in Eindhoven, Netherlands.

The LPC55S1x series targets secure, low-power embedded applications demanding hardware-rooted trust, real-time performance, and flexible peripheral integration-designed specifically for next-generation edge intelligence and zero-trust device architectures.

FAQ

What is the maximum operating frequency of the LPC55S16JBD64E?

The LPC55S16JBD64E runs its Arm Cortex-M33 core at up to 150 MHz, enabled by PLL0/PLL1 clock synthesis from internal FRO (12 MHz or 96 MHz) or external crystal sources. This frequency is fully supported across the −40 °C to +105 °C temperature range and 1.8–3.6 V supply voltage, with all peripherals-including USB HS and CAN FD-operational at rated speed. The LPC55S16JBD64E datasheet confirms sustained 150 MHz operation under worst-case conditions.

Does the LPC55S16JBD64E support crystal-less USB full-speed operation?

Yes, the LPC55S16JBD64E supports crystal-less USB full-speed device mode using its internal 48 MHz FRO-derived clock and software library (TN00065). This eliminates the need for an external 12 MHz crystal in USB device applications, reducing BOM cost and PCB area. Host mode still requires an external crystal or clock source. The LPC55S16JBD64E maintains full USB FS compliance-including suspend/resume and enumeration-without external timing components.

How many GPIO pins does the LPC55S16JBD64E provide in the HTQFP64 package?

The LPC55S16JBD64E in HTQFP64 provides 36 GPIO pins, as confirmed in Table 2 of the official datasheet. This count excludes power, ground, reset, debug, and dedicated analog inputs (e.g., ADC0_1 on PIO0_10). All 36 pins support configurable pull-up/pull-down, slew rate control, and multiple alternate functions-including secure GPIO mode-and are accessible via AHB for low-latency register access. The LPC55S16JBD64E GPIO count is fixed per package variant and not software-configurable.

What security features differentiate the LPC55S16JBD64E from standard Cortex-M33 MCUs?

The LPC55S16JBD64E integrates NXP-specific hardware security blocks beyond baseline TrustZone: PRINCE for real-time flash encryption, CASPER for ECC acceleration, PUF for silicon-rooted key generation, and DICE-compliant device identity composition. These enable certified secure boot (RSA-2048/4096), anti-rollback, and runtime code integrity (Code Watchdog)-features not present in generic Cortex-M33 implementations. The LPC55S16JBD64E delivers TBSA compliance and NXP Secure Boot v2.0 (SB2) file format support out-of-box.

Can the LPC55S16JBD64E's ADC perform simultaneous sampling on multiple channels?

Yes, the LPC55S16JBD64E's 16-bit ADC supports simultaneous conversions on two input channels belonging to the same differential pair (e.g., CH1A and CH1B), achieving true 2.0 Msamples/sec aggregate throughput. This capability is hardware-implemented and does not require software synchronization. The ADC also supports multiple trigger sources-including timers and external signals-and integrates a temperature sensor directly into the conversion path. Simultaneous sampling is explicitly documented for the LPC55S16JBD64E in the analog peripherals section of the datasheet.