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NXP Semiconductors LPC55S16JBD64K

Part No.:
LPC55S16JBD64K
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-TQFP Exposed Pad
Datasheet:
AetrixLPC55S16JBD64K.pdf
Description:
IC MCU 32BIT 256KB FLASH 64TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:800

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Product details

Overview

LPC55S16JBD64K from NXP Semiconductors is an Arm Cortex-M33 microcontroller with TrustZone security, 256 KB flash, 96 KB SRAM, PRINCE real-time flash encryption, CASPER crypto co-processor, and CAN FD interface - deployed in secure industrial gateways requiring firmware integrity, encrypted OTA updates, and deterministic fieldbus communication.

For engineers reviewing the LPC55S16JBD64K datasheet, LPC55S16JBD64K pinout, LPC55S16JBD64K application, or LPC55S16JBD64K equivalent, key selection criteria include its HTQFP64 package with 36 GPIOs, dual USB (FS + HS) support with crystal-less operation, 16-bit 2.0 Msamples/sec ADC with simultaneous differential conversion, and hardware-accelerated AES-256/SHA2/RSA via PUF and CASPER.

Technical Context

The LPC55S16JBD64K implements Arm TrustZone to isolate secure and non-secure execution environments, enabling secure boot with RSA-2048/4096 signature verification and DICE-compliant device identity composition. Its PRINCE module performs real-time AES-128 encryption/decryption of flash reads and writes, while CASPER accelerates ECC operations for key exchange and digital signatures.

It integrates two DMA controllers (23+10 channels), nine Flexcomm interfaces configurable as USART/SPI/I2C/I2S, SCTimer/PWM with 16 capture/match registers, and a 24-bit Multi-Rate Timer for precise periodic interrupts - all synchronized under a clock system featuring dual PLLs, FROs trimmed to ±1% (0–85°C), and 32.768 kHz RTC oscillator.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreArm Cortex-M33 @ up to 150 MHz with FPU, MPU, and TrustZone for secure partitioning
Memory256 KB on-chip flash (512-byte page erase), 96 KB SRAM (16 KB code bus + 64 KB system bus + 16 KB USB SRAM)
SecurityPRINCE flash encryption, CASPER ECC acceleration, PUF-based key generation (64–4096 bits), SHA2/AES-256/TRNG/UUID
Analog16-bit ADC @ 2.0 Msamples/sec with 5 differential/10 single-ended channels and simultaneous dual-channel conversion
ConnectivityCAN FD controller with dedicated DMA, USB 2.0 full-speed + high-speed (crystal-less FS mode), 9 Flexcomm serial interfaces
TimersFive 32-bit general-purpose timers, SCTimer/PWM (8 inputs/10 outputs), RTC with 1 s resolution, 24-bit MRT, WWDT
PackageHTQFP64 (10 × 10 × 0.5 mm, 0.5 mm pitch), 36 GPIOs, operating temperature −40 °C to +105 °C

Pinout & Package

HTQFP64 package with exposed thermal pad, 0.5 mm pitch, and 64 leads in low-profile quad flat configuration. Pin functions are software-selectable via IOCON registers; default reset state disables most pull-ups/pull-downs except on debug and boot pins (PIO0_2/5/11/12/13/14).

Pin/Terminal Circuit Role Design Meaning
PIO0_0 / ACMP0_AAnalog comparator input A or GPIOEnables analog voltage comparison when ANAMODE=1; otherwise standard I/O with secure GPIO option
PIO0_5 / TDIJTAG test data input / boot source selectorPin state at reset determines boot source (flash, ISP, ROM); critical for secure recovery and programming
PIO0_11 / SWDIOSerial Wire Debug I/OPrimary debug interface supporting 8 breakpoints and 4 watchpoints; enabled by default at reset
PIO0_12 / SWCLKSerial Wire Debug clockProvides clock for SWD protocol; internal pull-down ensures reliable debug initialization
USB_DP / USB_DMUSB 2.0 differential data pairSupports both full-speed (crystal-less) and high-speed modes; routed to on-chip PHY with dedicated DMA

Key Features

Feature Design Value
TrustZone-enabled secure executionHardware-isolated secure/non-secure worlds enable certified secure boot, encrypted firmware updates, and protected key storage
PRINCE real-time flash encryptionTransparent AES-128 encryption/decryption during flash read/write - no software overhead, no performance penalty
CASPER crypto co-processorHardware acceleration for ECC scalar multiplication (NIST P-256/P-384), reducing signature generation time by >10× vs. software-only
Flexcomm serial interface flexibilityNine software-configurable peripherals (USART/SPI/I2C/I2S) with shared fractional baud-rate generator and FIFO support
Secure boot with DICE complianceMeets Trusted Computing Group DICE Family 2.0 Level 00 Rev 69 for device identity composition and attestation
16-bit 2.0 Msamples/sec ADCSimultaneous sampling on differential pairs enables accurate motor current sensing and power quality monitoring

Applications

Industrial Gateway Secure Edge Node

Use Scenario: Field gateway aggregating Modbus RTU, CAN FD, and Ethernet data for cloud upload with TLS-secured MQTT.

IC Role / Device Role: Main application processor executing RTOS, managing secure boot, encrypted OTA updates, and CAN FD message routing.

Use Value: PRINCE and CASPER ensure firmware authenticity and confidentiality; 36 GPIOs support isolated I/O expansion for sensor/actuator interfacing.

Use Scenario: Battery-powered smart meter with tamper detection, encrypted energy logging, and remote firmware update capability.

IC Role / Device Role: Secure system-on-chip handling metering ADC sampling, cryptographic signing of usage data, and secure bootloader validation.

Use Value: PUF-generated keys eliminate key storage vulnerability; ultra-low-power deep-sleep modes extend battery life beyond 10 years.

Automotive Diagnostic Tool Medical Sensor Hub

Use Scenario: Handheld OBD-II scanner supporting UDS over CAN FD, firmware updates via USB, and secure diagnostic session authentication.

IC Role / Device Role: Host controller managing CAN FD diagnostics, USB HID-class interface, and secure session key derivation using CASPER.

Use Value: Dual USB (FS + HS) enables fast firmware download; TrustZone isolates diagnostic stack from secure key management routines.

Use Scenario: Wearable patient monitor collecting ECG, temperature, and motion data, then transmitting encrypted health metrics via BLE.

IC Role / Device Role: Signal acquisition and security co-processor performing ADC oversampling, noise filtering, and AES-GCM encryption before BLE transmission.

Use Value: 16-bit 2.0 Msamples/sec ADC captures high-fidelity biopotentials; TRNG and SHA2 ensure cryptographically sound data integrity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
LPC55S26JBD64Same core, 384 KB flash, 128 KB SRAM, identical security features and peripheral setHigher memory headroom for complex RTOS stacks or larger encrypted firmware imagesSelect when firmware size exceeds 256 KB or additional RAM is required for multi-threaded secure services
RA6M5GFP64AArm Cortex-M33 @ 200 MHz, 1 MB flash, 512 KB SRAM, but lacks PRINCE, CASPER, and PUFRelies on external secure element or software crypto; no on-the-fly flash encryptionChoose for cost-sensitive designs where hardware crypto acceleration and flash encryption are not mandatory

Compared with LPC55S26JBD64 and RA6M5GFP64A, the LPC55S16JBD64K delivers optimal balance of security depth (PRINCE/CASPER/PUF), compact footprint (HTQFP64), and deterministic real-time performance - making it ideal for resource-constrained secure edge nodes where flash encryption and ECC acceleration are non-negotiable.

Availability

LPC55S16JBD64K is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, automotive diagnostic tools, and medical sensor hubs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for LPC55S16JBD64K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Arm-based microcontrollers and hardware security IP.

The LPC55S1x series targets secure embedded systems demanding certified boot, runtime isolation, and hardware-accelerated cryptography - designed specifically for industrial control, smart infrastructure, and safety-critical edge devices.

FAQ

What is the maximum CPU frequency supported by the LPC55S16JBD64K?

The LPC55S16JBD64K operates at up to 150 MHz using its Arm Cortex-M33 core. This frequency is achievable with either the internal 96 MHz FRO (trimmed to ±1% over 0–85°C) or external crystal/oscillator sources, and is sustained across the full −40 °C to +105 °C operating range. The LPC55S16JBD64K uses PLL0 or PLL1 to scale the clock without requiring high-frequency external crystals.

Does the LPC55S16JBD64K support crystal-less USB full-speed operation?

Yes, the LPC55S16JBD64K supports crystal-less USB full-speed device mode using its internal 48 MHz clock derived from the FRO, eliminating the need for an external 48 MHz crystal. This feature is implemented in hardware and validated per NXP Technical Note TN00065, reducing BOM cost and PCB area. The LPC55S16JBD64K does not support crystal-less high-speed USB.

How many GPIO pins are available on the LPC55S16JBD64K in the HTQFP64 package?

The LPC55S16JBD64K in HTQFP64 package provides 36 general-purpose I/O pins. This count is confirmed in Table 2 of the datasheet and reflects the physical pin allocation after accounting for power, ground, debug, USB, and crystal connections. All 36 GPIOs support secure configuration, interrupt triggering, and flexible peripheral multiplexing via IOCON registers.

What security features differentiate the LPC55S16JBD64K from standard Cortex-M33 MCUs?

The LPC55S16JBD64K integrates PRINCE (real-time flash encryption), CASPER (ECC acceleration), PUF (silicon fingerprint-based key generation), and DICE-compliant device identity - features absent in generic Cortex-M33 implementations. These enable certified secure boot, anti-rollback protection, and hardware-rooted trust without external secure elements. The LPC55S16JBD64K also includes TrustZone-enforced memory isolation and Code Watchdog for runtime flow integrity.

Can the LPC55S16JBD64K's ADC perform simultaneous conversions on multiple channels?

Yes, the LPC55S16JBD64K's 16-bit ADC supports simultaneous conversions on two channels belonging to the same differential pair (e.g., CH1A and CH1B), enabling precise phase-aligned sampling for motor control or power measurement. This capability is hardware-implemented and requires no CPU intervention, delivering true 2.0 Msamples/sec aggregate throughput with sub-microsecond inter-channel skew.

LPC55S16JBD64K Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-TQFP Exposed Pad
Series:
LPC55S1x
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
96K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC55S16JBD64K FAQ

1.How can I place an order for LPC55S16JBD64K through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC55S16JBD64K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC55S16JBD64K reliable?

The price and inventory of LPC55S16JBD64K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S16JBD64K is usually 5 days.

3.What payment methods are accepted for LPC55S16JBD64K?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC55S16JBD64K transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC55S16JBD64K?

LPC55S16JBD64K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC55S16JBD64K order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC55S16JBD64K?

For technical support, including LPC55S16JBD64K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S16JBD64K requirements.

6.How does Aetrix verify that LPC55S16JBD64K is sourced from the original manufacturer or authorized distributors?

All LPC55S16JBD64K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S16JBD64K meets industry standards.

7.What is the process for return or replacement of LPC55S16JBD64K?

All LPC55S16JBD64K units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S16JBD64K, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC55S16JBD64K part is unused and in its original packaging.

Return procedure for LPC55S16JBD64K:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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