Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors LPC55S16JBD64Y

Part No.:
LPC55S16JBD64Y
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-TQFP Exposed Pad
Datasheet:
AetrixLPC55S16JBD64Y.pdf
Description:
IC MCU 32BIT 256KB FLASH 64TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,497

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

LPC55S16JBD64Y from NXP Semiconductors is a 32-bit Arm Cortex-M33 microcontroller with TrustZone security, PRINCE flash encryption, CASPER crypto acceleration, 256 KB on-chip flash, 96 KB SRAM, CAN FD, USB full-speed and high-speed interfaces, and a 16-bit 2.0 Msamples/sec ADC - deployed in secure industrial gateways requiring real-time control, encrypted firmware updates, and multi-protocol connectivity.

For engineers reviewing the LPC55S16JBD64Y datasheet, LPC55S16JBD64Y pinout, LPC55S16JBD64Y application, or LPC55S16JBD64Y equivalent, key selection criteria include TrustZone-enforced memory isolation, PRINCE-enabled over-the-air secure flash updates, CASPER-accelerated ECC operations, and HTQFP64 package compatibility with space-constrained industrial PCB layouts.

Technical Context

The LPC55S16JBD64Y implements Arm TrustZone to enforce hardware-isolated secure and non-secure execution environments, with PRINCE performing real-time AES-128 encryption/decryption of flash reads and writes. Its CASPER co-processor offloads elliptic curve cryptography (ECC) operations including point multiplication and modular arithmetic, reducing CPU load during TLS handshake or secure boot verification.

It integrates two DMA controllers (23-channel DMA0 and 10-channel DMA1), supports crystal-less USB full-speed device operation via software library TN00065, and delivers deterministic timing via five 32-bit general-purpose timers plus an 8-input/10-output SCTimer/PWM with 16 capture/match registers and state-machine programmability.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M33 @ up to 150 MHz with FPU, MPU, and TrustZone for hardware-enforced secure/non-secure partitioning.
Memory256 KB on-chip flash (512-byte page erase/write) + 96 KB SRAM (16 KB code bus, 64 KB system bus, 16 KB USB SRAM).
SecurityPRINCE real-time flash encryption, CASPER ECC acceleration, PUF-based key generation (64–4096 bits), SHA2/AES-256, RSA-2048/4096, DICE-compliant secure boot.
Analog16-bit ADC with 2.0 Msamples/sec sampling rate, simultaneous dual-channel conversion, integrated temperature sensor and comparator.
ConnectivityCAN FD controller with dedicated DMA, USB 2.0 HS/FS host/device with on-chip PHY, nine Flexcomm interfaces configurable as USART/SPI/I2C/I2S.
PackageHTQFP64 (10 × 10 × 0.5 mm, 0.5 mm pitch) with 36 GPIOs, operating from −40 °C to +105 °C at 1.8–3.6 V supply.

Pinout & Package

HTQFP64 package: 64-pin plastic low-profile quad flat package with exposed thermal pad, 0.5 mm pitch, 10 mm × 10 mm body, RoHS-compliant, rated for industrial temperature range (−40 °C to +105 °C).

Pin/TerminalCircuit RoleDesign Meaning
PIO0_0 / ACMP0_AGPIO / Analog Comparator Input ADual-function pin supporting digital I/O or comparator input A when analog mode enabled; default reset state is high-impedance (Z).
PIO0_5 / TDIJTAG Test Data In / Boot SelectState at reset determines boot source (flash, ISP, or ROM); also serves as JTAG TDI in boundary scan mode.
PIO0_11 / SWDIOSerial Wire Debug I/OPrimary debug interface pin; enables bidirectional communication for programming and real-time trace without dedicated JTAG pins.
USB_DP / USB_DMUSB 2.0 Differential Data PairFull-speed and high-speed USB transceiver signals routed directly to internal PHY; supports crystal-less FS device operation.
VDDA / VSSAAnalog Power / GroundIndependent analog supply domain for ADC, comparator, and temperature sensor; requires local decoupling for <1 LSB noise performance.

Key Features

FeatureDesign Value
TrustZone-enforced isolationHardware partitioning of memory, peripherals, and interrupts into secure/non-secure worlds - enabling certified secure boot and runtime attestation.
PRINCE flash encryptionReal-time AES-128 encryption/decryption of flash data during read/write - protecting firmware IP without software overhead or latency penalty.
CASPER crypto accelerationHardware offload of ECC scalar multiplication and modular arithmetic - accelerating TLS 1.2/1.3 handshakes by >10× vs. software-only M33 execution.
SCTimer/PWM flexibilityProgrammable state machine with 16 capture/match registers and 32 states - enabling complex motor control waveforms or protocol emulation without CPU intervention.
Flexcomm serial configurabilityNine software-selectable serial interfaces (USART/SPI/I2C/I2S) sharing FIFO and clock resources - reducing BOM count and PCB routing complexity.

Applications

Industrial PLC Edge NodeSecure Automotive Diagnostic Tool

Use Scenario: Compact programmable logic controller collecting sensor data via CAN FD and Modbus RTU over RS-485, executing control logic, and transmitting encrypted telemetry to cloud.

IC Role / Device Role / Timing Role: Main application processor managing real-time I/O, CAN FD messaging, secure OTA updates via PRINCE, and cryptographic signing of sensor logs using CASPER.

Use Value: Eliminates external secure element by integrating PUF, SHA2, AES, and RSA in one die; HTQFP64 footprint enables dense industrial PCB layout with thermal pad for sustained 150 MHz operation.

Use Scenario: Handheld OBD-II diagnostic tool connecting to vehicle ECUs via CAN FD and USB, verifying firmware authenticity before reprogramming.

IC Role / Device Role / Timing Role: Secure host controller authenticating ECU signatures using RSA-4096, validating SB2 update packages, and generating session keys via PUF-derived entropy.

Use Value: DICE-compliant device identity and secure boot ensure chain-of-trust from silicon to application; USB HS enables fast firmware download while CAN FD handles high-bandwidth diagnostic streaming.

Smart Energy Meter GatewayMedical IoT Sensor Hub

Use Scenario: Utility-grade meter aggregating data from sub-meters via I2C and SPI, encrypting payloads with AES-256, and transmitting via cellular modem over USB CDC interface.

IC Role / Device Role / Timing Role: Trusted execution environment for cryptographic processing, time-stamped logging via RTC alarm timer, and low-power deep-sleep wake-up using Micro-Tick Timer.

Use Value: Integrated TRNG and PUF eliminate need for external entropy sources; 36 GPIOs support direct connection to metrology ADCs and isolation interfaces without glue logic.

Use Scenario: Wearable hub collecting ECG, temperature, and motion data via ADC and I2S, performing on-device anomaly detection, and transmitting HIPAA-compliant encrypted streams via Bluetooth LE (via USB-connected dongle).

IC Role / Device Role / Timing Role: Real-time sensor fusion processor with simultaneous 16-bit ADC sampling, secure key storage in protected flash, and tamper-evident boot via Code Watchdog.

Use Value: Temperature sensor calibrated against on-die reference enables clinical-grade thermal monitoring; TrustZone isolates medical algorithm code from BLE stack to meet IEC 62304 Class C requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LPC55S06JBD64128 KB flash, 80 KB SRAM, no PUF or CASPER; same HTQFP64 package and peripheral set.Targeted at cost-sensitive industrial controls where full cryptographic acceleration and secure key storage are not required.Select when budget constraints outweigh need for hardware PUF, CASPER, or PRINCE - retains identical pinout and software compatibility.
RA6M5DBGLF00#AC0Renesas RA6M5: 100 MHz Cortex-M33, 1 MB flash, 448 KB SRAM, no PRINCE/CASPER, but includes SCE9 security accelerator and CAN FD.Higher memory capacity for complex GUI or protocol stacks; SCE9 provides AES-GCM and SHA acceleration but lacks ECC offload or DICE compliance.Choose for larger embedded applications needing more RAM/flash and Renesas ecosystem support, accepting trade-off in ECC performance and secure boot depth.

Compared with LPC55S06JBD64, the LPC55S16JBD64Y adds PUF, CASPER, and PRINCE for end-to-end firmware protection - critical for field-upgradable devices. Versus RA6M5DBGLF00#AC0, it delivers superior ECC throughput and DICE-aligned device identity, albeit with smaller memory footprint.

Availability

LPC55S16JBD64Y is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, smart energy metering, and medical IoT sensor hubs requiring stable component supply across extended product lifecycles.

Supply support for LPC55S16JBD64Y includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure edge computing, automotive radar, and industrial connectivity solutions, with headquarters in Eindhoven, Netherlands.

The LPC55S1x series targets secure, low-power embedded applications demanding hardware-rooted trust, real-time control, and multi-protocol connectivity - designed specifically for industrial gateways, automotive tools, and regulated medical devices.

FAQ

What is the maximum operating frequency of the LPC55S16JBD64Y?

The LPC55S16JBD64Y runs its Arm Cortex-M33 core at up to 150 MHz, supported by PLL0/PLL1 clock synthesis from internal FRO or external crystal sources. This frequency is achievable across the full industrial temperature range (−40 °C to +105 °C) and 1.8–3.6 V supply, with flash accelerator enabling zero-wait-state execution at peak speed. The LPC55S16JBD64Y maintains timing integrity under voltage and thermal stress via built-in frequency measurement unit and adaptive clock gating.

Does the LPC55S16JBD64Y support crystal-less USB full-speed device operation?

Yes, the LPC55S16JBD64Y supports crystal-less USB full-speed device operation using its internal 48 MHz FRO clock and software library TN00065. This eliminates the need for an external 48 MHz crystal, reducing BOM cost and board area - particularly valuable in space-constrained designs like handheld diagnostic tools. The LPC55S16JBD64Y maintains USB specification compliance through precise FRO trimming (±1% over 0–85 °C) and dynamic clock calibration during enumeration.

How many GPIO pins does the LPC55S16JBD64Y provide in the HTQFP64 package?

The LPC55S16JBD64Y in HTQFP64 package provides 36 general-purpose I/O pins, as confirmed in Table 2 of the datasheet. These GPIOs support multiple functions including ADC inputs, comparator channels, Flexcomm peripheral signals, and secure GPIO capability. Each pin is individually configurable via IOCON registers for pull-up/down, drive strength, and slew rate, with eight pins selectable as pin interrupts (PINT) and two grouped as logical AND/OR interrupts (GINT).

What security features distinguish the LPC55S16JBD64Y from standard Cortex-M33 MCUs?

The LPC55S16JBD64Y integrates hardware security features beyond baseline Cortex-M33: PRINCE for real-time flash encryption, CASPER for ECC acceleration, PUF for silicon-unique key generation, DICE-compliant device identity, and TrustZone-enforced secure boot with revocable root-of-trust keys. Unlike generic M33 implementations, the LPC55S16JBD64Y delivers TBSA compliance, secure debug authentication (RSA-2048/4096), and anti-rollback protection - making it suitable for PSA Certified Level 3 and Common Criteria EAL4+ deployments.

Is the LPC55S16JBD64Y pin-compatible with other members of the LPC55S1x family in HTQFP64?

Yes, the LPC55S16JBD64Y is pin-compatible with all LPC55S1x and LPC551x variants offered in the HTQFP64 package (e.g., LPC55S14JBD64, LPC5516JBD64), sharing identical pin numbering, electrical characteristics, and mechanical footprint. This allows hardware reuse across performance tiers - for example, upgrading from 128 KB to 256 KB flash without PCB redesign. The LPC55S16JBD64Y maintains functional consistency in GPIO mapping, peripheral signal routing, and power/ground pin locations per SOT 855-5 specification.

LPC55S16JBD64Y Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-TQFP Exposed Pad
Series:
LPC55S1x
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
96K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC55S16JBD64Y FAQ

1.How can I place an order for LPC55S16JBD64Y through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC55S16JBD64Y on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC55S16JBD64Y reliable?

The price and inventory of LPC55S16JBD64Y are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S16JBD64Y is usually 5 days.

3.What payment methods are accepted for LPC55S16JBD64Y?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC55S16JBD64Y transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC55S16JBD64Y?

LPC55S16JBD64Y orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC55S16JBD64Y order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC55S16JBD64Y?

For technical support, including LPC55S16JBD64Y datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S16JBD64Y requirements.

6.How does Aetrix verify that LPC55S16JBD64Y is sourced from the original manufacturer or authorized distributors?

All LPC55S16JBD64Y products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S16JBD64Y meets industry standards.

7.What is the process for return or replacement of LPC55S16JBD64Y?

All LPC55S16JBD64Y units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S16JBD64Y, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC55S16JBD64Y part is unused and in its original packaging.

Return procedure for LPC55S16JBD64Y:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LPC55S16JBD64Y Tags

  • LPC55S16JBD64Y
  • LPC55S16JBD64Y PDF
  • LPC55S16JBD64Y Datasheet
  • LPC55S16JBD64Y Specifications
  • LPC55S16JBD64Y Images
  • NXP Semiconductors
  • NXP Semiconductors LPC55S16JBD64Y
  • Buy LPC55S16JBD64Y
  • LPC55S16JBD64Y Price
  • LPC55S16JBD64Y Distributor
  • LPC55S16JBD64Y Supplier
  • LPC55S16JBD64Y Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER