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NXP Semiconductors LPC55S16JEV59Y

Part No.:
LPC55S16JEV59Y
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
59-VFBGA
Datasheet:
AetrixLPC55S16JEV59Y.pdf
Description:
IC MCU 32BIT 256KB FLASH 59BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,887

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Product details

Overview

LPC55S16JEV59Y from NXP Semiconductors is a 32-bit Arm Cortex-M33 microcontroller with TrustZone security, 256 KB flash, 96 KB SRAM, PRINCE real-time flash encryption, CASPER crypto co-processor, and CAN FD interface-designed for secure industrial edge nodes requiring authenticated firmware updates, isolated execution, and deterministic timing in harsh environments.

For engineers reviewing the LPC55S16JEV59Y datasheet, LPC55S16JEV59Y pinout, LPC55S16JEV59Y application, or LPC55S16JEV59Y equivalent, this page delivers verified specifications, VFBGA59 package mapping, functional pin roles, security architecture context, and validated alternative options for secure embedded control designs.

Technical Context

The LPC55S16JEV59Y implements Arm TrustZone to enforce hardware-isolated secure and non-secure execution states, with PRINCE encrypting flash writes and decrypting reads in real time. Its CASPER co-processor accelerates ECC operations, while the PUF generates and reconstructs keys up to 4096 bits from silicon fingerprinting.

It integrates two DMA controllers (23+10 channels), nine Flexcomm interfaces configurable as USART/SPI/I2C/I2S, a 16-bit 2.0 Msamples/sec ADC with simultaneous differential conversion, and dual watchdogs (WWDT + Code Watchdog) for runtime integrity monitoring across all power modes.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreArm Cortex-M33 @ up to 150 MHz with FPU, MPU, and TrustZone isolation
Memory256 KB on-chip flash (512-byte page erase) + 96 KB SRAM (16 KB code bus, 64 KB system bus, 16 KB USB SRAM)
SecurityPRINCE flash encryption/decryption, CASPER ECC acceleration, PUF key generation (64–4096 bits), SHA2/AES-256, RSA-2048/4096 secure boot
Analog16-bit ADC with 2.0 Msamples/sec sampling rate, 5 differential/10 single-ended channels, integrated temperature sensor and comparator
ConnectivityCAN FD controller with dedicated DMA, USB 2.0 high-speed host/device (no external crystal required in FS mode), 9 Flexcomm peripherals
TimersFive 32-bit general-purpose timers, SCTimer/PWM (8 inputs/10 outputs), RTC with 1 s resolution and wake-up from deep power-down, MRT, WWDT
PackageVFBGA59: 4 mm × 4 mm × 0.4 mm, 59-ball fine-pitch array, 0.4 mm pitch
Operating Range−40 °C to +105 °C, single 1.8–3.6 V supply with internal DC-DC converter

Pinout & Package

VFBGA59 package: 4 mm × 4 mm body, 0.4 mm ball pitch, 59 I/O balls arranged in 7×7 grid with corner balls omitted. Compatible with standard reflow profiles and IPC Class 3 assembly.

Pin/Terminal Circuit Role Design Meaning
PIO0_0 / ACMP0_AAnalog comparator input A or GPIOSelectable via IOCON; enables differential analog sensing when ANAMODE=1 and DIGIMODE=0
PIO0_5 / TDIJTAG test data input or CAN0_TDBoot source selection at reset; drives CAN FD transmitter output when configured
PIO0_10 / ADC0_1ADC channel 1A input or GPIOSupports single-ended or differential pair (with CH1B) for precision sensor acquisition
PIO0_11 / SWDIOSerial Wire Debug I/OPrimary debug interface; retains functionality through reset for secure firmware validation
PIO0_12 / SWCLKSerial Wire Debug clockEnables boundary scan and secure debug authentication without external clock dependency
USB_DP / USB_DMUSB 2.0 HS differential pairIntegrated high-speed PHY supports host/device operation; no external crystal needed in full-speed mode

Key Features

Feature Design Value
TrustZone-enabled secure executionHardware-enforced isolation between secure firmware (e.g., bootloader, crypto keys) and non-secure application code
PRINCE real-time flash encryptionTransparent AES-128 encryption of flash writes and decryption of reads-enables secure OTA updates without software overhead
CASPER crypto co-processorAccelerates Elliptic Curve Cryptography (ECC) operations including point multiplication, reducing signature verification latency by >10× vs. software-only
PUF-based key generationDerives device-unique cryptographic keys from SRAM startup behavior-eliminates need for external secure element or key provisioning
Flexible Flexcomm peripheralsNine software-configurable serial interfaces supporting USART/SPI/I2C/I2S with shared fractional baud-rate generator and FIFOs
2.0 Msamples/sec 16-bit ADCSimultaneous sampling on differential pairs enables precise current/voltage measurement in motor control and power monitoring

Applications

Industrial PLC I/O Module Secure Edge Gateway

Use Scenario: Real-time digital and analog I/O conditioning in DIN-rail mounted programmable logic controllers.

IC Role / Device Role / Timing Role: Main controller executing cyclic scan logic, ADC acquisition, CAN FD fieldbus communication, and secure firmware update handling.

Use Value: TrustZone isolates safety-critical control tasks from network-facing services; PRINCE ensures encrypted firmware persistence during brown-out events.

Use Scenario: Protocol translation and secure data aggregation between legacy field devices (CAN FD, Modbus) and cloud platforms.

IC Role / Device Role / Timing Role: Secure host processor managing TLS offload via CASPER, encrypted local storage via PRINCE, and time-synchronized sensor data forwarding.

Use Value: PUF-generated keys enable zero-touch device onboarding; dual watchdogs guarantee fail-safe restart after communication timeout or memory corruption.

Automotive Body Control Unit Medical Sensor Hub

Use Scenario: Centralized lighting, door lock, and HVAC control in 12 V automotive systems with ASIL-B functional safety requirements.

IC Role / Device Role / Timing Role: Safety-monitored MCU running RTOS with CRC-protected flash, WWDT supervision, and CAN FD diagnostics bus interface.

Use Value: Code Watchdog validates instruction flow integrity; 105 °C rating supports under-hood deployment without derating.

Use Scenario: Portable patient monitor aggregating ECG, SpO₂, and temperature data with HIPAA-compliant local encryption before transmission.

IC Role / Device Role / Timing Role: Low-power sensor fusion hub performing ADC oversampling, secure data packaging, and Bluetooth LE handoff.

Use Value: Integrated TRNG and SHA2 engine enable FIPS 140-2 compliant data signing; 1.8 V operation extends battery life in wearable form factors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar secure microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
LPC55S16JBD64HTQFP64 package (64-pin, 10×10 mm); 36 GPIOs vs. 37; same core, memory, security featuresBetter suited for prototyping and manual soldering; lacks VFBGA59's board-area efficiency for space-constrained modulesSelect when PCB assembly process does not support BGA or thermal management requires larger footprint
LPC55S06JEV59VFBGA59 package; reduced flash (64 KB), SRAM (48 KB), no CASPER or PUF; TrustZone and PRINCE retainedTargeted at cost-sensitive, lower-complexity secure endpoints where crypto acceleration is unnecessarySelect when secure boot and flash encryption suffice without ECC acceleration or silicon-rooted key generation

Compared with LPC55S16JEV59Y, LPC55S16JBD64 offers identical security and peripheral capability in a more manufacturable package, while LPC55S06JEV59 trades crypto acceleration and memory for cost reduction-neither is pin-compatible, but both share the same VFBGA59 footprint family and toolchain compatibility.

Availability

LPC55S16JEV59Y is available at Aetrix Electronics and suitable for industrial automation, automotive body electronics, and medical sensor hubs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for ISO 13485 and IATF 16949 certified production.

Supply support for LPC55S16JEV59Y includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 40 years of microcontroller innovation and ISO 9001-certified manufacturing.

The LPC55S1x series targets secure edge intelligence applications-delivering hardware-rooted trust, real-time performance, and low-power operation for devices that must authenticate, encrypt, and act autonomously in untrusted environments.

FAQ

What is the maximum operating frequency of the LPC55S16JEV59Y?

The LPC55S16JEV59Y runs its Arm Cortex-M33 core at up to 150 MHz, enabled by PLL0/PLL1 clock synthesis from internal FRO or external oscillators. This frequency is fully supported across the −40 °C to +105 °C operating range with stable 1.8–3.6 V supply, and verified in production testing per NXP's Rev. 1.8 datasheet.

Does the LPC55S16JEV59Y support USB high-speed operation?

Yes, the LPC55S16JEV59Y integrates a USB 2.0 high-speed host/device controller with on-chip PHY capable of 480 Mbps operation. It also supports crystal-less full-speed USB device mode using internal FRO calibration-confirmed in Section 2.2 of the LPC55S1x/LPC551x datasheet Rev. 1.8.

How many GPIO pins are available on the LPC55S16JEV59Y in VFBGA59 package?

The LPC55S16JEV59Y provides 37 GPIO pins in the VFBGA59 package, as specified in Table 2 of the ordering information section. This count includes multiplexed functions such as ADC inputs, comparator pins, and secure GPIOs-all accessible via IOCON register configuration.

What security features distinguish the LPC55S16JEV59Y from standard Cortex-M33 MCUs?

The LPC55S16JEV59Y integrates PRINCE flash encryption, CASPER crypto co-processor for ECC acceleration, PUF-based key generation, DICE-compliant device identity, and secure debug authentication-features beyond baseline TrustZone. These are documented in Sections 2.3 and 2.4 of the Rev. 1.8 datasheet and validated in NXP's TBSA certification.

Is the LPC55S16JEV59Y pin-compatible with other LPC55S1x variants in VFBGA59?

Yes, all LPC55S1x variants in VFBGA59 (e.g., LPC55S14JEV59, LPC55S16JEV59Y) share identical pinout, ball assignment, and mechanical footprint per SOT2162-1. Differences are limited to flash/SRAM size and feature enablement-not pin function mapping or electrical characteristics.

LPC55S16JEV59Y Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
59-VFBGA
Series:
LPC55S1x
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
37
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
96K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC55S16JEV59Y FAQ

1.How can I place an order for LPC55S16JEV59Y through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC55S16JEV59Y on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC55S16JEV59Y reliable?

The price and inventory of LPC55S16JEV59Y are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC55S16JEV59Y is usually 5 days.

3.What payment methods are accepted for LPC55S16JEV59Y?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC55S16JEV59Y transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC55S16JEV59Y?

LPC55S16JEV59Y orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC55S16JEV59Y order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC55S16JEV59Y?

For technical support, including LPC55S16JEV59Y datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC55S16JEV59Y requirements.

6.How does Aetrix verify that LPC55S16JEV59Y is sourced from the original manufacturer or authorized distributors?

All LPC55S16JEV59Y products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC55S16JEV59Y meets industry standards.

7.What is the process for return or replacement of LPC55S16JEV59Y?

All LPC55S16JEV59Y units undergo pre-shipment inspection (PSI). If there is an issue with LPC55S16JEV59Y, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC55S16JEV59Y part is unused and in its original packaging.

Return procedure for LPC55S16JEV59Y:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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